Parallel assembly of discrete components onto a substrate

1. A method comprising:

transferring multiple discrete components from a substrate, the discrete components being adhered to the substrate by a dynamic release layer, the transferring including:

individually transferring each of one or more first discrete components from the substrate to a first destination using a first laser-assisted transfer process, the first discrete components not satisfying a quality criterion, wherein the substrate is separated from the first destination by a gap during the transferring; and

transferring multiple second discrete components from the substrate to a second destination using a second laser-assisted transfer process, the second discrete components satisfying the quality criterion, wherein the substrate is separated from the second destination by another gap during the transferring.

2. The method of claim 1 , in which transferring the multiple second discrete components comprises transferring fewer than all of the second discrete components such that one or more second discrete components remain adhered to the substrate.

3. The method of claim 2 , comprising individually transferring each of one or more of the second discrete components that remain adhered to the substrate to the second destination.

4. The method of claim 3 , in which the multiple second discrete components form an array of discrete components at the second destination, and

in which individually transferring each of one or more of the second discrete components that remain comprises transferring each remaining second discrete component to an empty position in the array.

5. The method of claim 1 , in which the second laser-assisted transfer process comprises:

irradiating multiple regions on a top surface of the dynamic release layer, each of the irradiated regions being aligned with a corresponding one of the second discrete components,

in which the irradiation causes the second discrete components to be concurrently released from the substrate.

6. The method of claim 1 , in which the first laser-assisted transfer process comprises, for each of the first discrete components:

irradiating a region on a top surface of the dynamic release layer, the region being aligned with the first discrete component,

in which the irradiation causes the first discrete component to be released from the substrate.

7. The method of claim 1 , comprising reducing an adhesion of the dynamic release layer prior to transferring the one or more first discrete components.

8. The method of claim 7 , in which reducing the adhesion of the dynamic release layer comprises exposing the dynamic release layer to one or more of heat and ultraviolet light.

9. The method of claim 1 , in which the second destination comprises a target substrate, and

in which transferring the multiple second discrete components to the second destination comprises transferring the multiple second discrete components onto attachment elements disposed on a top surface of the target substrate.

10. The method of claim 9 , comprising curing the attachment elements to bond the multiple second discrete components to the target substrate.

11. The method of claim 10 , in which curing the attachment elements comprises exposing the attachment elements to one or more of heat, ultraviolet light, and mechanical pressure.

12. The method of claim 9 , comprising applying the attachment elements to the target substrate.

13. The method of claim 1 , in which the second destination comprises a target substrate, and comprising bonding the transferred second discrete components to the target substrate.

14. The method of claim 1 , in which the second destination comprises a target substrate having circuit components, and

in which the method comprises interconnecting circuit components of the transferred second discrete components to the circuit components of the target substrate.

15. The method of claim 1 , comprising transferring the discrete components from a donor substrate to the substrate.

16. The method of claim 15 , in which transferring the discrete components from the donor substrate to the substrate comprises contacting the dynamic release layer on the substrate to the discrete components on the donor substrate.

17. The method of claim 15 , comprising singulating the discrete components on the donor substrate.

18. The method of claim 15 , in which the donor substrate comprises a dicing tape.

19. The method of claim 15 , in which the donor substrate comprises a wafer.

20. The method of claim 1 , comprising applying the dynamic release layer to the substrate.

21. A method comprising:

transferring discrete components from a carrier substrate to each of multiple target substrates, the discrete components being adhered to the carrier substrate by a dynamic release layer, the transferring including:

transferring a first set of the discrete components to a first target substrate using a laser-assisted transfer process, the discrete components in the first set sharing a first characteristic, wherein the carrier substrate is separated from the first target substrate by a gap during the transferring; and

using the laser-assisted transfer process, transferring a second set of the discrete components to a second target substrate, the discrete components in the second set sharing a second characteristic different from the first characteristic, wherein the carrier substrate is separated from the second target substrate by another gap during the transferring.

22. The method of claim 21 , comprising transferring the discrete components from multiple carrier substrates to the multiple target substrates.

23. The method of claim 22 , comprising transferring the discrete components consecutively from each of the multiple carrier substrates.

24. The method of claim 22 , in which the transferring comprises:

transferring discrete components from a first carrier substrate to one or more of the target substrates in a transfer system;

removing the first carrier substrate from a transfer position in the transfer system;

placing a second carrier substrate in the transfer position; and

transferring discrete components from the second carrier substrate to one or more of the target substrates.

25. The method of claim 21 , in which the transferring comprises:

transferring the first set of the discrete components to the first target substrate in a transfer system;

removing the first target substrate from a transfer position in the transfer system; and

placing the second target substrate in the transfer position for transfer of the second set of the discrete components.

26. The method of claim 21 , in which the discrete components comprise LEDs, and

in which the first and second characteristics comprise one or more of an optical characteristic and an electrical characteristic.

27. The method of claim 21 , in which transferring the first and second sets of discrete components to the first and second target substrates comprises transferring each of the discrete components in the first and second sets individually to the first and second target substrates.

28. The method of claim 21 , in which transferring the first and second sets of discrete components to the first and second target substrates comprises at least one of

concurrently transferring some or all of the discrete components in the first set to the first target substrate, or

concurrently transferring some or all of the discrete components in the second set to the second target substrate.

29. The method of claim 21 , in which transferring a set of discrete components to the corresponding target substrate comprises transferring the discrete components in the set onto a layer of die catching material disposed on a top surface of the target substrate.

30. The method of claim 29 , comprising applying the die catching material to each target substrate.

31. The method of claim 21 , comprising reducing an adhesion of the dynamic release layer.

32. The method of claim 31 , in which reducing the adhesion of the dynamic release layer comprises exposing the dynamic release layer to one or more of heat and ultraviolet light.

33. The method of claim 21 , comprising transferring the discrete components from a donor substrate to the carrier substrate.

34. The method of claim 33 , in which transferring the discrete components from the donor substrate to the carrier substrate comprises contacting the dynamic release layer on the carrier substrate to the discrete components on the donor substrate.

35. The method of claim 33 , in which the donor substrate comprises a dicing tape.

36. The method of claim 33 , in which the donor substrate comprises a wafer.

37. The method of claim 21 , comprising applying the dynamic release layer to the carrier substrate.