High-speed RFID circuit placement method and device
A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
1. A method of making an RFID device, comprising:
testing an RFID circuit that is on a web of RFID circuits;
if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID circuit separation device;
separating the non-defective RFID circuit from the web of RFID circuits with a singulating member;
directing the non-defective RFID circuit onto a rotary placement device and holding the non-defective RFID circuit with a negative pressure with a singulating member; and
placing the non-defective RFID circuit onto an electrical component with the rotary placement device;
if the RFID circuit is determined by the testing to be defective, advancing the defective RFID circuit to a scrap RFID web removal device; and
removing the defective RFID circuit from the web, with the scrap RFID web removal device.
2. The method of claim 1 , wherein the step of advancing the defective RFID circuit on the web includes advancing the defective RFID circuit to a location downstream of the RFID circuit separation device.
3. The method of claim 1 , wherein the step of removing the defective RFID circuit with the scrap RFID web removal device includes cutting the web of RFID circuits.
4. The method of claim 1 , wherein the step of removing the defective RFID circuit with the scrap RFID web removal device includes collecting the scrap RFID circuit web in a receptacle.
5. The method of claim 1 , wherein the RFID circuit is provided on a strap or interposer.
6. The method of claim 1 , wherein the step of separating includes severing the RFID circuit from the web RFID circuits and directing the RFID circuit onto the rotary placement device.
7. The method of claim 1 , wherein the web of RFID circuits is advanced cooperatively with the scrap RFID web removal device through the RFID circuit separation device.
8. The method of claim 1 , further comprising separably coupling the non-defective RFID circuit to the singulating member while directing the non-defective RFID circuit to the rotary placement device.
9. A method of making an RFID device, comprising the steps of;
advancing a web of RFID circuits at a first speed;
testing each of the RFID circuits;
if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID separation device;
rotating a rotary placement device to pick up the non-defective RFID circuit from the RFID separation device at the first speed;
transferring the non-defective RFID circuit from the rotary placement device to an electrical component web at a second speed;
if the RFID circuit is determined by the testing to be defective,
advancing the defective RFID circuit to a scrap RFID web removal device; and
moving the web of RFID circuits and scrap RFID web removal device cooperatively with one another.
10. The method of claim 9 , wherein the first speed is different than the second speed.
11. The method of claim 9 , wherein the electrical component web is a web of antennas.
12. The method of claim 9 , including a further step of die cutting the web of RFID circuits after the step of advancing to form singulated RFID circuits.
13. The method of claim 9 wherein the web of RFID circuits is provided at a first pitch and the electrical component web has a second pitch different than the first pitch.
14. The method of claim 9 , including a further step of bonding the non-defective RFID circuit to the electrical component web after the step of transferring.
15. The method of claim 14 , wherein the step of bonding is accomplished by one of heat, adhesive, pressure, actinic radiation or combinations thereof.
16. The method of claim 9 , wherein the step of rotating the rotary placement device is performed at different speeds.
17. A method of making an RFID device, comprising the steps of:
advancing a web of RFID circuits at a first speed;
testing each of the RFID circuits;
marking each RFID circuit that is defective;
reading each of the RFID circuits on the web;
if the RFID circuit is determined by the testing to be non-defective, positioning the non-defective RFID circuit in an RFID separation device;
moving a placement device to pick up the non-defective RFID circuit from the RFID separation device at the first speed;
transferring the non-defective RFID circuit from the placement device to an electrical component web at a second speed;
if the RFID circuit is determined by the testing to be defective; and advancing the defective RFID circuit to a scrap RFID web removal device.
18. The method of claim 17 , wherein the separation device includes singulating the RFID circuit from the web of RFID circuits.
19. The method of claim 17 , wherein the web of RFID circuit has a first pitch and the electrical component web has a second pitch difference than the first pitch.
20. The method of claim 19 , wherein the first pitch is greater than the second pitch.