IC chip-mounting device and IC chip-mounting method
The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.
1 . An IC chip mounting apparatus comprising:
an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of the antenna continuous body, when located at the second position;
a nozzle attachment to which the plurality of nozzles is attached;
a rotating unit configured to rotate the nozzle attachment, such that the plurality of nozzles moves, on a surface orthogonal to the conveying surface, along a circular track, and a moving direction of each nozzle at the second position matches the conveying direction of the antenna continuous body; and
a processor, wherein the processor is configured to:
determine whether an IC chip is sucked by each nozzle while each nozzle is moved from the first position to the second position; and
control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.
2 . The IC chip mounting apparatus according to claim 1 , wherein the first nozzle is a nozzle having been determined by the processor as sucking an IC chip, and first reaching the second position after the non-sucking nozzle.
3 . The IC chip mounting apparatus according to claim 2 , further comprising an image acquisition unit configured to acquire an image of each nozzle at a position between the first position and the second position,
wherein the processor is configured to determine whether an IC chip is sucked by each nozzle, based on the image acquired by the image acquisition unit.
4 . The IC chip mounting apparatus according to claim 2 , further comprising a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the processor is configured to control the plurality of control valves such that the non-sucking nozzle does not perform the suction operation.
5 . The IC chip mounting apparatus according to claim 1 , further comprising an image acquisition unit configured to acquire an image of each nozzle at a position between the first position and the second position,
wherein the processor is configured to determine whether an IC chip is sucked by each nozzle, based on the image acquired by the image acquisition unit.
6 . The IC chip mounting apparatus according to claim 5 , wherein the processor is further configured to determine correction amounts for the IC chip sucked by each nozzle, based on the image acquired by the image acquisition unit, the correction amounts including
a first correction amount for correcting an angle of each nozzle around a corresponding axis,
a second correction amount for correcting a position of the antenna continuous body in a conveying direction thereof, and
a third correction amount for correcting the position of the antenna continuous body in a width direction thereof.
7 . The IC chip mounting apparatus according to claim 5 , further comprising a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the processor is configured to control the plurality of control valves such that the non-sucking nozzle does not perform the suction operation.
8 . The IC chip mounting apparatus according to claim 1 , further comprising a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the processor is configured to control the plurality of control valves such that the non-sucking nozzle does not perform the suction operation.
9 . The IC chip mounting apparatus according to claim 1 , further comprising a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the processor is configured to control the plurality of control valves such that the non-sucking nozzle does not perform the discharge operation at the second position.
10 . The IC chip mounting apparatus according to claim 1 , wherein:
the ejection unit comprises a dispenser, and
the rotating unit comprises a rotational drive motor.
11 . An IC chip mounting method comprising:
ejecting, by a dispenser, an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
rotating a nozzle attachment to which a plurality of nozzles is attached, each movable between a first position and a second position, such that:
a nozzle of the plurality of nozzles sequentially sucks an IC chip at the first position,
the plurality of nozzles moves, on a surface orthogonal to the conveying surface, along a circular track, and
a moving direction of each nozzle at the second position matches the conveying direction of the antenna continuous body;
determining whether an IC chip is sucked by each nozzle while each nozzle is moved from the first position to the second position;
with respect to each nozzle that has been determined as sucking an IC chip, placing the IC chip on the adhesive at the reference position of the corresponding antenna of the antenna continuous body, when each nozzle is located at the second position; and
controlling an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.
12 . The IC chip mounting method according to claim 11 , wherein the first nozzle is a nozzle having been determined by the determining as sucking an IC chip, and first reaching the second position after the non-sucking nozzle.
13 . The IC chip mounting method according to claim 12 , further comprising acquiring an image of each nozzle at a position between the first position and the second position,
wherein the determining is performed based on the acquired image.
14 . The IC chip mounting method according to claim 12 , further comprising controlling a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the controlling the plurality of control valves is performed such that the non-sucking nozzle does not perform the suction operation.
15 . The IC chip mounting method according to claim 11 , further comprising acquiring an image of each nozzle at a position between the first position and the second position,
wherein the determining is performed based on the acquired image.
16 . The IC chip mounting method according to claim 15 , further comprising determining correction amounts for the IC chip sucked by each nozzle, based on the acquired image, the correction amounts including
a first correction amount for correcting an angle of each nozzle around a corresponding axis,
a second correction amount for correcting a position of the antenna continuous body in a conveying direction thereof, and
a third correction amount for correcting the position of the antenna continuous body in a width direction thereof.
17 . The IC chip mounting method according to claim 15 , further comprising controlling a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the controlling the plurality of control valves is performed such that the non-sucking nozzle does not perform the suction operation.
18 . The IC chip mounting method according to claim 11 , further comprising controlling a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the controlling the plurality of control valves is performed such that the non-sucking nozzle does not perform the suction operation.
19 . The IC chip mounting method according to claim 11 , further comprising controlling a plurality of control valves, each connected to a corresponding nozzle of the plurality of nozzles, each configured so that the corresponding nozzle performs a suction operation for sucking or a discharge operation for discharging air,
wherein the controlling the plurality of control valves is performed such that the non-sucking nozzle does not perform the discharge operation at the second position.