Module
A module includes a main substrate having a first surface, a sub-module mounted on the first surface, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface, the sub-module, and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film formed so as to cover at least a part of a surface of second sealing resin remote from the first surface. A surface of the sub-module remote from the first surface includes a striped section where an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged.
1. A module comprising:
a main substrate having a first surface;
a sub-module mounted on the first surface;
a first component mounted on the first surface separately from the sub-module; and
a first sealing resin disposed so as to cover the first surface, the sub-module, and the first component, wherein:
the sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film disposed so as to cover at least a part of a surface of the second sealing resin remote from the first surface,
a surface of the sub-module remote from first surface includes a striped section, wherein in the striped section, an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged,
the second component is an inductor, and
the striped section and the second component overlap each other as viewed from above.
2. The module according to claim 1 , wherein the second component is disposed along a surface of the sub-module adjacent to the first surface, and the second component is mounted on the first surface.
3. The module according to claim 2 , wherein the second component is an inductor, and the striped section and the second component overlap each other as viewed from above.
4. The module according to claim 2 , wherein the internal shielding film further covers at least one of side surfaces of the second sealing resin.
5. The module according to claim 1 , wherein the sub-module includes a sub-module substrate, the second component is mounted on the sub-module substrate, and the sub-module substrate is mounted on the first surface.
6. The module according to claim 5 , wherein the internal shielding film further covers at least one of side surfaces of the second sealing resin.
7. The module according to claim 1 , wherein the internal shielding film further covers at least one of side surfaces of the second sealing resin.
8. The module according to claim 1 , further comprising an external shielding film disposed so as to cover a surface of the first sealing resin remote from the first surface, side surfaces of the first sealing resin, and side surfaces of the main substrate.
9. The module according to claim 8 , wherein the internal shielding film does not cover a portion of side surfaces of the second sealing resin, and the external shielding film directly covers at least a part of the portion of the side surfaces of the second sealing resin not covered with the internal shielding film.
10. The module according to claim 8 , wherein a thickness of the internal shielding film is less than or equal to a thickness of the external shielding film.
11. The module according to claim 1 , wherein the internal shielding film has at least a two-layer structure.
12. The module according to claim 1 , wherein the main substrate has a second surface on a side opposite from the first surface, and the module further comprises a third component mounted on the second surface.
13. The module according to claim 1 , wherein the striped section is striped in only one direction.
14. A module comprising:
a main substrate having a first surface;
a sub-module mounted on the first surface;
a first component mounted on the first surface separately from the sub-module; and
a first sealing resin disposed so as to cover the first surface, the sub-module, and the first component, wherein:
the sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film disposed so as to cover at least a part of a surface of the second sealing resin remote from the first surface,
a surface of the sub-module remote from first surface includes a striped section, wherein in the striped section, an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged, and
the two-layer structure includes a stainless steel film and a copper film stacked in order from inside.