Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.
1. An assembly comprising:
a printed circuit board (PCB) that includes one or more components and a thermally-conductive material that covers at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite the first surface of the PCB; and
a heatsink shield that includes multiple dimples in direct mechanical contact with the thermally-conductive material of the PCB on both the first surface and second surface of the PCB, the heatsink shield being adjacent to the one or more components and the first surface of the PCB, the heatsink shield being configured to distribute thermal energy produced at least in part by the one or more components to a housing positioned adjacent to the second surface of the PCB.
2. The assembly of claim 1 , the assembly further comprising:
multiple alignment pins that pass through the heatsink shield amongst at least some of the multiple dimples, the multiple alignment pins aligning the PCB, the heatsink shield, and the housing.
3. The assembly of claim 2 , wherein the alignment pins partially embed a radome adjacent to a portion of the housing, the radome and the housing encompassing the PCB and the heatsink shield.
4. The assembly of claim 1 , the assembly further comprising:
a radome adjacent to a portion of the housing, the radome and the housing encompassing the PCB and the heatsink shield; and
an elastomer pad positioned between the radome and the heatsink shield that compresses the heatsink shield against the thermally-conductive material of the PCB, the elastomer pad including dimples that fit within recesses created by the dimples of the heatsink shield.
5. The assembly of claim 1 , wherein:
the one or more components include a monolithic microwave integrated circuit (MMIC) positioned on the first surface of the PCB;
the PCB further includes multiple thermal vias between the first surface and the second surface, the multiple thermal vias configured to distribute thermal energy produced at least in part by the MMIC from the first surface to the second surface; and
the thermally-conductive material covers an inner surface of the thermal vias.
6. The assembly of claim 5 , wherein the thermally-conductive material also covers a first distal end and a second distal end of the thermal vias to distribute the thermal energy produced at least in part by the MMIC along the first surface.
7. The assembly of claim 1 , wherein:
the one or more components include a monolithic microwave integrated circuit (MMIC) positioned on the first surface of the PCB and a processor positioned on the second surface of the PCB; and
the heatsink shield is configured to distribute thermal energy produced by the MMIC and the processor to the housing.
8. The assembly of claim 7 , wherein at least a portion of the processor is positioned opposite at least a portion of the MMIC.
9. The assembly of claim 1 , wherein:
the one or more components include a monolithic microwave integrated circuit (MMIC) and a processor both positioned on the first surface of the PCB; and
the PCB further includes multiple thermal vias between the first surface and the second surface, the multiple thermal vias configured to distribute thermal energy produced at least in part by the MMIC and the processor from the first surface to the second surface.
10. The assembly of claim 1 , wherein the thermally-conductive material and the heatsink shield comprise a copper alloy.
11. The assembly of claim 1 , wherein the dimples are arranged in an aligned or staggered pattern on the heatsink shield.
12. The assembly of claim 1 , wherein the dimples have an approximately spherical shape.
13. A method of assembling a system, the method comprising:
positioning a printed circuit board (PCB) into a housing, the PCB including one or more components and a thermally-conductive material that covers at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite the first surface of the PCB, the housing being adjacent to the second surface of the PCB;
positioning a heatsink shield adjacent to the one or more components and the first surface of the PCB, the heatsink shield including multiple dimples in direct mechanical contact with the thermally-conductive material of the PCB on both the first surface and second surface of the PCB and being configured to distribute thermal energy produced at least in part by the one or more components to the housing, the multiple dimples having an approximately spherical shape; and
attaching together the housing, the PCB, and the heatsink shield to form the system.
14. The method of claim 13 , the method further comprising:
aligning, using multiple alignment pins, the PCB, the heatsink shield, and the housing, the multiple alignment pins passing through the heatsink shield amongst at least some of the multiple dimples.
15. The method of claim 14 , wherein the alignment pins are partially embedded a radome adjacent to a portion of the housing, the radome and the housing encompassing the PCB and the heatsink shield.
16. The method of claim 15 , the method further comprising:
positioning an elastomer pad between the radome and the heatsink shield that compresses the heatsink shield against the thermally-conductive material of the PCB, the elastomer pad including dimples that fit within recesses created by the dimples of the heatsink shield.
17. The method of claim 13 , wherein the dimples have an approximately spherical shape.
18. The method of claim 13 , wherein the dimples are arranged in an aligned or staggered pattern on the heatsink shield.
19. The method of claim 13 , wherein:
the one or more components include a monolithic microwave integrated circuit (MMIC) positioned on the first surface of the PCB;
the PCB further includes multiple thermal vias between the first surface and the second surface, the multiple thermal vias configured to distribute thermal energy produced at least in part by the MMIC from the first surface to the second surface; and
the thermally-conductive material covers an inner surface of the thermal vias.
20. The method of claim 13 , wherein:
the one or more components include a monolithic microwave integrated circuit (MMIC) positioned on the first surface of the PCB and a processor positioned on the second surface of the PCB; and
the heatsink shield is positioned adjacent to both the first surface and the second surface of the PCB and configured to distribute thermal energy produced by the MMIC and the processor to the housing.