Systems and methods for autonomous process control and optimization of semiconductor equipment using light interferometry and reflectometry
At least one laser sensor and a controller are embedded into a substrate processing system communicating with a remote big data and machine learning server receiving/sending data from/to a fleet of substrate processing systems for autonomous process control and optimization. The laser sensor is arranged proximate to a region of the substrate processing system and is configured to capture first data from at least one of an edge coupling ring and a semiconductor substrate transported from/to the processing chamber to/from the region. The controller is configured to receive the first data from the laser sensor, process the first data to generate second data, transmit the second data to a remote server via a network, receive third data from the remote server via the network in response to sending the second data to the remote server, and operate the substrate processing system based on the third data for process optimization.
1. A substrate processing system comprising:
a laser sensor arranged in the substrate processing system, wherein the laser sensor is configured to:
capture first data and second data from a component used in a processing chamber of the substrate processing system at first and second times, respectively;
wherein the component includes at least one of a semiconductor substrate and an edge coupling ring used with the semiconductor substrate;
wherein the component is used in the processing chamber during a process performed in the processing chamber between the first and second times; and
a controller configured to:
receive the first data and the second data from the laser sensor;
measure a change in a geometric parameter of the component based on the first data and the second data;
transmit the measured change to a remote server via a network, wherein the remote server includes a model trained to recommend an adjustment to a parameter of at least one of the process and the processing chamber based on the measured change;
receive the adjustment to the parameter from the remote server via the network; and
initially adjust the parameter of the processing chamber and then adjust the parameter of the process, or initially adjust the parameter of the processing chamber and then adjust the parameter of the process.
2. The substrate processing system of claim 1 wherein the first data and the second data include a measurement performed at a point, along a line, or across an area of the component.
3. The substrate processing system of claim 1 wherein the geometric parameter includes thickness, flatness, or surface roughness of the component.
4. The substrate processing system of claim 1 wherein the controller is configured to determine a non-uniformity of at least one of an etch rate of the process and a deposition rate of the process based on the measured change, and wherein the adjustment minimizes the non-uniformity of the at least one of the etch rate of the process and the deposition rate of the process.
5. The substrate processing system of claim 1 wherein the parameter of the process is selected from a group consisting of gas flow, pressure, upper electrode temperature, substrate support temperature distribution, bias voltage, etch/deposition rate, and etch/deposition uniformity.
6. The substrate processing system of claim 1 wherein the parameter of the processing chamber is selected from a group consisting of a height of the edge coupling ring above a substrate support assembly in the processing chamber, tilt of the edge coupling ring, a gap between upper and lower electrodes of the processing chamber, alignment between the upper and lower electrodes, and tilt between the upper and lower electrodes.
7. The substrate processing system of claim 1 wherein the measured change indicates variation in quality of the process used to clean the processing chamber, wherein the adjustment to the parameter of the process minimizes the variation, and wherein the parameter includes one or more of a duration and a frequency of the process.
8. A substrate processing system comprising:
a laser sensor arranged in the substrate processing system, wherein the laser sensor is configured to:
capture first data and second data from a component used in a processing chamber of the substrate processing system at first and second times, respectively;
wherein the component includes at least one of a semiconductor substrate and an edge coupling ring used with the semiconductor substrate;
wherein the component is used in the processing chamber during a process performed in the processing chamber between the first and second times; and
a controller configured to:
receive the first data and the second data from the laser sensor;
measure a change in a geometric parameter of the component based on the first data and the second data;
transmit the measured change to a remote server via a network, wherein the remote server includes a model trained to recommend an adjustment to a parameter of at least one of the process and the processing chamber based on the measured change;
receive the adjustment to the parameter from the remote server via the network;
perform the adjustment to the parameter of the at least one of the process and the processing chamber;
determine a profile of an inner diameter of the edge coupling ring based on the first data and the second data, wherein the profile is indicative of a malfunction of an assembly of the processing chamber;
transmit the profile to the remote server;
receive an indication from the remote server to service the assembly based on the profile; and
generate a message to service the assembly based on the indication.
9. A system comprising:
a processor; and
memory comprising instructions which when executed by the processor configure the processor to:
receive first data and second data captured by a laser sensor from a component used in a processing chamber of the substrate processing system at first and second times, respectively; wherein the component includes at least one of a semiconductor substrate and an edge coupling ring used with the semiconductor substrate; and
wherein the component is used in the processing chamber during a process performed in the processing chamber between the first and second times;
measure a change in a geometric parameter of the component based on the first data and the second data;
input the measured change to a model trained to recommend an adjustment to a parameter of at least one of the process and the processing chamber based on the measured change;
receive the adjustment to the parameter from the model; and
initially adjust the parameter of the process and then adjust the parameter of the processing chamber, or initially adjust the parameter of the processing chamber and then adjust the parameter of the process.
10. The system of claim 9 wherein the first data and the second data include a measurement performed at a point, along a line, or across an area of the component.
11. The system of claim 9 wherein the geometric parameter includes thickness, flatness, or surface roughness of the component.
12. The system of claim 9 wherein the instructions further configure the processor to determine a non-uniformity of at least one of an etch rate of the process and a deposition rate of the process based on the measured change, wherein the adjustment minimizes the non-uniformity of the at least one of the etch rate of the process and the deposition rate of the process.
13. The system of claim 9 wherein the instructions further configure the processor to select the parameter of the process from a group consisting of gas flow, pressure, upper electrode temperature, substrate support temperature distribution, bias voltage, etch/deposition rate, and etch/deposition uniformity.
14. The system of claim 9 wherein the instructions further configure the processor to select the parameter of the process from a group consisting of a height of the edge coupling ring above a substrate support assembly in the processing chamber, tilt of the edge coupling ring, a gap between upper and lower electrodes of the processing chamber, alignment between the upper and lower electrodes, and tilt between the upper and lower electrodes.
15. The system of claim 9 wherein the measured change indicates variation in quality of the process used to clean the processing chamber, wherein the adjustment to the parameter of the process minimizes the variation, and wherein the parameter includes one or more of a duration and a frequency of the process.
16. The system of claim 9 wherein the instructions further configure the processor to:
determine a profile of an inner diameter of the edge coupling ring based on the first data and the second data, wherein the profile is indicative of a malfunction of an assembly of the processing chamber;
transmit the profile to the model;
receive an indication from the model to service the assembly based on the profile; and
generate a message to service the assembly based on the indication.