Method for manufacturing array substrate, array substrate, display panel, and display device
View Patent ↗A method for manufacturing an array substrate includes: forming a patterned film layer on a side of a substrate, wherein the patterned film layer is provided with a plurality of grooves; forming a first precursor structure in the groove, wherein a material of the first precursor structure includes a first precursor; and disposing, in an environment of a gaseous second precursor, the substrate on which the first precursor structure is formed, such that the gaseous second precursor is reacted with the first precursor structure to form a perovskite crystal structure; wherein one of the first precursor and the gaseous second precursor includes a metal halide, and the other of the first precursor and the gaseous second precursor includes one of a formamidine halide, a methyl-amine halide, a cesium halide, and a hydrogen sulfide.
1. A method for manufacturing an array substrate, comprising:
forming a patterned film layer on a side of a substrate, wherein the patterned film layer is provided with a plurality of grooves;
forming a first precursor structure in the groove, wherein a material of the first precursor structure comprises a first precursor; and
disposing, in an environment of a gaseous second precursor, the substrate on which the first precursor structure is formed, such that the gaseous second precursor is reacted with the first precursor structure to form a perovskite crystal structure;
wherein one of the first precursor and the gaseous second precursor comprises a metal halide, and the other of the first precursor and the gaseous second precursor comprises one of a formamidine halide, a methyl-amine halide, a cesium halide, and a hydrogen sulfide,
wherein forming the first precursor structure in the groove comprises:
coating a first precursor solution having a first concentration to the side of the substrate on which the patterned film layer is formed;
acquiring a first precursor seed nucleus by precipitating a solute of the first precursor solution having the first concentration in the groove; and
disposing, in a first precursor solution having a second concentration, the substrate on which the first precursor seed nucleus is formed, such that the first precursor seed nucleus grows up to form the first precursor structure;
wherein the second concentration is greater than the first concentration.
2. The method according to claim 1 , wherein one of a target side of the substrate and the patterned film layer is hydrophilic, and the other of the target side of the substrate and the patterned film layer is hydrophobic, wherein the target side of the substrate is the side of the substrate on which the patterned film layer is formed; and
the groove is communicated with the substrate, hydrophilicity or hydrophobicity of the first precursor solution is the same as hydrophilicity or hydrophobicity of the target side of the substrate, and is opposite to hydrophilicity or hydrophobicity of the patterned film layer.
3. The method according to claim 1 , wherein precipitating the solute of the first precursor solution in the groove comprises:
disposing the substrate coated with the first precursor solution having the first concentration in an environment at a first temperature such that the solute is precipitated from the first precursor solution having the first concentration.
4. The method according to claim 1 , wherein disposing, in the first precursor solution having the second concentration, the substrate on which the first precursor seed nucleus is formed, such that the first precursor seed nucleus grows up to form the first precursor structure comprises:
disposing, in the first precursor solution having the second concentration, the substrate on which the first precursor seed nucleus is formed, and keeping the first precursor solution having the second concentration at a second temperature such that the first precursor seed nucleus precipitated on the substrate grows up to form the first precursor structure.
5. The method according to claim 4 , wherein prior to disposing, in the first precursor solution having the second concentration, the substrate on which the first precursor seed nucleus is formed, the method further comprises:
adjusting a temperature of the substrate on which the first precursor seed nucleus is formed to a third temperature, wherein a temperature difference between the third temperature and the second temperature is less than a preset value.
6. The method according to claim 1 , wherein disposing, in the environment of the gaseous second precursor, the substrate on which the first precursor structure is formed, such that the gaseous second precursor is reacted with the first precursor structure to form a perovskite crystal structure comprises:
forming the gaseous second precursor by heating a solid second precursor; and
injecting an inert gas and the gaseous second precursor to the target side of the substrate, such that the gaseous second precursor is reacted with the first precursor structure to form the perovskite crystal structure, wherein the target side of the substrate is the side of the substrate on which the patterned film layer is formed.
7. The method according to claim 6 , wherein injecting the inert gas and the gaseous second precursor to the target side of the substrate, such that the gaseous second precursor is reacted with the first precursor structure to form the perovskite crystal structure comprises:
disposing, in an environment at a fourth temperature, the substrate on which the first precursor structure is formed, and injecting the inert gas and the gaseous second precursor to the target side of the substrate such that the gaseous second precursor is reacted with the first precursor structure on the substrate to form the perovskite crystal structure.
8. The method according to claim 7 , wherein the fourth temperature ranges from 200° C. to 400° C.
9. The method according to claim 7 , wherein upon disposing, in the environment at the fourth temperature, the substrate on which the first precursor structure is formed, and injecting the inert gas and the gaseous second precursor to the target side of the substrate such that the gaseous second precursor is reacted with the first precursor structure on the substrate to form the perovskite crystal structure, the method further comprises:
disposing, in an environment at a fifth temperature, the substrate on which the perovskite crystal structure is formed for annealing for a specified time period.
10. The method according to claim 9 , wherein the fifth temperature ranges from 80° C. to 120° C.
11. The method according to claim 1 , wherein a chemical formula of the metal halide is MX, a chemical formula of the formamidine halide is NH 3 NHX, and a chemical formula of the methyl-amine halide is CH 3 NH 2 X 3 ;
wherein M is one of lead, tin, antimony, bismuth, cesium, and silver, and X is one of chlorine, bromine, and iodine.
12. The method according to claim 1 , wherein forming the patterned film layer on the side of the substrate comprises:
coating a polymer film layer to the side of the substrate;
acquiring a negative photoresist pattern by coating a negative photoresist to a side, distal from the substrate, of the polymer film layer and patterning the negative photoresist; and
etching the polymer film layer with the negative photoresist pattern as a mask, such that a plurality of grooves are formed in the polymer film layer and the patterned film layer is acquired.
13. The method according to claim 1 , wherein the plurality of grooves in the patterned film layer are arranged in an array.