Electronic device including antenna

1. An electronic device including an antenna, the electronic device comprising:

a first radiator configured by stacking metal patterns having a predetermined width and length on different layers of a multi-layer substrate;

a second radiator configured by stacking metal patterns having a predetermined width and length above the first radiator;

a vertical via configured to interconnect a metal pattern disposed at an upper portion of the first radiator and a metal pattern disposed at a lower portion of the second radiator;

first vertical vias spaced apart from each other and configured to interconnect the metal patterns of adjacent layers of the first radiator in one axial direction and the other axial direction perpendicular to the one axial direction;

second vertical vias spaced apart from each other and configured to interconnect the metal patterns of adjacent layers of the second radiator in one axial direction and the other axial direction;

a feeding line connected to one of first metal patterns disposed on an uppermost layer of the first radiator, wherein an end portion of the feeding line is connected to a first metal pattern disposed at one side of the first metal patterns;

a ground line connected to any one of second metal patterns disposed under the first metal patterns, wherein an end portion of the ground line is connected to a second metal pattern disposed at the other side of the second metal patterns;

a ground wall configured to connect the multi-layer substrate, and spaced apart from the first radiator; and

a transceiver circuit configured to be connected to the first metal pattern of the first radiator through a feeding line,

wherein the first metal patterns and the feeding line are disposed on a first layer that is an uppermost layer of the multi-layer substrate and a multi-layer circuit substrate, respectively, and

wherein the ground line is disposed on a second layer that is a layer adjacent to the uppermost layer of the multi-layer circuit substrate, and

wherein a height of the ground wall is defined to be higher than that of the multi-layer circuit substrate.

2. The electronic device of claim 1 , wherein a length of the metal patterns disposed on each layer of the first radiator is disposed to have a first length, and

wherein a length of the metal patterns disposed on each layer of the second radiator is disposed to have a second length larger than the first length.

3. The electronic device of claim 2 , wherein the metal patterns disposed on each layer of the first radiator are all disposed to have a first length that is the same length, and

wherein the metal patterns disposed on each layer of the second radiator are all disposed to have a second length that is the same length.

4. The electronic device of claim 1 , wherein an antenna element comprising the first radiator and the second radiator is configured to operate in a first band and a second band higher than the first band,

wherein a current intensity formed in the metal patterns of the first radiator that is a lower radiator in the first band is distributed to be higher than that formed in the metal patterns of the second radiator that is an upper radiator, and

wherein a current intensity formed in the metal patterns of the second radiator in the second band is distributed to be higher than that formed in the metal patterns of the first radiator.

5. The electronic device of claim 1 , wherein an antenna element comprising the first radiator and the second radiator constitutes an array antenna in which a plurality of antenna elements are disposed to be spaced apart from each other by a predetermined distance, the electronic device further comprising:

a baseband processor operatively coupled to the transceiver circuit and configured to control a phase of a signal applied to each antenna element of the array antenna via the transceiver circuit.

6. An antenna module provided in an electronic device, the antenna module comprising:

a lower radiator configured by stacking metal patterns having a predetermined width and length on different layers of a multi-layer substrate;

an upper radiator configured by stacking metal patterns having a predetermined width and length above the first radiator;

a feeding line disposed on any one layer of a multi-layer circuit substrate, and configured to be connected to a first metal pattern disposed at one side of first metal patterns disposed on an uppermost layer of the lower radiator;

a ground line connected to any one of second metal patterns disposed under the first metal patterns, wherein an end portion of the ground line is connected to a second metal pattern disposed at the other side of the second metal patterns;

a vertical via configured to interconnect a metal pattern disposed at an upper portion of the first radiator and a metal pattern disposed at a lower portion of the second radiator;

first vertical vias spaced apart from each other and configured to interconnect the metal patterns of adjacent layers of the first radiator in one axial direction and the other axial direction perpendicular to the one axial direction;

second vertical vias spaced apart from each other and configured to interconnect the metal patterns of adjacent layers of the second radiator in one axial direction and the other axial direction;

a ground wall configured to connect the multi-layer substrate, and spaced apart from the first radiator; and

wherein the first metal patterns and the feeding line are disposed on a first layer that is an uppermost layer of the multi-layer substrate and the multi-layer circuit substrate, respectively, and

wherein the ground line is disposed on a second layer that is a layer adjacent to the uppermost layer of the multi-layer circuit substrate, and

wherein a height of the ground wall is defined to be higher than that of the multi-layer circuit substrate.

7. The antenna module of claim 6 , wherein a length of the metal patterns disposed on each layer of the first radiator is disposed to have a first length, and

wherein a length of the metal patterns disposed on each layer of the second radiator is disposed to have a second length larger than the first length.

8. The antenna module of claim 6 , wherein the metal patterns disposed on each layer of the first radiator are all disposed to have a first length that is the same length, and

wherein the metal patterns disposed on each layer of the second radiator are all disposed to have a second length that is the same length.

9. The antenna module of claim 6 , wherein an antenna element comprising the first radiator and the second radiator is configured to operate in a first band and a second band higher than the first band,

wherein a current intensity formed in the metal patterns of the first radiator that is a lower radiator in the first band is distributed to be higher than that formed in the metal patterns of the second radiator that is an upper radiator, and

wherein a current intensity formed in the metal patterns of the second radiator in the second band is distributed to be higher than that formed in the metal patterns of the first radiator.

10. The antenna module of claim 6 , wherein an antenna element comprising the first radiator and the second radiator constitutes an array antenna in which a plurality of antenna elements are disposed to be spaced apart from each other by a predetermined distance, the antenna module further comprising:

a baseband processor operatively coupled to the transceiver circuit and configured to control a phase of a signal applied to each antenna element of the array antenna via the transceiver circuit.