Cooling systems and methods for use in data centers
A system includes one or more modular hot aisle cooling units (MHACUs) disposed in a data hall, each MHACU configured to cool one or more servers in the data hall. The system also includes a fluid cooler configured to receive the heated fluid from the one or more MHACUs, cool the heated fluid into cooled fluid, and output the cooled fluid. The system also includes a fluid supply line configured to convey the cooled fluid to the one or more MHACUs in order to cool heated air inside the data hall. The system also includes a pump package configured to control a flow of the heated fluid and the cooled fluid. The fluid cooler, the one or more MHACUs, and the pump package form a single fluid loop.
1. A system comprising:
one or more modular hot aisle cooling units (MHACUs) disposed in a data hall, each MHACU configured to cool one or more servers in the data hall;
a fluid cooler configured to receive heated fluid from the one or more MHACUs, cool the heated fluid into cooled fluid, and output the cooled fluid;
a fluid supply line configured to convey the cooled fluid to the one or more MHACUs in order to cool heated air inside the data hall;
a pump package configured to control a flow of the heated fluid and the cooled fluid; and
a trim chiller configured to additionally cool the cooled fluid as the cooled fluid is output from the fluid cooler, the trim chiller comprising a refrigeration loop configured to transfer thermal energy from the cooled fluid to the heated fluid that is received from the one or more MHACUs,
wherein the fluid cooler, the one or more MHACUs, and the pump package form a single fluid loop.
2. The system of claim 1 , wherein:
the fluid cooler comprises a first coil and a second coil,
the second coil is configured to cool the heated fluid as the heated fluid passes through the second coil,
the first coil is configured to additionally cool the heated fluid as the heated fluid passes through the first coil after passing through the second coil,
the first coil and the second coil are disposed together in a common air stream, wherein air flows through the first coil and then through the second coil.
3. The system of claim 2 , wherein the fluid cooler further comprises:
one or more variable speed fans configured to control the common air stream.
4. The system of claim 2 , wherein the fluid cooler further comprises:
multiple spray nozzles configured to spray water over the first coil while the heated fluid passes through the first coil, the sprayed water providing evaporative cooling of the air stream.
5. The system of claim 4 , wherein the fluid cooler further comprises:
a moisture eliminator structure disposed between the first coil and the second coil, the moisture eliminator structure configured to prevent the sprayed water from reaching the second coil.
6. The system of claim 4 , wherein the fluid cooler further comprises:
a computing device configured to control the spraying of the water over the first coil based on at least one of: an ambient dry bulb temperature around the fluid cooler, and a cooling load of the cooled fluid.
7. The system of claim 1 , wherein the pump package is disposed downstream from the one or more MHACUs and upstream from the fluid cooler.
8. A method comprising:
receiving, at a fluid cooler, heated fluid from one or more modular hot aisle cooling units (MHACUs) disposed in a data hall, each MHACU configured to cool one or more servers in the data hall;
cooling the heated fluid into cooled fluid at the fluid cooler, wherein cooling the heated fluid into the cooled fluid at the fluid cooler comprises:
cooling the heated fluid in a second coil of the fluid cooler as the heated fluid passes through the second coil;
spraying second water over the second coil using second spray nozzles while the heated fluid passes through the second coil, the second sprayed water providing evaporative cooling of air flow through the second coil;
additionally cooling the heated fluid in a first coil of the fluid cooler as the heated fluid passes through the first coil after passing through the second coil; and
spraying first water over the first coil using first spray nozzles while the heated fluid passes through the first coil, the first sprayed water providing evaporative cooling of air flow through the first coil, wherein the first coil and the second coil are disposed together in a common air stream and wherein air flows through the first coil and then through the second coil;
outputting the cooled fluid from the fluid cooler;
conveying the cooled fluid to the one or more MHACUs in order to cool heated air inside the data hall; and
controlling a flow of the heated fluid and the cooled fluid using a pump package,
wherein the fluid cooler, the one or more MHACUs, and the pump package form a single fluid loop.
9. The method of claim 8 , further comprising:
controlling the common air stream using one or more variable speed fans.
10. The method of claim 8 , further comprising:
a basin positioned beneath both the first and second coils and positioned to collect the first and second sprayed water;
a first pump configured to return a portion of the collected water to the first spray nozzles; and
a second pump configured to return another portion of the collected water to the second spray nozzles.
11. The method of claim 8 , wherein a moisture eliminator structure is disposed between the first coil and the second coil, the moisture eliminator structure configured to prevent the first sprayed water from reaching the second coil.
12. The method of claim 8 , further comprising:
controlling the spraying of the first water over the first coil based on at least one of: an ambient dry bulb temperature around the fluid cooler, and a cooling load of the cooled fluid.
13. The method of claim 8 , further comprising:
additionally cooling the cooled fluid using a trim chiller after outputting the cooled fluid from the fluid cooler.
14. The method of claim 13 , wherein the trim chiller comprises a refrigeration loop configured to transfer thermal energy from the cooled fluid to the heated fluid that is received from the one or more MHACUs.
15. The method of claim 8 , wherein the pump package is disposed downstream from the one or more MHACUs and upstream from the fluid cooler.
16. A cooler comprising:
a first coil;
a second coil;
first spray nozzles;
second spray nozzles; and
a fluid supply line provided to couple the first coil and the second coil together in series,
wherein:
the second coil is configured to receive heated fluid conveyed through the fluid supply line from outside the cooler, and cool the heated fluid into cooled fluid as the heated fluid passes through the second coil,
the second spray nozzles are configured to second spray water over the second coil while the heated fluid passes through the second coil, the second sprayed water providing evaporative cooling of air flow through the second coil,
the first coil is configured to additionally cool the cooled fluid as the cooled fluid passes through the first coil after passing through the second coil,
the first spray nozzles configured to spray first water over the first coil while the heated fluid passes through the first coil, the sprayed first water providing evaporative cooling of air flow through the first coil,
the fluid supply line is configured to convey the cooled fluid outside the cooler after the cooled fluid passes through the first coil, and
the first coil and the second coil are disposed together in a common air stream, wherein air flows through the first coil and then through the second coil.
17. The cooler of claim 16 , further comprising:
one or more variable speed fans configured to control the common air stream; and
a computing device configured to control the spraying of the first water over the first coil based on at least one of: an ambient dry bulb temperature around the cooler, and a cooling load of the cooled fluid.
18. The cooler of claim 16 , further comprising:
a moisture eliminator structure disposed between the first coil and the second coil, the moisture eliminator structure configured to prevent the first sprayed water from reaching the second coil.
19. The cooler of claim 16 , further comprising:
a basin positioned beneath both the first and second coils and positioned to collect the first and second sprayed water;
a first pump configured to return a portion of the collected water to the first spray nozzles; and
a second pump configured to return another portion of the collected water to the second spray nozzles.
20. A system comprising the cooler of claim 16 and further comprising:
a trim chiller configured to additionally cool the cooled fluid as the cooled fluid is output from the cooler, the trim chiller comprising a refrigeration loop configured to transfer thermal energy from the cooled fluid to the heated fluid that is received by the cooler.