Printed circuit board configuration blocks and edge projections
Examples of printed circuit boards (PCBs) with board configuration blocks and board edge projections are described. In one example, a PCB includes a core material and a metal layer comprising a plurality of metal traces on the core material. The plurality of metal traces can include component interconnect traces and a board configuration block. The board configuration block can include a plan diagram for the PCB, an operational diagram for the PCB, or a combination of plan and operational diagrams. In other examples, a PCB can include a core material having a peripheral edge. The peripheral edge can include one or more board edge scheme projections positioned within projection edge regions of the peripheral edge. The scheme projections have a projection shape based on operational characteristics for the PCB. In some cases, the board configuration blocks can be located on the board edge scheme projections.
1. A printed circuit board, comprising:
a core material; and
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block, wherein the board configuration block comprises a plan diagram for the printed circuit board.
2. The printed circuit board according to claim 1 , wherein the board configuration block comprises the plan diagram and an operational diagram for the printed circuit board.
3. The printed circuit board according to claim 1 , wherein the plurality of metal traces further comprise a board reference indicator trace.
4. The printed circuit board according to claim 3 , wherein:
the plan diagram comprises a plan component trace and a plan reference trace within a region on the printed circuit board; and
the board reference indicator trace is positioned outside the region on the printed circuit board.
5. The printed circuit board according to claim 4 , the plan reference trace in the region corresponds to the board reference indicator trace outside the region.
6. A printed circuit board, comprising:
a core material; and
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block, wherein the board configuration block comprises an operational diagram for the printed circuit board.
7. The printed circuit board according to claim 6 , wherein the operational diagram comprises a block diagram of an operational characteristic for the printed circuit board.
8. The printed circuit board according to claim 7 , wherein the operational diagram comprises a switched filter bank block diagram, a switch block diagram, or a signal chain block diagram.
9. A printed circuit board, comprising:
a core material; and
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block, wherein:
the board configuration block is positioned within a region on the printed circuit board;
the board configuration block comprises a signal chain block diagram;
the signal chain block diagram comprises a diagram input reference trace, a diagram output reference trace, and a diagram intermediate reference trace between the diagram input reference trace and the diagram output reference trace in the signal chain block diagram;
the plurality of metal traces further comprise a board reference indicator trace positioned outside the region on the printed circuit board; and
the diagram intermediate reference trace in the region corresponds to the board reference indicator trace outside the region.
10. A printed circuit board, comprising:
a core material;
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block; and
a solder mask, the solder mask comprising a first region comprising pigment and a second region free from the pigment, wherein the board configuration block is positioned within the second region.
11. A printed circuit board, comprising:
a core material;
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block; and
a solder mask, the solder mask comprising a first region comprising a first pigment and a second region comprising a second pigment, wherein the board configuration block is positioned within the second region.
12. The printed circuit board according to claim 1 , further comprising:
a solder mask, the solder mask comprising a board mask reference indicator, wherein:
the board configuration block further comprises a plan reference trace; and
the plan reference trace of the board configuration block corresponds to the board mask reference indicator of the solder mask.
13. The printed circuit board according to claim 1 , wherein:
the plan diagram comprises a plurality of plan component traces; and
relative positions of the plurality of plan component traces in the plan diagram correspond to relative positions of a plurality of components connected to the component interconnect traces on the printed circuit board.
14. A printed circuit board, comprising:
a core material; and
a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces, a board reference indicator trace, and a board configuration block, wherein:
the board configuration block comprises a plan component trace and a plan reference trace within a region on the printed circuit board;
the board reference indicator trace is positioned outside the region on the printed circuit board; and
the plan reference trace in the region corresponds to the board reference indicator trace outside the region.
15. The printed circuit board according to claim 14 , wherein the board configuration block further comprises an operational diagram for the printed circuit board, the operational diagram comprising a switched filter bank block diagram, a switch block diagram, or a signal chain block diagram.
16. A printed circuit board, comprising:
a core material comprising a peripheral edge, the peripheral edge comprising a board edge scheme projection positioned along a projection edge region of the peripheral edge.
17. The printed circuit board according to claim 16 , wherein the board edge scheme projection includes a projection shape based on an operational characteristic for the printed circuit board.
18. The printed circuit board according to claim 16 , wherein the board edge scheme projection includes a projection shape based on a filter operational characteristic for the printed circuit board, an amplifier operational characteristic, or a step attenuator operational characteristic for the printed circuit board.
19. A printed circuit board, comprising:
a core material comprising a peripheral edge, the peripheral edge comprising a board edge scheme projection positioned along a projection edge region of the peripheral edge, wherein the core material further comprises a board scheme cutout that extends through the core material within the peripheral edge of the printed circuit board.
20. A printed circuit board, comprising:
a core material comprising a peripheral edge, the peripheral edge comprising a board edge scheme projection positioned along a projection edge region of the peripheral edge; and
a solder mask, the solder mask comprising a first region comprising pigment and a second region free from the pigment, wherein the board edge scheme projection is positioned within the second region.