Methods of installing a purge fluid conditioning element into a semiconductor substrate carrying container
Methods of installing a purge fluid conditioning element into an interior space of a semiconductor substrate carrying container are described. The purge fluid conditioning element is installed from outside the semiconductor substrate carrying container through a port formed in one of the walls of the container, where the port is sized to permit the purge fluid conditioning element to be inserted into the interior space of the container by installing the purge fluid conditioning element through the port. The wall may be a bottom wall of the container or another wall of the container. The described methods eliminate the need to install the purge fluid conditioning element from the inside of the container which can cause human contamination of the interior environment of the container.
1. A method comprising installing a purge fluid conditioning element having a base portion and a conditioning portion into an interior space of a semiconductor substrate carrying container that includes a plurality of walls that define the interior space and that has an opening that is sized to permit a semiconductor substrate to be inserted into and removed from the interior space, wherein installing the purge fluid conditioning element comprises installing the purge fluid conditioning element from outside the semiconductor substrate carrying container and through a port formed in one of the walls.
2. The method of claim 1 , wherein the plurality of walls includes a bottom wall and the port is formed in the bottom wall whereby the purge fluid conditioning element is installed from outside the semiconductor substrate carrying container through the port formed in the bottom wall.
3. The method of claim 1 , wherein the semiconductor substrate carrying container comprises a front opening unified pod.
4. The method of claim 1 , wherein the purge fluid conditioning element comprises a diffuser, a getter, or a filter.
5. The method of claim 1 , comprising installing the purge fluid conditioning element into the interior space without a semiconductor substrate being present in the interior space.
6. The method of claim 1 , comprising installing the purge fluid conditioning element into the interior space while at least one semiconductor substrate is present in the interior space.
7. The method of claim 1 , wherein the semiconductor substrate comprises a wafer or a flat panel, and the interior space of the semiconductor substrate carrying container is sized to receive a plurality of the wafers or flat panels therein.
8. A method comprising installing a purge fluid conditioning element having a base portion and a conditioning portion into an interior space of a semiconductor substrate carrying container by inserting the purge fluid conditioning element through a purge port formed in a bottom wall of a shell of the semiconductor substrate carrying container from outside the semiconductor substrate carrying container.
9. The method of claim 8 , wherein the interior space of the semiconductor substrate carrying container is sized to receive a plurality of wafers or flat panels therein.
10. The method of claim 8 , wherein the semiconductor substrate carrying container comprises a front opening unified pod.
11. The method of claim 8 , wherein the purge fluid conditioning element comprises a diffuser, a getter, or a filter.
12. The method of claim 8 , comprising installing the purge fluid conditioning element into the interior space without a semiconductor substrate being present in the interior space.
13. The method of claim 8 , comprising installing the purge fluid conditioning element into the interior space while at least one semiconductor substrate is present in the interior space.
14. A method comprising installing a purge fluid conditioning element having a base portion and a conditioning portion into an interior space of a semiconductor substrate carrying container while at least one semiconductor substrate is present in the interior space.
15. The method of claim 14 , comprising installing the purge fluid conditioning element from outside the semiconductor substrate carrying container through a port formed in a wall of the semiconductor substrate carrying container.
16. The method of claim 15 , wherein the wall comprises a bottom wall.
17. The method of claim 14 , wherein the semiconductor substrate carrying container comprises a front opening unified pod.
18. The method of claim 14 , wherein the purge fluid conditioning element comprises a diffuser, a getter, or a filter.
19. The method of claim 14 , comprising installing the purge fluid conditioning element into the interior space of the semiconductor substrate carrying container while a plurality of the semiconductor substrates are present in the interior space.