Electromagnetic interference suppression circuit and intelligent electronic device
Provided in the embodiments are an electromagnetic interference suppression circuit and an intelligent electronic device. The electromagnetic interference suppression circuit comprises at least one ferrite bead located at the input port of the circuit, a transient voltage suppression diode, wherein either terminal of the transient voltage suppression diode is connected with the at least one ferrite bead, a resistor network connected with the transient voltage suppression diode, and an optocoupler with an alternating current input response coupled to resistor network.
1. An electromagnetic interference suppression circuit comprising:
at least one ferrite bead disposed at an input port of the circuit;
a transient voltage suppression diode, wherein a terminal of the transient voltage suppression diode is connected with the at least one ferrite bead;
a resistor network connected with the transient voltage suppression diode, wherein the resistor network comprises at least one anti-surge resistor; and
an optocoupler with an alternating current input response coupled to the resistor network.
2. The circuit of claim 1 , wherein the optocoupler is disposed on an integrated chip socket soldered on a printed circuit board.
3. The circuit of claim 1 , wherein the optocoupler comprises a Darlington-connected phototransistor.
4. An intelligent electronic device (IED) comprising an electromagnetic interference suppression circuit, wherein the circuit comprising:
at least one ferrite bead disposed at an input port of the circuit;
a transient voltage suppression diode, wherein either terminal of the transient voltage suppression diode is connected with the at least one ferrite bead;
a resistor network connected with the transient voltage suppression diode, wherein the resistor network comprises at least one anti-surge resistor; and
an optocoupler with an alternating current input response coupled to the resistor network.
5. The device of claim 4 , wherein the optocoupler comprises a Darlington-connected phototransistor.
6. The device of claim 4 , wherein the optocoupler is disposed on an integrated chip socket soldered on a printed circuit board.