Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

1. A resin composition comprising:

a bismaleimide compound (A) comprising a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain,

at least two maleimide compounds (B) selected from the group consisting of a compound represented by the following formula (2), a compound represented by the following formula (3), a compound represented by the following formula (4), a compound represented by the following formula (5), a compound represented by the following formula (6), and a compound represented by the following formula (7),

a photo initiator (C) and

a compound (D) comprising one or more carboxy groups:

wherein R 1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R 2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R 3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n 1 independently represents an integer of 1 to 10,

wherein each of R 4 , R 5 , and R 6 independently represents a hydrogen atom, a hydroxyl group, or a linear or branched alkyl group having 1 to 6 carbon atoms and optionally having a substituent; and n 2 represents an integer of 1 to 10,

wherein each R 7 independently represents a hydrogen atom or a methyl group; and n 3 represents an integer of 1 to 10,

wherein each of R 8 , R 9 , and R 10 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 8 carbon atoms and optionally having a substituent,

wherein each R 11 independently represents a hydrogen atom, a methyl group, or an ethyl group; and each R 12 independently represents a hydrogen atom or a methyl group,

wherein each R 13 independently represents a hydrogen atom, a methyl group, or an ethyl group, and

wherein each R 14 independently represents a hydrogen atom or a methyl group; and n 4 represents an integer of 1 to 10.

2. The resin composition according to claim 1 , wherein the photo initiator (C) comprises a compound represented by the following formula (8):

wherein each R 15 independently represents a group represented by the following formula (9) or a phenyl group; and

wherein -* represents a bonding hand, and each R 16 independently represents a hydrogen atom or a methyl group.

3. The resin composition according to claim 1 , wherein the compound (D) comprising one or more carboxy groups is at least one selected from the group consisting of a compound represented by the following formula (10), a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13):

wherein each R 17 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, an amino group or an aminomethyl group; each k independently represents an integer of 1 to 5; and when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride,

wherein each R 18 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each 1 independently represents an integer of 1 to 9; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when a carboxymethyl group is present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride,

wherein each R 19 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each m independently represents an integer of 1 to 9; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when a carboxymethyl group is present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride, and

wherein each R 20 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group or an aminomethyl group; each o independently represents an integer of 1 to 5; when one or more carboxy groups are present, the carboxymethyl group and the carboxy group are optionally linked together to form an acid anhydride; when two or more carboxy groups are present, the carboxy groups are optionally linked together to form an acid anhydride; and when two or more carboxymethyl groups are present, the carboxymethyl groups are optionally linked together to form an acid anhydride.

4. A resin sheet comprising:

a support; and

a resin layer disposed on one surface or both surfaces of the support,

wherein the resin layer comprises the resin composition according to claim 1 .

5. The resin sheet according to claim 4 , wherein the resin layer has a thickness of 1 to 50 μm.

6. A multilayer printed wiring board comprising:

an insulation layer; and

a conductor layer formed on one surface or both surfaces of the insulation layer,

wherein the conductor layer comprises the resin composition according to claim 1 .

7. A semiconductor device comprising the resin composition according to claim 1 .