Semiconductor memory device and method of fabricating the same
A semiconductor memory device including a stack including layer groups vertically stacked on a substrate, each of the layer groups including a word line, a lower channel layer, an upper channel layer, and a data storing element electrically connected to the lower channel layer and the upper channel layer; and a bit line at a side of the stack, the bit line extending vertically, wherein the bit line includes a protruding portion connected to the lower channel layer and the upper channel layer of each layer group, the word line of each layer group extends in a first direction parallel to a top surface of the substrate, and the word line of each layer group is sandwiched between the lower channel layer and the upper channel layer of the layer group.
1. A semiconductor memory device, comprising:
a stack including layer groups vertically stacked on a substrate, each of the layer groups including a word line, a lower channel layer, an upper channel layer, and a data storing element electrically connected to the lower channel layer and the upper channel layer; and
a bit line at a side of the stack, the bit line extending vertically,
wherein:
the bit line includes a protruding portion connected to the lower channel layer and the upper channel layer of each layer group,
the word line of each layer group extends in a first direction parallel to a top surface of the substrate, and
the word line of each layer group is sandwiched between the lower channel layer and the upper channel layer of the layer group.
2. The semiconductor memory device as claimed in claim 1 , wherein:
each of the lower and upper channel layers has a first end and a second end,
the bit line is connected to the first ends of the lower and upper channel layers, and
the data storing element is connected to the second ends of the lower and upper channel layers.
3. The semiconductor memory device as claimed in claim 1 , wherein:
the word line of each of the layer groups includes:
a gate portion sandwiched between and overlapped with the lower channel layer and the upper channel layer; and
a connecting portion connecting the gate portions, which are adjacent to each other in the first direction, and
a width of the gate portion is larger than a width of the connecting portion, as measured in a same direction.
4. The semiconductor memory device as claimed in claim 1 , wherein:
the layer groups include a first layer group and a second layer group, which are sequentially stacked, and
a first vertical distance between the lower channel layer of the first layer group and the upper channel layer of the first layer group is different from a second vertical distance between the upper channel layer of the first layer group and the lower channel layer of the second layer group.
5. The semiconductor memory device as claimed in claim 1 , wherein the lower channel layer and the upper channel layer of each of the layer groups each include an amorphous oxide semiconductor material or a two-dimensional semiconductor material.
6. The semiconductor memory device as claimed in claim 1 , wherein the bit line further includes a pad at a topmost level thereof, the pad being connected to a bit-line contact.
7. The semiconductor memory device as claimed in claim 1 , wherein the data storing element of each of the layer groups includes:
a first electrode connected in common to the lower channel layer and the upper channel layer;
a second electrode on the first electrode; and
a dielectric layer between the first electrode and the second electrode.
8. The semiconductor memory device as claimed in claim 1 , wherein:
the word lines of the layer groups extend to a connection region of the substrate,
the word lines of the layer groups include pad portions, respectively, which are on the connection region,
the pad portions collectively form a staircase structure on the connection region, and
the staircase structure is configured to sequentially expose the pad portions from top to bottom.
9. The semiconductor memory device as claimed in claim 8 , wherein a thickness of each pad portion is larger than a thickness of other portions of each word line, as measured in a same vertical direction.
10. The semiconductor memory device as claimed in claim 1 , further comprising:
a peripheral circuit layer between the substrate and the stack; and
a penetration contact electrically connecting at least one of the word lines and bit lines to the peripheral circuit layer.
11. A semiconductor memory device, comprising:
a stack including layer groups vertically stacked on a substrate, each of the layer groups including a word line, a lower channel layer, an upper channel layer, and a data storing element electrically connected to the lower channel layer and the upper channel layer; and
a bit line at a side of the stack, the bit line extending vertically,
wherein:
in each of the layer groups, the upper channel layer and the lower channel layer are vertically separated from each other,
the word line of each of the layer groups extends horizontally between the lower channel layer and the upper channel layer,
the lower channel layer and the upper channel layer of each of the layer groups are electrically connected to the bit line,
the layer groups include a first layer group and a second layer group, which are sequentially stacked, and
a first vertical distance between the lower channel layer of the first layer group and the upper channel layer of the first layer group is different from a second vertical distance between the upper channel layer of the first layer group and the lower channel layer of the second layer group.
12. The semiconductor memory device as claimed in claim 11 , wherein the bit line includes:
a first protruding portion connected in common to the lower channel layer and the upper channel layer of the first layer group; and
a second protruding portion connected in common to the lower channel layer and the upper channel layer of the second layer group.
13. The semiconductor memory device as claimed in claim 11 , wherein:
the word line of each of the layer groups extends in a first direction, and
the lower channel layer and the upper channel layers of each of the layer groups extend in a second direction crossing the first direction.
14. The semiconductor memory device as claimed in claim 11 , wherein the data storing element of each of the layer groups includes:
a first electrode connected in common to the lower channel layer and the upper channel layer;
a second electrode on the first electrode; and
a dielectric layer between the first electrode and the second electrode.
15. The semiconductor memory device as claimed in claim 11 , wherein:
the word line of each of the layer groups includes:
a gate portion sandwiched between and overlapped with the lower channel layer and the upper channel layer; and
a connecting portion connecting the gate portions that are adjacent to each other, and
a width of the gate portion is larger than a width of the connecting portion, as measured in a same direction.
16. A semiconductor memory device, comprising:
a stack including layer groups vertically stacked on a substrate, each of the layer groups including a memory cell transistor and a data storing element electrically connected to the memory cell transistor; and
a bit line at a side of the stack, the bit line extending vertically,
wherein:
the bit line electrically connects the stacked memory cell transistors of the layer groups to each other,
the memory cell transistor of each of the layer groups includes:
a lower channel layer between the bit line and the data storing element;
an upper channel layer between the bit line and the data storing element, the upper channel layer being vertically separated from the lower channel layer; and
a word line between the lower channel layer and the upper channel layer,
the word line of each of the layer groups includes:
a gate portion sandwiched between and overlapped with the lower channel layer and the upper channel layer; and
a connecting portion connecting the gate portions that are adjacent to each other, and
a width of the gate portion is larger than a width of the connecting portion, as measured in a same direction.
17. The semiconductor memory device as claimed in claim 16 , wherein the lower channel layer and the upper channel layer of each of the layer groups includes an amorphous oxide semiconductor material or a two-dimensional semiconductor material.
18. The semiconductor memory device as claimed in claim 16 , wherein the bit line includes a protruding portion, which is connected in common to the lower channel layer and the upper channel layer of each of the layer groups.
19. The semiconductor memory device as claimed in claim 16 , wherein:
the word line of each of the layer groups extends in a first direction parallel to a top surface of the substrate, and
the lower channel layer and the upper channel layer of each of the layer groups extend in a second direction, which is parallel to the top surface of the substrate and crosses the first direction.
20. The semiconductor memory device as claimed in claim 16 , wherein the data storing element of each of the layer groups includes:
a first electrode connected in common to the lower channel layer and the upper channel layer;
a second electrode on the first electrode; and
a dielectric layer interposed between the first electrode and the second electrode.