Highly thermally conductive flowable silicone composition
A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.
1. A composition comprising:
a. 2.5-4.0 weight-percent of a polyorganosiloxane component comprising:
i. a trialkoxysiloxy-terminated diorganopolylsiloxane having Formula (I) where Vi refers to vinyl group, R in each occurrence is methyl and subscript a is a value in a range of 50 to 60:
ViR 2 SiO—(R 2 SiO) a —SiR 2 Vi (I)
ii. a trimethylsiloxy-terminated dimethyl siloxane methylhydrogen siloxane having Formula (II) where b has a value in a range of 5 to 25, c has a value in a range of one to 5:
(CH 3 ) 3 Si—((CH 3 ) 2 SiO) b ˜((CH 3 )HSiO) c —Si(CH 3 ) 3 (II);
b. a filler treating agent comprising:
i. 0.20-0.26 wt % of an alkyltrialkoxysilane having the general formula (R′)(R″O) 3 Si where R′ is an alkyl having 8 or more and at the same time 12 or fewer carbon atom on average per molecule and R″ is methyl; and
ii. 0-1.2 wt % of a trialkoxysiloxy-terminated diorganopolysiloxane having the general formula R 3 SiO—(R 2 SiO) d —[(CH 2 ) e ((CH 3 ) 2 SiO) f ] g —(CH 2 ) e —Si(OR″) 3 where each R and R″ are methyl groups, d is a value in a range of 25-35, and e and g are zero;
c. 90-98 weight-percent of a combination of thermally conductive fillers comprising:
i. 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-120 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles;
ii. 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles;
iii. 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-3 micrometers; and
iv. 10-15 weight-percent aluminum oxide thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers;
where weight-percent is relative to composition weight.
2. The composition of claim 1 , wherein the polyorganosiloxane component comprises a combination of vinyl capped polydiorganosiloxanes and silyl hydride functional polyorganosiloxanes.
3. The composition of claim 1 , wherein the alkyltrialkoxysilane is an alkyltrimethoxy silane.
4. The composition of claim 1 , wherein the alkyl of the alkyltrialkoxysilane is an alkyl or substituted alkyl containing 6 to 18 carbons.
5. The composition of claim 1 , wherein the trialkoxysiloxy-terminated diorganopolysiloxane is a trimethoxy siloxy-terminated dimethylpolysiloxane.
6. The composition of claim 1 , wherein the trialkoxysiloxy-terminated diorganopolysiloxane has the following formula:
R 3 SiO—(R 2 SiO) d —[(CH 2 ) e ((CH 3 ) 2 SiO) f ] g —(CH 2 ) e —Si(OR″) 3
where R is independently in each occurrence selected from hydrocarbyl groups having from one to 12 carbons; R″ is a hydrocarbyl having one to 10 carbon atoms; subscript “d” has a value in a range of 10 to 150; subscript “e” has a value independently in each occurrence in a range of zero to 4; subscript “f” has a value of zero to 6 or less; and subscript “g” has a value of zero to 6.
7. The composition of claim 1 , wherein thermally conductive filler (c)(iv) is one or more filler selected from a group consisting of aluminum oxide and zinc oxide particles.
8. The composition of claim 1 , wherein the composition is free of magnesium oxide particle having an average particle size larger than 70 micrometers.
9. The composition of claim 1 , wherein the composition is a one-part curable composition where the polyorganosiloxane component comprises a combination of vinyl capped polydiorganosiloxanes and silyl hydride functional polyorganosiloxanes, an encapsulated platinum catalyst.
10. An article of manufacture comprising the composition of claim 1 interposed along a thermal path between two objects.