Method of manufacturing electric device
Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
1. A method for manufacturing an electronic device, the method comprising:
mapping good elements and defective elements on a substrate;
providing a first transparent structure comprising a first adhesive layer on the substrate;
selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate;
providing a second transparent structure comprising a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate; and
selectively providing second laser light to the new elements to bond the new elements to the substrate.
2. A method for manufacturing an electronic device, the method comprising:
mapping good elements and defective elements on a substrate;
providing a first transparent structure comprising a first adhesive layer on the substrate;
selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate;
providing a second transparent structure comprising a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate; and
selectively providing second laser light to the new elements to bond the new elements to the substrate,
wherein the first laser light comprises ultraviolet light, and
the second laser light comprises infrared light.
3. The method of claim 2 , wherein the first adhesive layer comprises an ultraviolet curable adhesive, and
the second adhesive layer comprises a thermoplastic resin.
4. The method of claim 1 , wherein the first adhesive layer comprises a thermosetting resin, and
the second adhesive layer comprises a thermoplastic resin.
5. The method of claim 1 , wherein the first adhesive layer comprises:
a first lower adhesive layer on the first transparent structure; and
a first upper adhesive layer on the first lower adhesive layer.
6. The method of claim 5 , wherein the first lower adhesive layer comprises a thermosetting resin, and
the first upper adhesive layer comprises a photo-curable resin.
7. The method of claim 5 , wherein the first transparent structure comprises a first heater layer that heats the first lower adhesive layer.
8. The method of claim 1 , wherein the second adhesive layer comprises:
a second lower adhesive layer on the second transparent structure; and
a second upper adhesive layer on the second lower adhesive layer.
9. The method of claim 8 , wherein the second lower adhesive layer comprises a thermoplastic resin, and
the second upper adhesive layer comprises a photo plastic resin.
10. The method of claim 8 , wherein the second transparent structure comprises a second heater layer that heats the second lower adhesive layer.
11. A method for manufacturing an electronic device, the method comprising:
mapping good elements and defective elements on a substrate;
providing a first transparent structure comprising a first adhesive layer on the substrate;
allowing the first adhesive layer to be in contact with the good elements and the defective elements;
selectively providing ultraviolet light to the defective elements to fix the defective elements to the first transparent structure by the first adhesive layer and separate the defective elements from the substrate;
providing a second transparent structure comprising a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate; and
allowing the new elements to be in contact with the substrate; and
selectively providing ultraviolet light or infrared light to the new elements to bond the new elements to the substrate.
12. The method of claim 11 , wherein the first adhesive layer comprises an ultraviolet curable adhesive, and
the second adhesive layer comprises a thermoplastic resin.
13. The method of claim 11 , wherein the first adhesive layer comprises:
a first lower adhesive layer on the first transparent structure; and
a first upper adhesive layer on the first lower adhesive layer.
14. The method of claim 13 , wherein the first lower adhesive layer comprises a thermosetting resin, and
the first upper adhesive layer comprises a photo-curable resin.
15. The method of claim 13 , wherein the first transparent structure comprises a first heater layer that heats the first lower adhesive layer.
16. The method of claim 11 , wherein the second adhesive layer comprises:
a second lower adhesive layer on the second transparent structure; and
a second upper adhesive layer on the second lower adhesive layer.
17. The method of claim 16 , wherein the second lower adhesive layer comprises a thermoplastic resin, and
the second upper adhesive layer comprises a photo plastic resin.
18. The method of claim 16 , wherein the second transparent structure comprises a second heater layer that heats the second lower adhesive layer.
19. The method of claim 11 , wherein each of the first and second transparent structures comprises glass, sapphire, acrylic, polyimide, epoxy, or quartz.
20. The method of claim 11 , wherein each of the good elements and the defective elements comprises a light emitting diode.