RESIN COMPOSITION AND RESIN-ATTACHED COPPER FOIL
There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).
1 . A resin composition comprising the following components:
(a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group; a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group; and
at least any one of (b) a polymer comprising a styrene butadiene backbone and (c) a polymer comprising a cycloolefin backbone,
wherein the content of the component (a) is 15 parts by weight or more and 60 parts by weight or less and the total content of the component (b) and the component (c) is 40 parts by weight or more and 85 parts by weight or less; based on 100 parts by weight of a total content of the component (a), the component (b), and the component (c).
2 . The resin composition according to claim 1 , wherein the content of the component (a) is 20 parts by weight or more and 55 parts by weight or less.
3 . The resin composition according to claim 1 , comprising both of the component (b) and the component (c).
4 . The resin composition according to claim 3 , wherein a weight ratio of the component (h) to the component (c), b/c, is 0.8 or more and 10.0 or less.
5 . The resin composition according to claim 1 , wherein the resin composition further comprises (d) a silane coupling agent, and
wherein the content of the component (d) is 0.10 parts by weight or more and 10.0 parts by weight or less, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).
6 . The resin composition according to claim 1 , wherein the resin composition further comprises (e) an inorganic filler, and
wherein the content of the component (e) of 50 parts by weight or more and 400 parts by weight or less, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).
7 . The resin composition according to claim 1 , having a dielectric loss tangent at a frequency of 10 GHz after curing of less than 0.0030.
8 . The resin composition according to claim 1 , having a water absorption ratio after curing, as measured in accordance with JIS C 6481-1996, of less than 0.5%.
9 . A resin-attached copper foil comprising:
a copper foil; and
a resin layer provided on at least one surface of the copper foil and comprising the resin composition according to claim 1 .
10 . The resin-attached copper foil according to claim 9 , wherein a surface of the resin layer side of the copper foil has a ten-point average roughness Rzjis of 0.5 μm or less as measured in accordance with JIS B0601-2001.
11 . The resin-attached copper foil according to claim 9 , wherein a peel strength in a normal state between the resin layer and the copper foil, as measured in accordance with JIS C 6481-1996 in a state where the resin layer is cured, is 0.6 kgf/cm or more.
12 . The resin-attached copper foil according to claim 9 , wherein a peel strength between the resin layer and the copper foil after the resin layer is cured and heated at 260° C. for 60 minutes, as measured in accordance with JIS C 6481-1996, is 0.5 kgf/cm or more.