Optical component, optical assembly and optical module
An optical module includes an electronic assembly and an optical component. The electronic assembly includes a chip component and a circuit board. The optical assembly disposed on the electronic assembly includes a bracket and an optical component. The bracket surrounds the chip component and has at least two conductive layers separated from each other. The conductive layers extend to the bottom of the bracket and are electrically connected to the electronic assembly. The optical assembly is disposed on the bracket and has at least one light-transmissive conductive layer which is electrically connected to the conductive layers.
1. An optical module, comprising:
an electronic assembly including a chip component and a circuit board; and
an optical assembly disposed on the electronic assembly, including a bracket and an optical component, the bracket surrounding the chip component and including at least two conductive layers separated from each other, the conductive layers extending to the bottom of the bracket and being electrically connected to the electronic assembly, the optical assembly being disposed on the bracket and including at least one light-transmissive conductive layer which is electrically connected to the conductive layers;
wherein the optical component further includes an optical component body, the at least one light-transmissive conductive layer is disposed on one of the upper surface and the lower surface of the optical component body, and the at least one light-transmissive conductive layer includes two conductive ends disposed at two sides of the optical component body, respectively; and the conductive layers are configured on one of the outer surface, the inner surface, and the interior of the bracket; wherein the at least one light-transmissive conductive layer is electrically disconnected from the conductive layers when the optical component is detached from the bracket.
2. The optical module according to claim 1 , wherein the bracket further includes at least two grooves, and each of the conductive layers is respectively disposed in each of the grooves; the optical component further includes an optical component body on which the at least one light-transmissive conductive layer is disposed, the shape of the optical component body is rectangular, and the at least one light-transmissive conductive layer extends from one corner of the optical component body to another opposite corner thereof; and the at least one light-transmissive conductive layer is S-shaped or strip-shaped.
3. The optical module according to claim 1 , wherein the width of the conductive layers is longer than the width of the light-transmissive conductive layer.
4. An optical module, comprising:
an electronic assembly including a chip component and a circuit board; and
an optical assembly disposed on the electronic assembly, including a bracket and an optical component, the bracket surrounding the chip component and including at least two conductive layers separated from each other, the conductive layers extending to the bottom of the bracket and being electrically connected to the electronic assembly, the optical assembly being disposed on the bracket and including at least one light-transmissive conductive layer which is electrically connected to the conductive layers;
wherein the bracket further includes at least two grooves, and each of the conductive layers is respectively disposed in each of the grooves; the optical component further includes an optical component body on which the at least one light-transmissive conductive layer is disposed, the shape of the optical component body is rectangular, and the at least one light-transmissive conductive layer extends from one corner of the optical component body to another opposite corner thereof; and the at least one light-transmissive conductive layer is S-shaped or strip-shaped.