Granted Patent B2

US 12,568,787 · App. 17/783,386 · Granted Mar 3, 2026

Inventor: Yoshimitsu Maeda (Tokyo, JP)

Assignee: SATO CORPORATION

H01L21/67115H01L21/463H01L21/477H01L21/67092H01L21/67706

Abstract

Claims (42)

1 . An IC chip mounting apparatus comprising:

a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;

an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body; and

a light irradiator configured to irradiate, with light, the photo-curable adhesive located on each of the inlay antennas of the antenna continuous body,

wherein the light irradiator is configured to irradiate the photo-curable adhesive located on each of the inlay antennas with the light while the IC chip on the photo-curable adhesive is pressed to each of the inlay antennas.

2 . The IC chip mounting apparatus according to claim 1 , wherein the light irradiator is disposed along a conveying direction of the antenna continuous body on the conveying surface.

3 . The IC chip mounting apparatus according to claim 1 , further comprising a press unit that moves up and down in a direction orthogonal to the conveying surface, the press unit configured to press the IC chip on the photo-curable adhesive.

4 . The IC chip mounting apparatus according to claim 3 , further comprising a press unit moving machine configured to move the press unit from a waiting position toward one of the inlay antennas on the conveying surface and circulate the press unit on a circular track along the conveying surface.

5 . The IC chip mounting apparatus according to claim 4 , further comprising a plurality of the press units,

wherein the press unit moving machine is configured to move each of the press units from the waiting position at predetermined times.

6 . The IC chip mounting apparatus according to claim 3 , wherein the press unit has a pressing surface for pressing the IC chip on the photo-curable adhesive, the pressing surface being made of glass through which the light passes.

7 . The IC chip mounting apparatus according to claim 3 , wherein the light irradiator comprises the press unit.

8 . An IC chip mounting apparatus comprising:

a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;

an IC chip placement unit configured to place an IC chip on a thermosetting adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body; and

a thermal curing unit configured to apply heat to the thermosetting adhesive located on the each of the inlay antennas of the antenna continuous body that is conveyed by the conveyor,

wherein the thermal curing unit is configured to apply heat to the thermosetting adhesive located on each of the inlay antennas while the IC chip on the thermosetting adhesive is pressed to each of the inlay antennas.

9 . An IC chip mounting method comprising:

conveying an antenna continuous body on a conveying surface, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;

placing an IC chip on a photo-curable adhesive that is located on a reference position of each of the inlay antennas of the antenna continuous body; and

irradiating, with light, the photo-curable adhesive located on each of the inlay antennas of the antenna continuous body while pressing the IC chip on the photo-curable adhesive to each of the inlay antennas.

10 . The IC chip mounting method according to claim 9 , wherein the pressing the IC chip on the photo-curable adhesive to each of the inlay antennas is performed by a press unit moving up and down in a direction orthogonal to the conveying surface.

11 . The IC chip mounting method according to claim 10 , further comprising:

moving the press unit from a waiting position toward one of the inlay antennas on the conveying surface; and

circulating the press unit on a circular track along the conveying surface.

12 . The IC chip mounting method according to claim 11 , further comprising:

moving each of a plurality of the press units from the waiting position at predetermined times.

13 . The IC chip mounting apparatus according to claim 2 , further comprising a press unit that moves up and down in a direction orthogonal to the conveying surface, the press unit configured to press the IC chip on the photo-curable adhesive.

14 . The IC chip mounting apparatus according to claim 4 , wherein the press unit has a pressing surface for pressing the IC chip on the photo-curable adhesive, the pressing surface being made of glass through which the light passes.

15 . The IC chip mounting apparatus according to claim 5 , wherein the press unit has a pressing surface for pressing the IC chip on the photo-curable adhesive, the pressing surface being made of glass through which the light passes.

16 . An IC chip mounting apparatus comprising:

a light irradiator configured to irradiate, with light, an adhesive on which an IC chip is placed, the adhesive being applied on each of a plurality of antennas of an antenna continuous body;

a press unit configured to press the IC chip on the adhesive to each of the antennas, wherein:

the light irradiator is configured to irradiate the adhesive applied on each of the antennas with the light while the press unit presses the IC chip on the adhesive to each of the antennas, and

the press unit is configured to transmit the light irradiated from the light irradiator while pressing the IC chip on the adhesive to each of the antennas so that the transmitted light irradiates the adhesive.

17 . The IC chip mounting apparatus according to claim 16 , wherein the light irradiator is disposed along an extending direction of the antenna continuous body.

18 . The IC chip mounting apparatus according to claim 16 , wherein the press unit is disposed above the IC chip on the antenna continuous body.

19 . An IC chip mounting method comprising:

pressing, with a press unit, an IC chip on an adhesive to an antenna of an antenna continuous body, the adhesive being applied on the antenna; and

irradiating, with light, the adhesive of the antenna of the antenna continuous body while pressing the IC chip on the adhesive to the antenna with the press unit, wherein:

the press unit transmits the light while pressing the IC chip on the adhesive to the antenna so that the transmitted light irradiates the adhesive.

20 . The IC chip mounting method according to claim 19 , wherein the press unit is disposed above the IC chip on the antenna continuous body.

Assignments (2)

Priority Claims (2)

Continuity (1)

References Cited (50)