Lead-free solder composition
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
1. An electrical assembly, comprising:
an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector; and
a layer of a solder alloy consisting essentially of:
about 15% to 28% indium by weight;
about 5% to 20% zinc by weight;
about 1% to 6% silver by weight; and
a remaining weight of the solder alloy being tin.
2. The electrical assembly according to claim 1 , wherein the solder alloy consists essentially of:
21% to 27% indium by weight;
8% to 10% zinc by weight;
2% to 4% silver by weight; and
a remaining weight of the solder alloy being tin.
3. The electrical assembly according to claim 1 , wherein the solder alloy consists essentially of:
about 24% indium by weight;
about 9% zinc by weight;
about 3% silver by weight; and
a remaining weight of the solder alloy being tin.
4. The electrical assembly according to claim 1 , wherein the second layer is soldered to a silver-based connection pad.
5. The electrical assembly according to claim 4 , wherein the silver-based connection pad is disposed on a glass surface.
6. An electrical assembly, comprising:
an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector and wherein the electrical connector is soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of:
17% to 28% indium by weight;
12% to 20% zinc by weight;
1% to 6% silver by weight; and
a remaining weight of the solder alloy being tin.
7. The electrical assembly according to claim 6 , wherein the solder alloy includes 23% to 26% indium by weight.
8. The electrical assembly according to claim 6 , wherein the solder alloy includes 24% to 26% indium by weight.
9. The electrical assembly according to claim 6 , wherein the solder alloy includes 25% to 26% indium by weight.
10. The electrical assembly according to claim 6 , wherein the solder alloy includes 5.5% to 6% silver by weight.
11. The electrical assembly according to claim 6 , wherein the solder alloy includes 5.75% to 6% silver by weight.
12. An electrical assembly, comprising:
an electrical connector having a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector and wherein the electrical connector is soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of:
17% to 28% indium by weight;
12% to 20% zinc by weight;
1% to 6% silver by weight;
1% to 3% copper by weight; and
a remaining weight of the solder alloy being tin.
13. The electrical assembly according to claim 12 , wherein the solder alloy includes 23% to 26% indium by weight.
14. The electrical assembly according to claim 12 , wherein the solder alloy includes 24% to 26% indium by weight.
15. The electrical assembly according to claim 12 , wherein the solder alloy includes 25% to 26% indium by weight.
16. The electrical assembly according to claim 12 , wherein the solder alloy includes 5.5% to 6% silver by weight.
17. The electrical assembly according to claim 12 , wherein the solder alloy includes 5.75% to 6% silver by weight.