Film structure puncture testing tool and method

1. A film puncture testing tool for testing resistance to puncturing of a film structure for a product package, said film puncture testing tool comprising:

a mold insertable into a product package and including a slot; and

an insert positioned in the slot in an orientation extending outwardly of the slot to simulate an object in the product package.

2. The film puncture testing tool of claim 1 wherein the mold fills the product package.

3. The film puncture testing tool of claim 1 wherein the insert has a pointed end.

4. The film puncture testing tool of claim 1 and further including a plurality of slots.

5. The film puncture testing tool of claim 4 wherein the plurality of slots have varying depths.

6. The film puncture testing tool of claim 4 wherein the plurality of slots have the same depth.

7. The film puncture testing tool of claim 1 and including a plurality of inserts.

8. The film puncture testing tool of claim 7 wherein the plurality of inserts are of differing dimensions.

9. A film puncture testing tool for testing resistance to puncturing of a film structure for a product package, said film puncture testing tool comprising:

a mold insertable into a product package; and

an insert extending outwardly from the mold so that a film structure to be tested can be sealed to the product package over the mold and the insert.

10. The film puncture testing tool of claim 9 and further including a plurality of inserts.

11. A film puncture testing tool for testing resistance to puncturing of a film structure for a product package, said film puncture testing tool comprising:

a mold insertable into a product package, the mold having a plurality of slots; and

a plurality of inserts, each positionable in a slot in an orientation extending outwardly of the mold.

12. The film puncture testing tool of claim 11 wherein the plurality of inserts are the same size.

13. The film puncture testing tool of claim 11 wherein the plurality of inserts are of differing sizes.

14. A method for testing the resistance of a film structure on product package to puncturing, said method including the steps:

inserting a mold having a slot into a product package;

inserting an insert into the slot, the insert extending outwardly from the mold; and

covering the mold and the insert with a film structure to be tested.

15. The method of claim 14 wherein the mold includes a plurality of slots.

16. The method of claim 15 wherein in the inserting step, a plurality of inserts are inserted into the plurality of slots.

17. The method of claim 14 wherein in the covering step, the film structure is sealed to the product package.

18. A method for testing the resistance of a film structure on product package to puncturing, said method including the steps:

inserting a mold into a product package, the mold having a portion adapted to simulate an object in the product package; and

covering the mold and the insert with a film structure to be tested.