High frequency package
A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from the mounting surface.
1 . A high frequency package comprising:
a package main body including a substrate made of an insulator;
a differential coplanar line on the substrate;
a first signal lead pin arranged on a side of a mounting surface of the package main body, the first signal lead pin being bent such that a first end is connected to a first signal line of the differential coplanar line and a second end is apart from the mounting surface;
a second signal lead pin arranged on the side of the mounting surface of the package main body, the second signal lead pin being bent such that a first end is connected to a second signal line of the differential coplanar line and a second end is apart from the mounting surface, and the second signal lead pin extending in a same direction as the first signal lead pin; and
a ground lead pin arranged on the side of the mounting surface of the package main body, the ground lead pin being bent such that a first end is connected to a ground line of the differential coplanar line and a second end is apart from the mounting surface, and the ground lead pin extending in a same direction as the first signal lead pin,
wherein a distance between the second end of the first signal lead pin and the second end of the second signal lead pin is different from a distance between the first end of the first signal lead pin and the first end of the second signal lead pin,
wherein:
the package main body comprises a metal layer to which the ground line is connected; and
the metal layer includes notches around a first connecting portion between the first end of the first signal lead pin and the first signal line and a second connecting portion between the first end of the second signal lead pin and the second signal line.
2 . The high frequency package according to claim 1 , wherein:
a distal end of the ground lead pin on the second end, a distal end of the first signal lead pin on the second end, and a distal end of the second signal lead pin on the second end are arranged on a same line; and
the ground lead pin is longer than the first signal lead pin and the second signal lead pin.
3 . The high frequency package according to claim 1 , wherein:
at the first end of the ground lead pin, an embedded portion partially embedded in the substrate in a thickness direction is disposed.
4 . The high frequency package according to claim 3 , wherein:
a portion of the first end of the ground lead pin including the embedded portion is thicker than in other regions.
5 . The high frequency package according to claim 3 , wherein:
a portion of the first end of the ground lead pin including the embedded portion is wider than in other regions.
6 . The high frequency package according to claim 3 , wherein:
at the first end of the first signal lead pin, an embedded portion partially embedded in the substrate in the thickness direction is disposed.
7 . The high frequency package according to claim 1 , wherein:
each of the first end of the first signal lead pin and the first end of the second signal lead pin comprises a narrow portion that is narrower than in other regions and disposed such that a distance to the ground lead pin adjacent to the first signal lead pin and the second signal lead pin is wider than in other regions.
8 . The high frequency package according to claim 3 , wherein a part of a surface of the embedded portion is exposed from the substrate.
9 . A method comprising:
providing a package main body including a substrate made of an insulator;
forming a differential coplanar line on the substrate;
arranging a first signal lead pin on a side of a mounting surface of the package main body, the first signal lead pin being bent such that a first end is connected to a first signal line of the differential coplanar line and a second end is apart from the mounting surface;
arranging a second signal lead pin on the side of the mounting surface of the package main body, the second signal lead pin being bent such that a first end is connected to a second signal line of the differential coplanar line and a second end is apart from the mounting surface, and the second signal lead pin extending in a same direction as the first signal lead pin; and
arranging a ground lead pin on the side of the mounting surface of the package main body, the ground lead pin being bent such that a first end is connected to a ground line of the differential coplanar line and a second end is apart from the mounting surface, and the ground lead pin extending in a same direction as the first signal lead pin,
wherein a distance between the second end of the first signal lead pin and the second end of the second signal lead pin is different from a distance between the first end of the first signal lead pin and the first end of the second signal lead pin,
wherein:
the package main body comprises a metal layer to which the ground line is connected; and
the metal layer includes notches around a first connecting portion between the first end of the first signal lead pin and the first signal line and a second connecting portion between the first end of the second signal lead pin and the second signal line.
10 . The method according to claim 9 , wherein:
a distal end of the ground lead pin on the second end, a distal end of the first signal lead pin on the second end, and a distal end of the second signal lead pin on the second end are arranged on a same line; and
the ground lead pin is longer than the first signal lead pin and the second signal lead pin.
11 . The method according to claim 9 , wherein:
at the first end of the ground lead pin, an embedded portion partially embedded in the substrate in a thickness direction is disposed.
12 . The method according to claim 11 , wherein:
a portion of the first end of the ground lead pin including the embedded portion is thicker than in other regions.
13 . The method according to claim 11 , wherein:
a portion of the first end of the ground lead pin including the embedded portion is wider than in other regions.
14 . The method according to claim 11 , wherein:
at the first end of the first signal lead pin, an embedded portion partially embedded in the substrate in the thickness direction is disposed.
15 . The method according to claim 9 , wherein:
each of the first end of the first signal lead pin and the first end of the second signal lead pin comprises a narrow portion that is narrower than in other regions and disposed such that a distance to the ground lead pin adjacent to the first signal lead pin and the second signal lead pin is wider than in other regions.
16 . The method according to claim 11 , wherein a part of a surface of the embedded portion is exposed from the substrate.