Optoelectronic device with multiple epitaxial layers, and production method
In an embodiment an optoelectronic device includes an epitaxial layer stack having at least a first epitaxial layer and a second epitaxial layer arranged above the first epitaxial layer, wherein the following layers are embedded in the epitaxial layer stack a first semiconductor layer of a first conductivity type, an active layer arranged above the first semiconductor layer and configured to generate light, and a second semiconductor layer of a second conductivity type arranged above the active layer, wherein an interface between the first epitaxial layer and the second epitaxial layer extends at least partially through the first semiconductor layer and/or the second semiconductor layer, and wherein the active layer is embedded in a non-doped barrier layer, the barrier layer covering one or more side surfaces of the active layer.
1 . An optoelectronic device comprising:
an epitaxial layer stack comprising at least a first epitaxial layer and a second epitaxial layer arranged above the first epitaxial layer, wherein the following layers are embedded in the epitaxial layer stack:
a first semiconductor layer of a first conductivity type,
an active layer arranged above the first semiconductor layer and configured to generate light, wherein the active layer comprises a first main surface and a second main surface opposite the first main surface, and wherein the first main surface and the second main surface are connected by one or more side surfaces of the active layer, and
a second semiconductor layer of a second conductivity type arranged above the active layer,
wherein an interface between the first epitaxial layer and the second epitaxial layer extends at least partially through the first semiconductor layer and/or the second semiconductor layer, and
wherein the active layer is embedded in a non-doped barrier layer, the barrier layer covering the first and second main surfaces and the one or more side surfaces of the active layer.
2 . The optoelectronic device according to claim 1 , wherein a first portion of the interface between the first epitaxial layer and the second epitaxial layer extends through the first semiconductor layer and a second portion of the interface between the first epitaxial layer and the second epitaxial layer extends through the second semiconductor layer.
3 . The optoelectronic device according to claim 2 , wherein the first portion of the interface is arranged outside an outline of the active layer and the second portion of the interface lies within the outline of the active layer.
4 . The optoelectronic device according to claim 2 , wherein the first portion and/or the second portion of the interface are parallel to a main surface of the active layer.
5 . The optoelectronic device according to claim 1 , wherein at least a portion of the interface between the first epitaxial layer and the second epitaxial layer is parallel to a main surface of the active layer and above or below the main surface of the active layer.
6 . The optoelectronic device according to claim 1 , wherein the active layer comprises one or more side surfaces and at least a portion of the interface between the first epitaxial layer and the second epitaxial layer extends along at least one of the side surfaces of the active layer.
7 . The optoelectronic device according to claim 1 , wherein the active layer comprises a mesa structure.
8 . The optoelectronic device according to claim 1 , wherein a ratio of a width of an upper main surface of the active layer to a portion of the interface extending along at least one of the side surfaces of the active layer is at least 10.
9 . The optoelectronic device according to claim 1 , wherein one of the first and second conductivity types is a p-type conductivity type and the other conductivity type is an n-type conductivity type.
10 . The optoelectronic device according to claim 1 , wherein the optoelectronic device is a μLED.
11 . The optoelectronic device according to claim 1 , wherein the first semiconductor layer is arranged on a substrate.
12 . A method for manufacturing the optoelectronic device according to claim 1 , the method comprising:
generating the epitaxial layer stack of at least the first epitaxial layer and the second epitaxial layer arranged above the first epitaxial layer.
13 . The method according to claim 12 , wherein, after the first epitaxial layer is generated, the first epitaxial layer is structured and the second epitaxial layer is generated on the structured first epitaxial layer.
14 . The method according to claim 13 , wherein structuring the first epitaxial layer structures the active layer.
15 . The method according to claim 12 , wherein the second epitaxial layer is generated directly on the first epitaxial layer.