Support substrate for display device, organic EL display device, and manufacturing method for organic EL display device
The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device. In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.
1. A support substrate for a display device comprising:
a TFT glass substrate having a thickness of 10 μm to 150 μm;
a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate; and
a TFT circuitry layer installed on the TFT glass substrate,
wherein the TFT circuitry layer is installed in contact with the TFT glass substrate on a side of the TFT glass substrate that is opposite to the side of the TFT glass substrate in contact with the polyimide resin layer,
wherein the polyimide resin layer comprises a polyimide resin formed from at least one acid dianhydride selected from 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2-bis(4-(3,4-dicarboxyphenoxy) phenyl) propane dianhydride (BSAA), 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) or 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) and at least one diamine selected from 2,2-bis [3-(3-aminobenzamide)-4-hydroxyphenyl] hexafluoropropane (HFHA), trans-1,4-diaminocyclohexane or 2,2′-bis(trifluoromethyl) benzidine (TFMB), and
wherein the support substrate has a total light transmittance of 70% or greater in a visible region after exposure to heat at 450° C. for 120 minutes.
2. The support substrate for a display device of claim 1 , wherein the display device is an organic EL display device.
3. The support substrate for a display device of claim 1 , wherein the polyimide resin layer has a thickness of 0.1 nm or greater.
4. The support substrate for a display device of claim 1 , wherein the polyimide resin layer has a thickness of 100 nm or less.
5. The support substrate for a display device of claim 1 , wherein the TFT glass substrate has a thickness of 30 μm to 100 μm.
6. An organic EL display device comprising the support substrate for a display device of claim 1 .
7. A method for manufacturing an organic EL display device, the method comprising:
a process of forming a polyimide resin layer having a thickness of 20 nm to 150 nm on a glass substrate;
a process of forming a TFT glass substrate having a thickness of 10 μm to 150 μm on the polyimide resin layer;
a process of forming a TFT circuitry layer on the TFT glass substrate on a side of the TFT glass substrate that is opposite to the side of the TFT glass substrate in contact with the polyimide resin layer;
a process of installing a light emitting layer including an organic layer on the TFT circuitry layer; and
a process of encapsulating the light emitting layer with an encapsulation layer, and
a process of peeling the polyimide resin layer from the glass substrate by irradiating laser light on the polyimide resin layer.
8. An organic EL display device comprising the support substrate for a display device of claim 2 .
9. An organic EL display device comprising the support substrate for a display device of claim 3 .
10. An organic EL display device comprising the support substrate for a display device of claim 4 .
11. An organic EL display device comprising the support substrate for a display device of claim 5 .
12. The support substrate for a display device of claim 1 , wherein the polyimide resin comprises at least one of repeating structure units represented by Formulae (1) to (3):
wherein, in the Formulae (1) to (3), R 1 is at least one or more groups represented by (4) to (9):