Touch pad
A touch pad, comprises a housing comprising a vibration device, a cover, a capacitive sensing layer electrically connected to a processor and a pressure sensing layer arranged in the housing, also electrically connected to the processor. The capacitive sensing layer is positioned between the cover and the pressure sensing layer. The processor is configured to utilize a signal output from either the capacitive sensing layer or the pressure sensing layer to activate the vibration device.
1. A touch pad, comprising:
a housing comprising a vibration device;
a cover;
a capacitive sensing layer electrically connected to a processor;
a pressure sensing layer arranged in said housing, said pressure sensing layer being electrically connected to said processor, wherein:
said capacitive sensing layer is positioned between said cover and said pressure sensing layer, and
said processor is configured to utilize a voltage signal output from either said capacitive sensing layer or said pressure sensing layer to activate said vibration device; and
an actuator provided between said capacitive sensing layer and said pressure sensing layer, a cross-sectional area of said actuator being smaller than a cross-sectional area of said pressure sensing layer, and said actuator being configured to transfer an applied pressure through said capacitive sensing layer to said pressure sensing layer to amplify said applied pressure on said actuator such that said pressure sensing layer receives an indication of the pressure applied, wherein:
when said capacitive sensing layer is in a low current state and a voltage signal output from said capacitive sensing layer cannot be processed by said processor, said processor utilizes a voltage signal output from said pressure sensing layer to activate said vibration device.
2. The touch pad of claim 1 , wherein said pressure sensing layer comprises a thin film pressure sensor.
3. The touch pad of claim 1 , further comprising a support plate.
4. The touch pad of claim 3 , wherein said pressure sensing layer is positioned on an upper surface of said support plate.
5. The touch pad of claim 3 , wherein said vibration device is attached to said support plate.
6. The touch pad of claim 3 , wherein said support plate comprises a metallic material.
7. The touch pad of claim 3 , wherein said support plate is secured to said housing.
8. The touch pad of claim 1 , wherein said vibration device is a linear motor.
9. The touch pad of claim 8 , wherein said cover comprises a metal material.
10. The touch pad of claim 9 , wherein said vibration device is disposed to one side of said capacitive sensing layer away from said cover.
11. The touch pad of claim 1 , wherein said cover and said capacitive sensing layer have a substantially similar cross-sectional area.
12. A keyboard comprising the touch pad of claim 1 .
13. An electronic device comprising the keyboard of claim 12 .
14. A method of activating a touch pad, comprising the steps of:
providing an application of force to a cover of a touch pad, said touch pad comprising a capacitive sensing layer and a pressure sensing layer electrically connected to a processor, and an actuator provided between said capacitive sensing layer and said pressure sensing layer, a cross-sectional area of said actuator being smaller than a cross-sectional area of said pressure sensing layer; and
transferring said application of force through said capacitive sensing layer to said pressure sensing layer by means of said actuator to amplify applied pressure on said actuator such that said pressure sensing layer receives an indication of the pressure applied;
said processor being configured to:
determine a voltage signal output from either one of said capacitive sensing layer or said pressure sensing layer;
activate a vibration device of said touch pad in response to said determined voltage signal; and
utilize a voltage signal output from said pressure sensing layer to activate said vibration device when said capacitive sensing layer is in a low current state and a voltage signal output from said capacitive sensing layer cannot be processed by said processor.