IP Library › Granted Patent US 12,272,607
Granted Patent B2
US 12,272,607 · App. 17/770,434 · Granted Apr 8, 2025

Method of enhancing contrast while imaging high aspect ratio structures in electron microscopy

Inventors: Geetika Bajaj (Mumbai, IN); Prerna Sonthalia Goradia (Mumbai, IN); Robert J. Visser (Menlo Park, CA)
Assignee: Applied Materials, Inc.
H01L22/12B05D1/60B82Y40/00G01B15/04
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Quick Facts
Patent No.
US 12,272,607
App. No.
17/770,434
Granted
Apr 8, 2025
Kind
B2
Abstract

The enclosed disclosure relates to a method and apparatus for depositing functionalized nanoparticles within a semiconductor structure in order to create a nano-layer capable of enhancing imaging and contrast, The semiconductor structure can include any type of VNAND structure or 3D structure, The nanoparticles are formed in high-aspect ratio trenches of the structure and form a nano-layer. The functionalized nanoparticles comprise synthesized nanoparticles as well as organic molecules. The organic molecules are chosen to selectively bind to certain nanoparticles and surface materials.

Claims (31)

1. A method for depositing a layer of nanoparticles or a nano-layer to a semiconductor device, comprising:

modifying synthesized nanoparticles with an organic molecule, the organic molecule comprising:

a head group that binds to a surface of the synthesized nanoparticle; and

a tail group; and

depositing the synthesized nanoparticles onto at least part of a semiconductor structure, wherein the tail group binds the synthesized nanoparticles to at least part of the semiconductor structure and forms a nano-layer.

2. The method of claim 1 , wherein the at least part of the semiconductor structure comprises a high-aspect ratio trench.

3. The method of claim 2 , wherein the high-aspect ratio trench comprises a trench with a depth and a width and a ratio of the depth to the width is greater than about 10:1.

4. The method of claim 3 , wherein the synthesized nanoparticles have a diameter that is smaller than the width of the trench.

5. The method of claim 1 , wherein the synthesized nanoparticles have a diameter of less than about 5 nm.

6. The method of claim 1 , wherein the synthesized nanoparticle comprises an element with an atomic number greater than 25.

7. The method of claim 1 , wherein the synthesized nanoparticle comprises at least one fluorescent marker.

8. The method of claim 1 , wherein the synthesized nanoparticles comprise one of silver or gold.

9. A method for depositing a nano-layer in a semiconductor device, comprising:

modifying synthesized nanoparticles with an organic molecule, the organic molecule comprising:

a head group that binds to a surface of the synthesized nanoparticle; and

a tail group; and

depositing the synthesized nanoparticles into at least part of a high-aspect ratio trench structure, wherein a surface of the high-aspect ratio trench structure comprises hydrogen oxide molecules, and wherein the tail group binds the synthesized nanoparticles to at least part of the high-aspect ratio trench structure.

10. The method of claim 9 , wherein the high-aspect ratio trench comprises a trench structure with a depth and a width and a ratio of the depth to the width is greater than about 10:1.

11. The method of claim 10 , wherein the synthesized nanoparticles have a diameter that is smaller than the width of the trench.

12. The method of claim 9 , wherein the synthesized nanoparticle comprises an element with an atomic number greater than 25.

13. The method of claim 9 , wherein the synthesized nanoparticle comprises at least one florescent marker.

14. The method of claim 9 , wherein the high-aspect ratio trench structure comprises a trench with two or more surface materials.

15. The method of claim 14 , wherein the synthesized nanoparticles bind to only a first material of the two or more surface materials.

16. The method of claim 15 , wherein a second synthesized nanoparticle is deposited onto and binds to a second material of the two or more surface materials.

17. The method of claim 16 , wherein the first material is an oxide material and the second material is a metal material.

18. A semiconductor device, comprising:

a high-aspect ratio trench having a depth and a width, a ratio of the depth to the width being greater than about 10:1;

a nano-layer disposed in at least a portion of the high-aspect ratio trench, the nano-layer comprising synthesized nanoparticles, the synthesized nanoparticles comprising an element with an atomic number greater than 40; and

an organic molecule, the organic molecule bonded to the high-aspect ratio trench via a tail group and the synthesized nanoparticle via a head group.

19. The device of claim 18 , wherein the head group comprises one of SH, NH 2 , PO(OH) 2 , SiCl 3 , and COOH and the tail group comprises on of Si(OCH 3 ) 3 , Si(OC 2- ,H 5 ) 3 , COOH, and CH 3 .

20. The device of claim 19 , wherein the synthesized nanoparticles comprise one of gold, silver, copper, or non-metals with an atomic number greater than 25.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2022
From: BAJAJ, GEETIKA; GORADIA, PRERNA SONTHALIA; VISSER, ROBERT J.
To: APPLIED MATERIALS, INC.
Reel/Frame 059872/0292 →
Priority Claims (1)
IN 202041000949 · Jan 9, 2020 · national
Continuity (1)
Related Publication 20220392810A1 · Dec 8, 2022
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