METHOD FOR CUTTING A GLASS ELEMENT AND CUTTING SYSTEM
A method for cutting a glass element ( 2 ) with a processing laser ( 4 ) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser ( 4 ) is operated in a first processing step as a perforation laser, with which a perforation ( 12 ) is produced in the glass element ( 2 ) along an intended cutting line ( 8 ), whereby the processing laser ( 4 ) is operated in a second processing step with a modified laser beam ( 14 ) as a separating laser, with which a splitting of the filaments ( 6 ) forming the perforation ( 12 ) is effected.
1 . A method for cutting a glass element with a processing laser, in which the processing laser is operated in a first processing step as a perforation laser, with which a perforation is produced in the glass element along an intended cutting line, and in which the same processing laser is operated in a second processing step with a modified laser beam as a separating laser, with which a splitting of the filaments forming the perforation is effected, the filaments forming the perforation being split by ablative laser processing, characterized in that a laser beam of the processing laser is split in the second processing step by beam shaping into a plurality of partial beams, a notch with a bevel being produced in the second processing step in a region of the previously introduced perforation by ablative laser processing.
2 . The method of claim 1 , in which an ultrashort pulse laser is used as the processing laser.
3 . The method of claim 1 , in which the laser beam of the processing laser is divided into six partial beams by beam shaping in the second processing step.
4 . The method of claim 1 , in which a plasma is generated in the glass element by the processing laser during operation as a separating laser.
5 . The method of claim 1 , wherein a beam shaping element is pivoted into a beam path of the processing laser for the second processing step.
6 . The method of claim 5 , wherein a diffractive optical element is used as the beam shaping element.
7 . (canceled)