Semiconductor device including a field stop region
A semiconductor device includes: a drift region of a first conductivity type arranged between first and second surfaces of a semiconductor body; a first region of the first conductivity type at the second surface; a second region of a second conductivity type adjacent the first region at the second surface; a field stop region of the first conductivity type between the drift region and second surface; and a first electrode on the second surface directly adjacent to the first region in a first part of the second surface and to the second region in a second part of the second surface. The field stop region includes first and second sub-regions. Over a predominant portion of the first part of the second surface, the second sub-region directly adjoins the first region and includes dopants of the second conductivity type that partially compensate dopants of the first conductivity type.
1 . A semiconductor device, comprising:
a drift region of a first conductivity type arranged between a first surface and a second surface of a semiconductor body;
a first region of the first conductivity type at the second surface;
a second region of a second conductivity type arranged adjacent to the first region at the second surface;
a field stop region of the first conductivity type arranged between the drift region and the second surface;
a first electrode on the second surface, wherein the first electrode is arranged directly adjacent to the first region in a first part of the second surface and to the second region in a second part of the second surface, wherein the field stop region includes a first sub-region and a second sub-region between the first sub-region and the second surface, wherein over a predominant portion of the first part of the second surface, the second sub-region directly adjoins to the first region and includes dopants of the second conductivity type that partially compensate dopants of the first conductivity type; and
an embedded region of the second conductivity type integrated in the second sub-region of the field stop region, wherein the embedded region laterally overlaps both the first region and the second region.
2 . The semiconductor device of claim 1 , wherein the second sub-region of the field stop region directly adjoins to the first region over all of the first part of the second surface.
3 . The semiconductor device of claim 1 , wherein a lateral concentration profile of the dopants of the second conductivity type and/or a lateral concentration profile of the dopants of the first conductivity type is constant in the second sub-region of the field stop region over a predominant portion of the first part of the second surface.
4 . The semiconductor device of claim 1 , wherein the dopants of the second conductivity type partially compensate at least 10% of the dopants of the first conductivity type in at least a portion of the second sub-region of the field stop region.
5 . The semiconductor device of claim 1 , wherein a vertical concentration profile of the dopants of the second conductivity type extends from within the second sub-region of the field stop region to the second surface.
6 . The semiconductor device of claim 5 , wherein a vertical concentration profile of dopants of the second conductivity type along a predominant vertical extent of the second region corresponds to a vertical concentration profile of the dopants of the second conductivity type extending from the second sub-region of the field stop region, through the first region, and to the second surface.
7 . The semiconductor device of claim 1 , wherein a carrier mobility in the second sub-region of the field stop region is by more than 10% smaller than a carrier mobility in the first sub-region of the field stop region.
8 . The semiconductor device of claim 1 , wherein a concentration of the dopants of the second conductivity type in a portion of the second sub-region of the field stop region is larger than 1×10 15 cm −3 .
9 . The semiconductor device of claim 1 , wherein an effective concentration of dopants of the first conductivity type in the portion of the second sub-region of the field stop region ranges between 1×10 14 cm −3 and 2×10 16 cm −3 .
10 . The semiconductor device of claim 1 , wherein a vertical position where the concentration profile of the dopants of the first conductivity type constituting the first region intersects a concentration profile of dopants of the first conductivity type constituting the field stop region defines the vertical extension of the first region to the second surface.
11 . The semiconductor device of claim 10 , wherein the dopants of the second conductivity type include boron, the dopants of the first conductivity type include phosphorus, and the field stop region includes hydrogen-related donors.
12 . The semiconductor device of claim 11 , wherein a pn junction between the second region and the field stop region is located closer to the second surface than a separation plane between the second sub-region of the field stop region and the first region.
13 . The semiconductor device of claim 1 , wherein a separation plane between the second sub-region of the field stop region and the first region is located closer to the second surface than a pn junction between the second region and the field stop region.
14 . The semiconductor device of claim 1 , wherein a concentration profile of the dopants of the second conductivity type in the second sub-region of the field stop region has a peak.
15 . The semiconductor device of claim 1 , wherein a concentration profile of the dopants of the second conductivity type in the second sub-region of the field stop region continuously decreases toward the first surface.
16 . A semiconductor device, comprising:
a drift region of a first conductivity type arranged between a first surface and a second surface of a semiconductor body;
a first region of the first conductivity type at the second surface;
a second region of a second conductivity type arranged adjacent to the first region at the second surface;
a field stop region of the first conductivity type arranged between the drift region and the second surface; and
a first electrode on the second surface,
wherein the first electrode is arranged directly adjacent to the first region in a first part of the second surface and to the second region in a second part of the second surface,
wherein the field stop region includes a first sub-region and a second sub-region between the first sub-region and the second surface,
wherein over a predominant portion of the first part of the second surface, the second sub-region directly adjoins to the first region and comprises an embedded region of a second conductivity type integrated in the second sub-region of the field stop region,
wherein in the embedded region, dopants of the second conductivity type outnumber dopants of the first conductivity type,
wherein the embedded region is electrically connected to the second region,
wherein the embedded region laterally overlaps both the first region and the second region.
17 . A method for manufacturing a semiconductor device, the method comprising:
providing a semiconductor body including a drift region of a first conductivity type arranged between a first surface and a second surface of the semiconductor body;
forming a first region of the first conductivity type at the second surface;
forming a second region of a second conductivity type arranged adjacent to the first region at the second surface;
forming a field stop region of the first conductivity type arranged between the drift region and the second surface; and
forming a first electrode on the second surface,
wherein the first electrode is arranged directly adjacent to the first region in a first part of the second surface and to the second region in a second part of the second surface,
wherein the field stop region includes a first sub-region and a second sub-region between the first sub-region and the second surface,
wherein over a predominant portion of the first part of the second surface, the second sub-region directly adjoins to the first region and includes dopants of the second conductivity type that partially compensate dopants of the first conductivity type,
wherein forming the field stop region comprises integrating an embedded region of the second conductivity type in the second sub-region of the field stop region, the embedded region laterally overlapping both the first region and the second region.
18 . The method of claim 17 , wherein forming the second region includes one unmasked ion implantation process and a second implantation process, and wherein dopants for forming the first region and the dopants of the second conductivity type are implanted through a same mask.
19 . The method of claim 17 , wherein the dopants of the second conductivity type are formed by an unmasked ion implantation process, and wherein dopants for forming the first region are implanted through a mask that differs from a mask used for implanting dopants of the second region.