Device for generating a dielectric barrier discharge and method for treating an object to be activated
The present invention relates to a device for generating a dielectric barrier discharge for treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising a dielectric working chamber which has a wall of a dielectric material and which encloses a working space, wherein a metallization is applied to an outer side of the wall facing away from the working space, wherein the working space is an open volume, and a high-voltage source which is configured to apply a high voltage to the metallization or to the object to be activated when the object to be activated is in the working space. According to a further aspect, the invention relates to a method of treatment of an object to be activated with a non-thermal atmospheric pressure plasma.
1 . A device for generating a dielectric barrier discharge for a treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising:
a dielectric working chamber having a wall made of a dielectric material and enclosing a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner, the working space being an open volume; and
a high-voltage source which is configured to apply a high voltage to the metallization or to the object to be activated when the object to be activated is arranged in the working space.
2 . The device according to claim 1 , further including a receptacle that is configured to receive the object to be activated and to move the object into the working space.
3 . The device according to claim 2 , wherein the receptacle is configured to move the object to be activated in the working space in a rotational movement and/or in a translational movement.
4 . The device according to claim 1 , wherein the object to be activated is an implant treated with non-thermal atmospheric pressure plasma prior to a medical treatment.
5 . The device according to claim 1 , wherein the high voltage source is configured to generate the dielectric barrier discharge between the object to be activated and the metallization.
6 . The device according to claim 1 , wherein atmospheric pressure is present in the working space, or wherein a pressure lower than 1 Atm is present in the working space.
7 . The device according to claim 1 , wherein the device is configured to hydrophilize a surface of the object to be activated by the treatment with non-thermal atmospheric pressure plasma.
8 . The device according to claim 1 , further comprising a base unit having an opening for receiving the dielectric working chamber.
9 . The device according to claim 8 , wherein the dielectric working chamber is adapted to be inserted into the opening of the base unit before the treatment and to be removed from the opening of the base unit after the treatment has been performed.
10 . The device according to claim 8 , wherein the high voltage source is arranged in the base unit.
11 . The device according to claim 1 , wherein the wall of the dielectric working chamber has a part located at an entrance of the dielectric working chamber and having a larger thickness than other parts of the wall.
12 . The device according to claim 1 , wherein the metallization is a continuous sleeve-shaped metallization or comprises several annular sections separated from each other.
13 . The device according to claim 1 , wherein the high voltage source comprises a piezoelectric transformer.
14 . The device according to claim 1 , further comprising a fan and/or a filter.
15 . The device according to claim 1 , wherein the working space is filled with air.
16 . The device according to claim 1 , wherein the dielectric working chamber is a replaceable disposable article.
17 . The device according to claim 1 , wherein an inner diameter of the wall of the dielectric working chamber is in a range of 4 mm to 7 mm.
18 . The device according to claim 1 , further comprising a plurality of high voltage sources.
19 . A method of treating an object to be activated with a non-thermal atmospheric pressure plasma, comprising:
removing a dielectric working chamber from a sterile package, the dielectric working chamber having a wall made of a dielectric material that encloses a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner;
inserting the dielectric working chamber into an opening of a base unit, the base unit having a high-voltage source;
introducing the object to be activated into the working space; and
applying a high voltage to the object to be activated or to the metallization so as to generate a dielectric plasma discharge between the object and the metallization.
20 . The method according to claim 19 , wherein the method takes less than 90 seconds.
21 . A device for generating a dielectric barrier discharge for the treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising:
a dielectric working chamber having a wall made of a dielectric material and enclosing a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner, the working space being an open volume; and
a high-voltage source which is configured to apply a high voltage to the metallization or to the object to be activated when the object to be activated is arranged in the working space,
wherein the open volume is a non-closed volume such that ambient air from around the device is permitted to enter the open volume.
22 . A device for generating a dielectric barrier discharge for the treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising:
a dielectric working chamber having a wall made of a dielectric material and enclosing a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner, the working space being an open volume;
a high-voltage source which is configured to apply a high voltage to the metallization or to the object to be activated when the object to be activated is arranged in the working space; and
a receptacle that is configured to receive the object to be activated, to move the object into the working space and to move the object to be activated during the plasma treatment inside the working space.
23 . A device for generating a dielectric barrier discharge for the treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising:
a dielectric working chamber having a wall made of a dielectric material and enclosing a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner, the working space being an open volume; and
a high-voltage source that is directly connected to the object and applies a high voltage to the object when the object to be activated is arranged in the working space.
24 . A device for generating a dielectric barrier discharge for the treatment of an object to be activated with non-thermal atmospheric pressure plasma, comprising:
a dielectric working chamber having a wall made of a dielectric material and enclosing a working space, the wall having an outer side facing away from the working space, the outer side having metallization that is a metal layer applied to the wall in a material-bonding manner, the working space being an open volume; and
a high-voltage source which is configured to apply a high voltage to the metallization or to the object to be activated when the object to be activated is arranged in the working space,
wherein the dielectric working chamber comprises a bottom wall portion closing an exit of the dielectric working chamber, wherein an active substance is arranged on the bottom wall portion of the dielectric working chamber.