Electromagnetic waveguiding through liquid cooling conduit
A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.
1. A multi-chip package structure comprising:
a first IC chip and a second IC chip;
a fluid conduit thermally coupled to the first IC chip and the second IC chip, and configured to circulate fluid and remove heat generated by at least one of the first IC chip and the second IC chip, the fluid conduit having a first end and a second end opposite to the first end;
a first monopole feed connected between the first IC chip and the first end of the fluid conduit; and
a second monopole feed connected between the second IC chip and the second end of the fluid conduit,
wherein the first monopole feed is configured to transmit electromagnetic signals through the fluid conduit.
2. The multi-chip package structure of claim 1 , wherein the second monopole feed is configured to receive the electromagnetic signals.
3. The multi-chip package structure of claim 1 , wherein the fluid conduit includes a first mesh signal reflector at the first end and a second mesh signal reflector at the second end.
4. The multi-chip package structure of claim 3 , wherein the first mesh signal reflector and the second mesh signal reflector include a plurality of holes.
5. The multi-chip package structure of claim 4 , wherein the holes are spaced periodically at a given pitch so that the electromagnetic signals emitted from the first monopole feed at an operating frequency only propagate toward a direction of the second monopole feed.
6. The multi-chip package structure of claim 4 , wherein the holes are configured and sized to reflect the electromagnetic signals and to allow a cooling fluid to flow therethrough.
7. The multi-chip package structure of claim 4 , wherein the holes are arranged in rows and columns.
8. The multi-chip package structure of claim 1 , further comprising:
a first processor package connected to the first IC chip, the first monopole feed being connected to the first processor package; and
a second processor package connected to the second IC chip, the second monopole feed being connected to the second processor package.
9. The multi-chip package structure of claim 1 , wherein a cross-sectional shape of the fluid conduit is circular.
10. The multi-chip package structure of claim 1 , wherein the first IC chip and the second IC are mounted on a processor card.
11. The multi-chip package structure of claim 3 , further comprising:
a first signal carrying wire connected to the first monopole feed and inserted into the fluid conduit; and
a second signal carrying wire connected to the second monopole feed and inserted into the fluid conduit.
12. The multi-chip package structure of claim 11 , wherein the first signal carrying wire is positioned at a specified distance from the first mesh signal reflector to enable the electromagnetic signals to propagate from the first end of the fluid conduit to the second end of the fluid conduit.