Power electronics device and power electronics functional system
A power electronics device comprises a power semiconductor, a first circuit board controllingly connected to the power semiconductor, a lead frame connecting the power semiconductor and the first circuit board. The power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor. The power electronics device further comprises a housing, which borders at least regions of a fluid reservoir accommodating a coolant fluid. The power semiconductor and the lead frame are arranged in the fluid reservoir and are configured to transfer heat to the coolant fluid.
1 . A power electronics device, comprising:
a power semiconductor, the power semiconductor being a switching device;
a first circuit board controllingly connected to the power semiconductor;
a lead frame connecting the power semiconductor and the first circuit board, wherein the power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor, wherein the power semiconductor is disposed between the first circuit board and the lead frame, wherein the power semiconductor is directly connected to the first circuit board and the lead frame on opposing sides of the power semiconductor, the power semiconductor being configured to transfer heat directly to the first circuit board and the lead frame, the lead frame forming a drain connection from the power semiconductor to the first circuit board; and
a housing which borders at least regions of a fluid reservoir accommodating a coolant fluid;
wherein the power semiconductor and the lead frame are arranged in the fluid reservoir and configured to transfer heat to the coolant fluid.
2 . The power electronics device according to claim 1 , further comprising:
a further power semiconductor; and
a further lead frame connecting the further power semiconductor and the first circuit board;
wherein the further power semiconductor is connected to at least one contacting region of the further lead frame in such a way that heat can be transferred from the further power semiconductor to the further lead frame and is conducted away from the further lead frame by the further power semiconductor;
wherein the further power semiconductor and the further lead frame are arranged on an opposite side of the first circuit board than the power semiconductor and the lead frame.
3 . The power electronics device according to claim 2 , wherein the first circuit board is electrically coupled to a second circuit board, and wherein the first circuit board with the power semiconductors and lead frames arranged thereon is positioned in such a way that the further lead frame has a spacing from the second circuit board.
4 . The power electronics device according to claim 1 , wherein line elements of the lead frame form a total heat transfer surface for transferring heat to the coolant fluid, wherein an area of the total heat transfer surface is greater than an area of a connection surface of the lead frame on which the lead frame contacts the power semiconductor.
5 . The power electronics device according to claim 1 , wherein a plane of attachment of the lead frame to the power semiconductor has a spacing from the first circuit board.
6 . The power electronics device according to claim 1 , further comprising a condensing unit configured to cool and thus condense vaporized coolant fluid and in turn to provide the cooled and condensed coolant fluid for cooling at least one of the power semiconductor or the lead frame, wherein the condensing unit is disposed within the housing and above the lead frame.
7 . The power electronics device according to claim 6 , wherein the condensing unit has a receiving space and a cooling medium accommodated in the receiving space, the condensing unit being configured to absorb heat from vaporized coolant fluid and transfer the absorbed heat to the cooling medium in the receiving space.
8 . The power electronics device according to claim 7 , wherein the condensing unit has projections extending towards the fluid reservoir, wherein the receiving space extends at least partially into the projections.
9 . A motor vehicle having an electric motor, comprising a power electronics device according to claim 6 , and a cooling medium circuit which is fluidically coupled to the condensing unit of the power electronics device.
10 . A power electronics functional system, comprising a plurality of power electronics devices according to claim 1 , wherein the power electronics devices are connected to lines for different voltage phases.
11 . The power electronics device of claim 1 , comprising a snubber capacitor arranged on and connected to the first circuit board, wherein the snubber capacitor is arranged in the fluid reservoir and configured to transfer heat to the coolant fluid.
12 . A power electronics device, comprising:
a circuit board;
a housing, at least partially, defining a fluid reservoir;
a power semiconductor disposed in the fluid reservoir, the power semiconductor being a switching device;
a lead frame disposed in the fluid reservoir, the lead frame being connected to the power semiconductor and the circuit board, wherein the power semiconductor is disposed between the circuit board and the lead frame, wherein the power semiconductor is directly connected to the circuit board and the lead frame on opposing sides of the power semiconductor, the power semiconductor being configured to transfer heat directly to the circuit board and the lead frame, the lead frame forming a drain connection from the power semiconductor to the circuit board; and
a coolant fluid housed in the fluid reservoir, the coolant fluid surrounding the power semiconductor and the lead frame in the fluid reservoir.
13 . The power electronics device of claim 12 , wherein the circuit board, at least partially, defines the fluid reservoir, wherein a top surface of the circuit board defines a bottom of the fluid reservoir, wherein the power semiconductor and the lead frame are connected to the top surface of the circuit board.
14 . The power electronics device of claim 12 , wherein the circuit board is disposed in the fluid reservoir.
15 . The power electronics device of claim 12 , further comprising:
a further power semiconductor disposed in the fluid reservoir; and
a further lead frame disposed in the fluid reservoir, the further lead frame connecting the further power semiconductor to the circuit board;
wherein the coolant fluid surrounds the further power semiconductor and the further lead frame in the fluid reservoir.
16 . The power electronics device of claim 15 , wherein the further power semiconductor and the further lead frame are arranged on an opposite side of the circuit board than the power semiconductor and the lead frame.
17 . The power electronics device of claim 11 , further comprising a further circuit board supporting the housing, the further circuit board, at least partially, defining the fluid reservoir, wherein the power semiconductor, the circuit board, and the lead frame are spaced from the further circuit board.
18 . The power electronics device of claim 12 , wherein a plane of attachment of the lead frame to the power semiconductor has a spacing from the circuit board.
19 . The power electronics device of claim 12 , further comprising a condensing unit disposed within the housing, the condensing unit being configured to cool vaporized coolant fluid received from the fluid reservoir and to provide condensed coolant fluid to the fluid reservoir.
20 . The power electronics device of claim 12 , the power semiconductor is configured to transfer heat to at least one of the coolant fluid or the lead frame, and the lead frame is configured to transfer heat to the coolant fluid.