Stud bumped printed circuit assembly
View Patent ↗A circuit board having a plurality of conductive layers including a first conductive layer and a second conductive layer is provided. The circuit board includes a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers. The plurality of non-conductive layers include at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer. At least one collapsed stud bump extends at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer.
1 . A circuit board comprising:
a plurality of conductive layers including a first conductive layer and a second conductive layer;
a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers, the plurality of non-conductive layers including at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer;
at least one collapsed stud bump extending at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer; and
a surface finish layer on the first conductive layer, between the at least one collapsed stud bump and the first conductive layer, the surface finish layer composed of one or more noble metals,
wherein the at least one collapsed stud bump is bonded to the surface finish layer and is in non-bonded contact with the second conductive layer.
2 . The circuit board of claim 1 , wherein the at least one collapsed stud bump includes a plurality of collapsed stud bumps.
3 . The circuit board of claim 1 , wherein the at least one collapsed stud bump is composed of gold.
4 . The circuit board of claim 1 , wherein the first conductive layer and the second conductive layer are internal layers of the circuit board.
5 . The circuit board of claim 1 , wherein the plurality of conductive layers include a third conductive layer and a fourth conductive layer,
wherein the plurality of non-conductive layers include a second non-conductive layer between the third conductive layer and the fourth conductive layer,
wherein the at least one collapsed stud bump includes at least a second collapsed stud bump extending at least partially through the second non-conductive layer to electrically couple the third conductive layer to the fourth conductive layer.
6 . The circuit board of claim 1 , wherein the at least one collapsed stud bump includes a plurality of collapsed stud bumps extending at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer.