IP Library › Granted Patent US 11,997,783
Granted Patent B2
US 11,997,783 · App. 17/827,546 · Granted May 28, 2024

Electronic devices

Inventors: Po-An Lin (Kaohsiung, TW); Huei-Shyong Cho (Kaohsiung, TW); Shih-Wen Lu (Kaohsiung, TW)
Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H05K1/024H05K1/16H05K2201/10098
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Quick Facts
Patent No.
US 11,997,783
App. No.
17/827,546
Granted
May 28, 2024
Kind
B2
Abstract

The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.

Claims (15)

1. An electronic device, comprising:

a first insulating layer having a first dielectric constant;

a first antenna pattern at least partially disposed over the first insulating layer;

a second insulating layer disposed over the first insulating layer and having a second dielectric constant;

a second antenna pattern at least partially disposed over the second insulating layer;

a circuit structure comprising a third insulating layer which has a third dielectric constant,

wherein a difference between the first dielectric constant and the third dielectric constant is less than a difference between the first dielectric constant and the second dielectric constant;

a first antenna component comprising the first insulating layer and the first antenna pattern, wherein the first antenna component is connected to the circuit structure through a bonding layer; and

a second antenna component comprising the second insulating layer and the second antenna pattern, wherein the second antenna component is connected to the first antenna component through a solder material.

2. The electronic device of claim 1 , further comprising:

a conductive element at least partially within the bonding layer and electrically connecting the circuit structure to the first antenna component.

3. The electronic device of claim 2 , wherein the conductive element comprises a conductive filler.

4. The electronic device of claim 1 , wherein the first antenna component further comprises the second insulating layer and the second antenna pattern.

5. The electronic device of claim 1 , wherein the first dielectric constant is less than the second dielectric constant.

6. The electronic device of claim 1 , wherein the first antenna pattern is configured to operate at a first frequency, and the second antenna pattern is configured to operate at a second frequency greater than the first frequency.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2022
From: LIN, PO-AN; CHO, HUEI-SHYONG; LU, SHIH-WEN
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 060103/0031 →
Continuity (1)
Related Publication 20230389173A1 · Nov 30, 2023