Optoelectronic module
A support structure for mounting an optical assembly above an optoelectronic device, the optical assembly comprising an electrically conductive structure, the support structure comprising: a first surface for supporting an optical assembly; and an electrically conductive lead, wherein said electrically conductive lead comprises: a first electrical interface portion adjacent to the first surface for forming an electrical contact with an electrically conductive structure of an optical assembly supported by the first surface; a second electrical interface portion on a side opposing the first surface, and wherein the electrically conductive lead extends from the first electrical interface portion to the second electrical interface portion so as to maintain an optical assembly supported on the first surface and the second electrical interface portion in electrical contact.
1 . A support structure for mounting an optical assembly above an optoelectronic device, the optical assembly comprising an electrically conductive structure, the support structure comprising:
a first surface for supporting the optical assembly;
a spacer on the first surface;
an electrically conductive lead comprising a first electrical interface portion adjacent to the first surface; and
a first recess in the first surface, wherein the first recess comprises one or more walls defining a volume for receiving an electrically conductive fluid, wherein the volume is open at the first surface but is otherwise closed, and
wherein at least a portion of the one or more walls of the recess is formed from the first electrical interface portion of the electrically conductive lead such that the electrically conductive fluid received in the recess maintains the first electrical interface portion of the electrically conductive lead and the electrically conductive structure of the optical assembly supported by the surface in electrical connection.
2 . The support structure of claim 1 , wherein all of the one or more walls of the first recess is or are formed from the first interface portion of the electrically conductive lead.
3 . The support structure of claim 1 , further comprising a plurality of sidewalls extending from the first surface such that the sidewalls define a continuous border surrounding the optical assembly supported by the first surface.
4 . The support structure of claim 1 ,
wherein the support structure is electrically insulating, save for the electrically conductive lead.
5 . The support structure of claim 1 , wherein the first recess is positioned such that it is at least partially covered by the optical assembly supported on the first surface.
6 . The support structure of claim 5 , wherein the first recess is positioned such that a portion of the recess remains uncovered when the optical assembly is supported on the first surface.
7 . The support structure of claim 1 , wherein one or more walls of the first recess is or are substantially curved.
8 . The support structure of claim 7 , wherein the first recess has a substantially recessed spherical cap shape or recessed ellipsoidal cap shape.
9 . The support structure of claim 1 , wherein the electrically conductive fluid is a conductive epoxy.
10 . The support structure of claim 1 , wherein the electrically conductive fluid a heat-curable fluid.
11 . An optoelectronic module comprising:
the support structure of claim 1 ;
the optical assembly comprising the electrically conductive structure positioned on the first surface;
a mechanical adhesive attaching the optical assembly to the first surface; and
the electrically conductive fluid disposed in the first recess and in contact with the electrically conductive structure, so as to maintain the electrically conductive lead and the electrically conductive structure in electrical connection.
12 . The optoelectronic module of claim 11 , further comprising:
an electrically conductive trace;
the optoelectronic device mounted on the electrically conductive trace and being operable to emit or detect light through the optical assembly,
wherein the electrically conductive lead is in electrical connection with the electrically conductive trace.
13 . A method of manufacturing the optoelectronic module of claim 11 , the method comprising:
applying the mechanical adhesive to the first surface;
positioning the optical assembly on the first surface; thermally curing the mechanical adhesive;
once the mechanical adhesive is thermally cured, introducing the electrically conductive fluid into the first recess;
thermally curing the electrically conductive fluid.
14 . The method of claim 13 , wherein, prior to thermally curing the adhesive, the adhesive is partially cured using ultraviolet light.
15 . The support structure of claim 1 , wherein the electrically conductive structure comprises an electrical trace that is substantially transparent to a wavelength of light produced by the optoelectronic device.
16 . The support structure of claim 15 , wherein the electrical trace is disposed on a surface of the optical assembly and configured to detect moisture on the surface of the optical assembly.