IP Library › Granted Patent US 12,237,599
Granted Patent B2
US 12,237,599 · App. 17/814,705 · Granted Feb 25, 2025

Socket

Inventor: Toshiyasu Ito (Tokyo, JP)
Assignees: YAMAICHI ELECTRONICS CO., LTD.; Huawei Technologies Co., Ltd.
H01R12/707H01R13/11
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Quick Facts
Patent No.
US 12,237,599
App. No.
17/814,705
Granted
Feb 25, 2025
Kind
B2
Abstract

A socket includes a housing and a plurality of contacts. The housing is formed in a box-shape with an opening and is provided with a matrix of through holes at a bottom portion. The plurality of contacts includes ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of them and are passed through the through holes. The ground contacts adjacent to each other in the array direction are short-circuited.

Claims (53)

1. A socket, comprising:

a housing which is formed in a box-shape with an opening and provided with a matrix of through holes at a bottom portion; and

a plurality of contacts comprising ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of the contacts and are passed through the through holes,

wherein

the ground contacts adjacent to each other in the array direction are short-circuited,

connecting portions connecting a plurality of ground contacts adjacent to each other in the array direction are provided to the contacts,

and wherein

the connecting portion is a bar extending in the array direction, and

the bar is fixed to the plurality of ground contacts adjacent to each other in the array direction in such a manner that a rear surface of the bar is in contact with corresponding surfaces of the adjacent ground contacts.

2. The socket according to claim 1 , wherein

each of the ground contacts and signal contacts comprises:

a contact point portion in contact with a substrate of an external communication partner; a spring portion extending from an end portion of the contact point portion;

an insertion portion bent and extending from an end portion of the spring portion and inserted into the through hole; and

a soldered portion soldered to be attached to an external substrate at an end portion of the insertion portion, and

a width in the array direction of the contact point portion of the ground contact is wider than a width in the array direction of the contact point portions of the signal contacts.

3. The socket according to claim 1 , wherein

each of the ground contacts and signal contacts comprises:

a contact point portion in contact with a substrate of an external communication partner;

a spring portion extending from an end portion of the contact point portion;

an insertion portion which is bent and extends from an end portion of the spring portion and is inserted into the through hole; and

a soldered portion soldered to be attached to an external substrate at an end portion of the insertion portion, and

a width in the array direction of the spring portion of the ground contact is narrower than a width in the array direction of the spring portions of the signal contacts.

4. The socket according to claim 1 , wherein

each of the ground contacts and signal contacts comprises:

a contact point portion in contact with a substrate of an external communication partner;

a spring portion extending from an end portion of the contact point portion;

an insertion portion which is bent and extends from an end portion of the spring portion and is inserted into the through hole; and

a soldered portion connected to an end portion of the insertion portion and soldered to be attached to an external substrate, and

a width in the array direction of the insertion portion of the ground contact is narrower than a width in the array direction of the insertion portions of the signal contacts.

5. The socket according to claim 1 , wherein

each of the ground contacts and signal contacts comprises:

a contact point portion in contact with a substrate of an external communication partner;

a spring portion extending from an end portion of the contact point portion;

an insertion portion which is bent and extends from an end portion of the spring portion and is inserted into the through hole; and

a soldered portion soldered to be attached to an external substrate at an end portion of the insertion portion,

a width in the array direction of the contact point portion of the ground contact is wider than a width in the array direction of the contact point portions of the signal contacts,

a width in the array direction of the spring portion of the ground contact is narrower than a width in the array direction of the spring portions of the signal contacts,

and width in the array direction of the insertion portion of the ground contact is narrower than a width in the array direction of the insertion portions of the signal contacts.

6. The socket according to claim 1 , wherein

the connecting portion connects the insertion portions of the plurality of ground contacts adjacent to each other in the array direction.

7. The socket according to claim 1 , wherein

the bar is bent into an approximate U-shape so as to avoid the signal contacts.

8. The socket according to claim 1 , wherein

the ground contact comprises a round hole,

the bar is made of metal and comprises a plurality of protrusion portions protruding from one surface of the bar,

the plurality of protrusion portions of the connecting portion are fitted into the round holes of the plurality of ground contacts adjacent to each other in the array direction.

9. The socket according to claim 1 , wherein

of the signal contacts, pair of two adjacent signal contacts form one channel of high-speed differential transmission,

respective pairs of the signal contacts are arranged apart in the array direction and an orthogonal direction orthogonal to the array direction, and

the ground contacts are arranged at adjacent positions in the array direction and adjacent positions in the orthogonal direction in each pair of the signal contacts so as to surround the pair.

10. The socket according to claim 1 , further comprising an insulating member extending in one direction,

wherein the contacts aligned in the array direction are inserted into the insulating member, and

the insulating member is bridged between opposing wall portions of the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2022
From: ITO, TOSHIYASU
To: YAMAICHI ELECTRONICS CO., LTD.; HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 060608/0593 →
Priority Claims (1)
CN 202110852075.2 · Jul 27, 2021 · national
Continuity (1)
Related Publication 20230029598A1 · Feb 2, 2023
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