IP Library › Granted Patent US 12,242,080
Granted Patent B2
US 12,242,080 · App. 17/779,300 · Granted Mar 4, 2025

Laser processing device, and laser processing method

Inventors: Yotaro Wani (Hamamatsu, JP); Yasunori Igasaki (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
G02B27/286B23K26/0006B23K26/046B23K26/53G02B5/3025G02B27/0927G02B27/283G02F1/0136B23K2101/40B23K2103/56B29C2791/009
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Quick Facts
Patent No.
US 12,242,080
App. No.
17/779,300
Granted
Mar 4, 2025
Kind
B2
Abstract

There is provided a laser processing device that performs laser processing on an object made of a birefringent material, the device including: a light source that outputs laser light; a spatial light modulator that modulates the laser light output from the light source; a focusing lens that focuses the laser light toward the object; and a polarized light component control unit that is a function of the spatial light modulator to control polarized light components of the laser light such that the laser light is focused on one point in the object in a Z direction (optical axis direction).

Claims (16)

1. A laser processing device configured to perform laser processing on a semiconductor object made of a birefringent material, by irradiating the semiconductor object with laser light, the device comprising:

a laser output unit configured to output the laser light;

a spatial light modulator configured to modulate the laser light output from the laser output unit;

a focusing lens configured to focus the laser light toward the semiconductor object; and

a polarized light component control unit configured to control polarized light components of the laser light such that the laser light is focused on one point in the semiconductor object in an optical axis direction,

wherein the laser output unit outputs the laser light that is linearly polarized light, and

the polarized light component control unit unifies the polarized light components of the laser light to one of P-polarized light and S-polarized light, and

wherein the polarized light component control unit includes a conversion element configured to convert the linearly polarized light into radially polarized light or azimuthally polarized light.

2. The laser processing device according to claim 1 ,

wherein the birefringent material is a uniaxial crystal material with a 001 plane orientation.

3. A laser processing method in which laser processing is performed on a semiconductor object made of a birefringent material, by irradiating the semiconductor object with laser light, the method comprising:

a step of placing the semiconductor object on a stage;

a step of setting a polarized light component control unit configured to control polarized light components of the laser light such that the laser light is focused on one point in the semiconductor object in an optical axis direction; and

a step of outputting the laser light, wherein

in the step of outputting the laser light, the laser light that is linearly polarized light is output, and

in the step of setting the polarized light component control unit, a conversion element configured to convert the linearly polarized light into radially polarized light or azimuthally polarized light is disposed on an optical path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2022
From: WANI, YOTARO; IGASAKI, YASUNORI
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 060545/0585 →
Priority Claims (1)
JP 2019-214337 · Nov 27, 2019 · national
Continuity (1)
Related Publication 20220390757A1 · Dec 8, 2022
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