IP Library › Granted Patent US 11,721,789
Granted Patent B2
US 11,721,789 · App. 17/806,528 · Granted Aug 8, 2023

Light-emitting diode device and method for manufacturing the same

Inventors: Jiangbin Zeng (Xiamen, CN); Anhe He (Xiamen, CN); Ling-yuan Hong (Xiamen, CN); Kang-Wei Peng (Xiamen, CN); Su-hui Lin (Xiamen, CN); Chia-Hung Chang (Xiamen, CN)
H01L33/22H01L33/005H01L33/10H01L33/382H01L2933/0016
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Quick Facts
Patent No.
US 11,721,789
App. No.
17/806,528
Granted
Aug 8, 2023
Kind
B2
Abstract

A light-emitting diode (LED) device includes a substrate, an epitaxial layered structure disposed on the substrate, a current-spreading layer disposed on the epitaxial layered structure, a current-blocking unit disposed on the current-spreading layer, and a distributed Bragg reflector. The epitaxial layered structure, the current-spreading layer and the current-blocking unit are covered by the distributed Bragg reflector. One of the current-spreading layer, the current-blocking unit, and a combination thereof has a patterned rough structure. A method for manufacturing the LED device is also disclosed.

Claims (25)

1. A light-emitting diode device, comprising:

a substrate;

an epitaxial layered structure which includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer sequentially formed on said substrate in such order, and which is formed with an indentation extending through said second-type semiconductor layer and said active layer and terminating at said first-type semiconductor layer to expose a portion of said first-type semiconductor layer;

a first current-blocking layer formed on said epitaxial layered structure opposite to said substrate;

a current-spreading layer which is disposed on said epitaxial layered structure opposite to said substrate, which is disposed over said first current-blocking layer, and which is connected to said epitaxial layered structure;

a second current-blocking layer which is formed on said current-spreading layer opposite to said epitaxial layered structure; and

a distributed Bragg reflector which covers said epitaxial layered structure, said current-spreading layer, and said second current-blocking layer.

2. The light-emitting diode device according to claim 1 , wherein a width of said second current-blocking layer is larger than a width of said first current-blocking layer.

3. The light-emitting diode device according to claim 1 , wherein an area of said second current-blocking layer is larger than an area of said first current-blocking layer.

4. The light-emitting diode device according to claim 3 , wherein said first current-blocking layer is made of a material having a relatively low refractive index, and said second current-blocking layer is made of a material having a relatively high refractive index.

5. The light-emitting diode device according to claim 1 , wherein said distributed Bragg reflector has a thickness of not less than 3 μm.

6. The light-emitting diode according to claim 1 , wherein said second current-blocking layer is formed with an opening, and said light-emitting diode further includes a first electrode unit that contains a first electrode disposed on said current-spreading layer and extending into said opening of said second current-blocking layer.

7. The light-emitting diode according to claim 1 , wherein said distributed Bragg reflector is formed with a first through hole, and said light-emitting diode further includes a first electrode unit that contains a second electrode being formed in said first through hole and being electrically connected to said current-spreading layer.

8. The light-emitting diode device according to claim 6 , wherein said first current-blocking layer is under said first electrode unit, and said second current-blocking layer surrounds said first electrode of said first electrode unit.

9. The light-emitting diode according to claim 1 , wherein one of said current-spreading layer, said first current-blocking layer, said second current-blocking layer and a combination thereof has an upper surface with a patterned rough structure.

10. The light-emitting diode according to claim 9 , wherein said second current-blocking layer has said upper surface with said patterned rough structure, each of said first current-blocking layer and said current-spreading layer has a smooth upper surface.

11. The light-emitting diode according to claim 6 , wherein said first current-blocking layer is under said first electrode unit.

12. The light-emitting diode according to claim 6 , wherein said distributed Bragg reflector is formed with a first through hole, and said first electrode unit further contains a second electrode disposed on said distributed Bragg reflector and electrically connected to said first electrode through said first through hole.

13. The light-emitting diode according to claim 12 , wherein said distributed Bragg reflector is formed with a second through hole, and said light-emitting diode further includes a second electrode unit disposed on said distributed Bragg reflector and electrically connected to said first-type semiconductor layer through said second through hole.

14. The light-emitting diode device according to claim 10 , wherein said patterned rough structure has a plurality of protrusions that protrude in a direction away from said epitaxial layered structure.

15. The light-emitting diode device according to claim 14 , wherein each of said protrusions is one of a hemispherical protrusion, a conical protrusion, and a frustoconical protrusion.

16. The light-emitting diode device according to claim 15 , wherein a projection of each of said protrusions on said epitaxial layered structure has a diameter of not greater than 50 μm.

17. The light-emitting diode device according to claim 14 , wherein each of said protrusions has a height of not less than 100 nm.

18. The light-emitting diode device according to claim 14 , wherein a distance between two adjacent ones of said protrusions is not greater than 20 μm.

19. The light-emitting diode device according to claim 14 , wherein said current-spreading layer is transparent.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065667/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2022
From: ZENG, JIANGBIN; HE, ANHE; HONG, LING-YUAN; PENG, KANG-WEI; LIN, SU-HUI; CHANG, CHIA-HUNG
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 061062/0951 →
Priority Claims (1)
CN 201810216614.1 · Mar 16, 2018 · national
Continuity (3)
Continuation 17019857 · Sep 14, 2020
Continuation In Part PCTCN2019072021 · Jan 16, 2019
Related Publication 20220302345A1 · Sep 22, 2022