Semiconductor memory device
A semiconductor memory device includes: first pad transmitting and receiving first timing signal; second pad transmitting and receiving data signal in response to the first timing signal; third pad receiving second timing signal; fourth pad receiving control information in response to the second timing signal; memory cell array; sense amplifier connected to the memory cell array; first register connected to the sense amplifier; second register storing first control information; third register storing second control information; and control circuit executing data-out operation. The first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles, and the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles.
1. A semiconductor memory device comprising:
a first pad being capable of transmitting and receiving a first timing signal;
a second pad being capable of transmitting and receiving a data signal in response to the first timing signal;
a third pad being capable of receiving a second timing signal;
a fourth pad being capable of receiving control information in response to the second timing signal;
a memory cell array including a string in which a plurality of memory cell transistors are connected in series;
a sense amplifier connected to the memory cell array;
a first register connected to the sense amplifier and being capable of storing data read from the memory cell array;
a second register being capable of storing first control information;
a third register being capable of storing second control information; and
a control circuit being capable of executing a data-out operation of outputting the data stored in the first register from the first pad, wherein
the first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles (i is an integer of two or more), and
the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles (j is an integer different from i).
2. The semiconductor memory device according to claim 1 , wherein
the fourth pad includes:
a command latch enable signal receiving pad; and
an address latch enable signal receiving pad, wherein
j is an integer larger than i.
3. The semiconductor memory device according to claim 1 , wherein
the fourth pad includes:
a command latch enable signal receiving pad;
an address latch enable signal receiving pad; and
at least one of a chip enable signal receiving pad or a write protect signal receiving pad.
4. The semiconductor memory device according to claim 2 , wherein
the first control information includes a command signal or an address signal,
the second control information includes characteristic data information,
the second register includes a command register or an address register, and
the third register includes a characteristic register.
5. The semiconductor memory device according to claim 4 , further comprising:
a first receiver and a first driver that are connected to the second pad; and
a second receiver and a second driver that are connected to the fourth pad, wherein
the first driver outputs the data stored in the first register to the first pad in the data-out operation, and
the second driver outputs the characteristic data information stored in the characteristic register to the fourth pad in a characteristic information output operation.
6. The semiconductor memory device according to claim 5 , further comprising
a fourth register storing status information, wherein
the second driver outputs the status information stored in the fourth register to the fourth pad in a status information output operation.
7. The semiconductor memory device according to claim 6 , further comprising:
a fifth pad that receives a third timing signal; and
a receiving unit that receives a trigger signal and outputs an output start signal, wherein
the trigger signal is transferred to the receiving unit based on an input to the fourth pad in response to the second timing signal consisting of k cycles,
after a command set that instructs an output of the data stored in the first register is accepted, and
after the receiving unit outputs the output start signal,
the first driver outputs the data to the second pad in response to the third timing signal input to the fifth pad, and
after the command set that instructs an output of the data stored in the first register is accepted, and
before the receiving unit outputs the output start signal,
the first driver does not output the data to the second pad even when the third timing signal is input to the fifth pad.
8. The semiconductor memory device according to claim 1 , wherein
the first control information includes a command signal, and
the semiconductor memory device further comprises:
a first command processing unit that processes a first command signal; and
a second command processing unit that processes a second command signal.
9. The semiconductor memory device according to claim 1 , further comprising
a deserializer connected between the fourth pad and the second register and between the fourth pad and the third register.
10. A semiconductor memory device comprising:
a first pad being capable of transmitting and receiving a first timing signal;
a second pad being capable of transmitting and receiving a data signal in response to the first timing signal;
a third pad being capable of receiving a second timing signal;
a fourth pad being capable of receiving control information in response to the second timing signal;
a memory cell array including a string in which a plurality of memory cell transistors are connected in series;
a sense amplifier connected to the memory cell array;
a first register connected to the sense amplifier and being capable of storing data read from the memory cell array;
a second register being capable of storing first control information;
a third register being capable of storing second control information; and
a control circuit being capable of executing a data-out operation of outputting the data stored in the first register from the first pad, wherein
the received control information is stored in one of the second register and the third register based on an input to the fourth pad in response to the second timing signal consisting of i cycles (i is an integer of two or more), and
the received control information is stored in the one of the second register and the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles (j is an integer smaller than i) following the i cycles.
11. The semiconductor memory device according to claim 10 , wherein
the first control information includes a command signal, and
the semiconductor memory device further comprises:
a first command processing unit that processes a first command signal; and
a second command processing unit that processes a second command signal.
12. The semiconductor memory device according to claim 10 , wherein
the fourth pad includes:
a command latch enable signal receiving pad; and
an address latch enable signal receiving pad.
13. The semiconductor memory device according to claim 12 , wherein
the fourth pad includes at least one of a chip enable signal receiving pad or a write protect signal receiving pad.
14. The semiconductor memory device according to claim 10 , wherein
the first control information includes a command signal,
the second control information includes an address signal,
the second register includes a command register, and
the third register includes an address register.
15. The semiconductor memory device according to claim 10 , further comprising:
a first receiver and a first driver that are connected to the second pad; and
a second receiver and a second driver that are connected to the fourth pad, wherein
the first driver outputs the data stored in the first register to the first pad in the data-out operation.
16. The semiconductor memory device according to claim 15 , further comprising
a fourth register storing status information, wherein
the second driver outputs the status information stored in the fourth register to the fourth pad in a status information output operation.
17. The semiconductor memory device according to claim 16 , further comprising:
a fifth pad that receives a third timing signal; and
a receiving unit that receives a trigger signal and outputs an output start signal, wherein
the trigger signal is transferred to the receiving unit based on an input to the fourth pad in response to the second timing signal consisting of k cycles,
after a command set that instructs an output of the data stored in the first register is accepted, and
after the receiving unit outputs the output start signal,
the first driver outputs the data to the second pad in response to the third timing signal input to the fifth pad, and
after the command set that instructs an output of the data stored in the first register is accepted, and
before the receiving unit outputs the output start signal,
the first driver does not output the data to the second pad even when the third timing signal is input to the fifth pad.
18. The semiconductor memory device according to claim 10 , further comprising
a deserializer connected between the fourth pad and the second register and between the fourth pad and the third register.