Stack-PCB architecture with embedded vapor chamber
An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.
1. An interposer comprising:
a laminate structure defining an inner space; and
a heat spreader comprising an active portion and a passive portion, the active portion being located in the inner space,
wherein the active portion of the heat spreader has a thickness that is less than a depth of the inner space, and
wherein the passive portion extends from the active portion to outside an outer boundary of the laminate structure in a first direction and to outside the outer boundary of the laminate structure in a second direction.
2. The interposer of claim 1 , the laminate structure further comprising one or more connection points, each connection points comprising a through chip via.
3. The interposer of claim 2 , further comprising a metal plating over at least each connection point.
4. The interposer of claim 1 , wherein the active portion comprises a isothermal plate.
5. The interposer of claim 1 , wherein the passive portion is thermally coupled to the active portion.
6. The interposer of claim 1 , wherein the passive portion is an extension of the active portion.
7. A tri-layer structure comprising:
a first printed circuit board;
a second printed circuit board;
an interposer positioned between the first printed circuit board and the second printed circuit board and coupled to the first printed circuit board and to the second printed circuit board; and
a heat spreader located in the interposer, the heat spreader comprising an active portion and a passive portion, the active portion being nested within an inner space defined by the interposer,
wherein the passive portion extends from the active portion to outside an outer boundary of the interposer in a first direction toward the first printed circuit board and to outside the outer boundary of the interposer in a second direction toward the second printed circuit board.
8. The tri-layer structure of claim 7 , wherein at least one of the first printed circuit board and second circuit board comprises one or more electronic components thermally coupled to the heat spreader.
9. The tri-layer structure of claim 7 , wherein the active portion comprises an isothermal plate.
10. The tri-layer structure of claim 7 , wherein the interposer further comprises FR4 material.
11. A stack-PCB architecture comprising:
a core frame;
two or more printed circuit boards on a first side of the core frame, the two or more printed circuit boards interconnected by one or more first interposers; and
two or more complementary elements on second side of the core frame, the second side of the core frame being opposite the first side of the core frame, the two or more complementary elements interconnected by one or more second interposers,
wherein at least one of the first interposers or second interposers comprises a heat spreader comprising an active portion and a passive portion, the active portion being nested within an inner space defined by the interposer,
wherein the passive portion extends from the active portion to outside an outer boundary of the at least one of the first interposes or second interposes in a first direction and to outside the outer boundary of the at least one of the first interposes or second interposes in a second direction.
12. The stack-PCB architecture of claim 11 , wherein the core frame further comprises a second heat spreader.
13. The stack-PCB architecture of claim 11 , wherein the active portion comprises an isothermal plate.
14. The stack-PCB architecture of claim 11 , wherein the heat spreader further comprises FR4 material.
15. The stack-PCB architecture of claim 14 , wherein the passive portion is thermally coupled to the active portion and to a heat dissipating structure.