IP Library › Granted Patent US 12,149,845
Granted Patent B2
US 12,149,845 · App. 17/759,118 · Granted Nov 19, 2024

Image sensor, imaging device, and ranging device

Inventors: Hideki Arai (Kanagawa, JP); Yusuke Otake (Kanagawa, JP); Takuro Murase (Kanagawa, JP); Takeshi Yamazaki (Kanagawa, JP); Taisuke Suwa (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N25/65H04N25/71H04N25/772
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Quick Facts
Patent No.
US 12,149,845
App. No.
17/759,118
Granted
Nov 19, 2024
Kind
B2
Abstract

The present technology relates to an image sensor, an imaging device, and a ranging device capable of performing imaging so that noise is reduced. A photoelectric conversion unit configured to perform photoelectric conversion; a charge accumulation unit configured to accumulate charges obtained by the photoelectric conversion unit; a transfer unit configured to transfer the charges from the photoelectric conversion unit to the charge accumulation unit; a reset unit configured to reset the charge accumulation unit; a reset voltage control unit configured to control a voltage to be applied to the reset unit; and an additional control unit configured to control addition of capacitance to the charge accumulation unit are included. The charge accumulation unit includes a plurality of regions. The present technology can be applied to, for example, an imaging device that captures an image and a ranging device that performs ranging.

Claims (72)

1. An image sensor, comprising:

a substrate that includes a photodiode configured to perform photoelectric conversion;

a floating diffusion configured to accumulate charges from the photodiode;

a transfer transistor configured to transfer the charges from the photodiode to the floating diffusion;

a reset transistor configured to reset the floating diffusion;

a reset voltage control transistor configured to control a voltage applied to the reset transistor;

an additional control transistor configured to control addition of capacitance to the floating diffusion, wherein the floating diffusion includes a plurality of regions in the substrate; and

a multilayer wiring layer on the substrate, wherein

the multilayer wiring layer includes:

first wirings that connect the plurality of regions, and

second wirings that are a part of the floating diffusion, and

the first wirings and the second wirings are in different layers of the multilayer wiring layer.

2. The image sensor according to claim 1 , wherein the plurality of regions includes a first region connected to the transfer transistor and a second region connected to the additional control transistor.

3. The image sensor according to claim 1 , wherein the plurality of regions includes a first region in a first pixel, and a second region in a second pixel adjacent to the first pixel.

4. An image sensor, comprising:

a substrate that includes a photodiode configured to perform photoelectric conversion;

a plurality of floating diffusions configured to accumulate charges from the photodiode;

a plurality of transfer transistors configured to transfer the charges from the photodiode to each of the plurality of floating diffusions;

a plurality of reset transistors configured to reset each of the plurality of floating diffusions;

a plurality of reset voltage control transistors configured to control voltages applied to each of the plurality of reset transistors;

a plurality of additional control transistors configured to control addition of capacitance to each of the plurality of floating diffusions, wherein each floating diffusion of the plurality of floating diffusions includes a plurality of regions in the substrate; and

a multilayer wiring layer on the substrate, wherein

the multilayer wiring layer includes:

first wirings that connect the plurality of regions, and

second wirings that are a part of the plurality of floating diffusions, and

the first wirings and the second wirings are in different layers of the multilayer wiring layer.

5. The image sensor according to claim 4 , wherein the plurality of regions includes a first region connected to a respective transfer transistor of the plurality of transfer transistors and a second region connected to a respective additional control transistor of the plurality of additional control transistors.

6. The image sensor according to claim 4 , wherein

the multilayer wiring layer includes a third wiring that is connected to a respective reset voltage control transistor of the plurality of reset voltage control transistors, and

the third wiring is configured to function as a parasitic capacitance.

7. The image sensor according to claim 4 , wherein the plurality of floating diffusions, the plurality of transfer transistors, the plurality of reset transistors, the plurality of reset voltage control transistors, and the plurality of additional control transistors are linearly symmetric.

8. The image sensor according to claim 7 , further comprising a discharge transistor configured to discharge the charges obtained by the photodiode, wherein the discharge transistor is linearly symmetric.

9. The image sensor according to claim 8 , wherein the discharge transistor is at a position at which the discharge transistor forms a right angle with a respective transfer transistor of the plurality of transfer transistors.

10. The image sensor according to claim 8 , wherein the discharge transistor and a respective transfer transistor of the plurality of transfer transistors are disposed side by side on one side of the photodiode.

11. The image sensor according to claim 4 , wherein a transfer transistor of the plurality of transfer transistors includes a vertical gate.

12. The image sensor according to claim 11 , wherein

the transfer transistor includes a plurality of vertical gates including the vertical gate, and

a depth of a first vertical gate of the plurality of vertical gates is different from a depth of a second vertical gate of the plurality of vertical gates.

13. The image sensor according to claim 4 , wherein

a transfer transistor of the plurality of transfer transistors includes a first gate and a second gate,

the first gate is between the photodiode and a respective floating diffusion of the plurality of floating diffusions, and

the second gate is at a position superimposed on the photodiode.

14. The image sensor according to claim 13 , wherein at least one of the first gate or the second gate includes a vertical gate.

15. The image sensor according to claim 14 , wherein the first gate and the second gate are simultaneously driven.

16. An imaging device, comprising:

an image sensor; and

a processor configured to process a signal from the image sensor, wherein the image sensor includes:

a substrate that includes a photodiode configured to perform photoelectric conversion;

a floating diffusion configured to accumulate charges from the photodiode;

a transfer transistor configured to transfer the charges from the photodiode to the floating diffusion;

a reset transistor configured to reset the floating diffusion;

a reset voltage control transistor configured to control a voltage applied to the reset transistor;

an additional control transistor configured to control addition of capacitance to the floating diffusion, wherein the floating diffusion includes a plurality of regions in the substrate; and

a multilayer wiring layer on the substrate, wherein

the multilayer wiring layer includes:

first wirings that connect the plurality of regions, and

second wirings that are a part of the floating diffusion, and

the first wirings and the second wirings are in different layers of the multilayer wiring layer.

17. A ranging device, comprising:

a light-emitting diode configured to emit irradiation light; and

a light-receiving element configured to receive reflected light in a case where the irradiation light from the light-emitting diode is reflected from an object, wherein the light-receiving element includes:

a substrate that includes a photodiode configured to perform photoelectric conversion;

a plurality of floating diffusions configured to accumulate charges from the photodiode;

a plurality of transfer transistors configured to transfer the charges from the photodiode to each of the plurality of floating diffusions;

a plurality of reset transistors configured to reset each of the plurality of floating diffusions;

a plurality of reset voltage control transistors configured to control voltages applied to each of the plurality of reset transistors;

a plurality of additional control transistors configured to control addition of capacitance to each of the plurality of floating diffusions, wherein each floating diffusion of the plurality of floating diffusions includes a plurality of regions in the substrate; and

a multilayer wiring layer on the substrate, wherein

the multilayer wiring layer includes:

first wirings that connect the plurality of regions, and

second wirings that are a part of the plurality of floating diffusions, and

the first wirings and the second wirings are in different layers of the multilayer wiring layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2022
From: ARAI, HIDEKI; OTAKE, YUSUKE; MURASE, TAKURO; YAMAZAKI, TAKESHI; SUWA, TAISUKE
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 060563/0664 →
Priority Claims (1)
JP 2020-012436 · Jan 29, 2020 · national
Continuity (1)
Related Publication 20230044912A1 · Feb 9, 2023
Cited By (1)
US 12,283,603