IP Library › Granted Patent US 11,835,539
Granted Patent B2
US 11,835,539 · App. 17/769,007 · Granted Dec 5, 2023

Low heat-resistant sensor

Inventors: Hisataka Satoh (Gojo, JP); Tetsuya Komeda (Gojo, JP)
Assignee: VALQUA, LTD.
G01P1/023G01D11/245G01P1/02G01P15/08G01P15/0802
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Quick Facts
Patent No.
US 11,835,539
App. No.
17/769,007
Granted
Dec 5, 2023
Kind
B2
Abstract

A low heat-resistant sensor that has high chemical resistance, excellent drip-proof properties, and excellent dust-proof properties is provided. The low heat-resistant sensor includes a sensor body that includes a sensor unit that is disposed in a housing and a cable that is electrically connected to the sensor unit of the sensor body. The housing of the sensor body is composed of fluorine resin, the cable is covered by a tube composed of fluorine resin, a portion at which the housing and the tube are connected to each other is thermally bonded, and the housing and the tube are integrally formed.

Claims (14)

1. A low heat-resistant sensor comprising:

a sensor body that includes a sensor unit that is disposed in a housing, wherein the housing includes:

a container that contains the sensor unit in a recessed portion and that is composed of fluorine resin,

a plate that serves as a lid covering an opening of the recessed portion and that is composed of fluorine resin, and

a frame body that is disposed such that the frame body surrounds a perimeter of the plate and that is composed of fluorine resin,

wherein the frame body and the container are thermally bonded to each other, and the frame body and the plate are thermally bonded to each other; and

a cable that is electrically connected to the sensor unit of the sensor body,

wherein the housing of the sensor body is composed of fluorine resin, and the cable is covered by a tube composed of fluorine resin, and

wherein a portion at which the housing and the tube are connected to each other is thermally bonded, and the housing and the tube are integrally formed.

2. The low heat-resistant sensor according to claim 1 , wherein the housing and the tube are thermally bonded to each other with a connection member that is composed of fluorine resin interposed therebetween.

3. The low heat-resistant sensor according to claim 1 , wherein the fluorine resin is polytetrafluoroethylene (PTFE) resin, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin, tetrafluoroethylene-hexafluoropropylene copolymer (FEP) resin, tetrafluoroethylene-ethylene copolymer (ETFE) resin, polyvinylidene fluoride (PVDF) resin, polychlorotrifluoroethylene (PCTFE) resin, chlorotrifluoroethylene-ethylene copolymer (ECTFE) resin, or polyvinyl fluoride (PVF) resin.

4. The low heat-resistant sensor according to claim 2 , wherein the frame body of the housing and the connection member are composed of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) resin.

5. The low heat-resistant sensor according to claim 1 , wherein the container, the plate, and the tube are composed of polytetrafluoroethylene (PTFE) resin.

6. The low heat-resistant sensor according to claim 1 , wherein the low heat-resistant sensor is an acceleration sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2022
From: SATOH, HISATAKA; KOMEDA, TETSUYA
To: VALQUA, LTD.
Reel/Frame 059599/0441 →
Priority Claims (1)
JP 2019-190082 · Oct 17, 2019 · national
Continuity (1)
Related Publication 20230160919A1 · May 25, 2023
Cited By (2)
US 1,099,725 US 12,578,218