Photodetector with dual doped semiconductor material
The present disclosure relates to semiconductor structures and, more particularly, to a photodetector and methods of manufacture. The structure includes: a photodetector; and a semiconductor material on the photodetector, the semiconductor material comprising a first dopant type, a second dopant type and intrinsic semiconductor material separating the first dopant type from the second dopant type.
1. A structure comprising:
a photodetector; and
a semiconductor material on the photodetector, the semiconductor material comprising a first dopant type contacting a top surface of the photodetector, a second dopant type contacting the top surface of the photodetector and intrinsic semiconductor material contacting the top surface of the photodetector and separating the first dopant type from the second dopant type.
2. The structure of claim 1 , wherein the first dopant type comprises a P+ dopant type and the second dopant type comprises an N+ dopant type.
3. The structure of claim 2 , wherein the intrinsic semiconductor material comprises Si material.
4. The structure of claim 3 , wherein the N+ dopant type and the P+ dopant type comprise polysilicon/silicon material over the photodetector.
5. The structure of claim 3 , wherein the photodetector comprises Ge material.
6. The structure of claim 1 , wherein the semiconductor material directly contacts the top surface of the photodetector.
7. The structure of claim 6 , wherein the semiconductor material comprises epitaxial semiconductor material directly contacting the top surface of the photodetector.
8. The structure of claim 7 , further comprising an insulator material directly under and contacting a bottom surface of the epitaxial semiconductor material.
9. The structure of claim 8 , wherein the photodetector is within a trench of a semiconductor substrate, a collar is on sidewalls of the trench and the insulator material is on the semiconductor substrate and under the semiconductor material on sides of the photodetector.
10. The structure of claim 1 , further comprising an insulator collar abutting sidewalls of the photodetector.
11. The structure of claim 10 , further comprising dopant regions on sides of the insulator collar, which isolates the dopant regions from the photodetector.
12. A structure comprising:
a semiconductor substrate;
an insulator material over the semiconductor substrate;
a photodetector within a trench of the semiconductor substrate;
a semiconductor material of a first dopant type on a first portion of the photodetector and the insulator material;
a semiconductor material of a second dopant type on a second portion of the photodetector and the insulator material; and
an intrinsic semiconductor material contacting a third portion of the photodetector between the semiconductor material of the first dopant type and the semiconductor material of the second dopant type.
13. The structure of claim 12 , wherein the first dopant type comprises P+ dopant type, the second dopant type comprises an N+ dopant type and the intrinsic semiconductor material is between the semiconductor material of the first dopant type and the semiconductor material of the second dopant type.
14. The structure of claim 12 , further comprising an insulator collar lining the trench.
15. The structure of claim 14 , further comprising doped regions within the semiconductor substrate, which are isolated from the photodetector by the insulator collar lining the trench.
16. The structure of claim 12 , wherein the first portion is a first side, the second portion is a second side, and the third portion is between the first side and the second side.
17. The structure of claim 12 , wherein the semiconductor material of the first dopant type and the semiconductor material of the second dopant type extend over and are in direct contact with the insulator material and in direct contact with the photodetector.
18. The structure of claim 12 , wherein the photodetector comprises Ge material and the intrinsic semiconductor material comprises Si material.
19. The structure of claim 18 , wherein the first dopant type, the second dopant type and the intrinsic semiconductor material comprise a PIN diode.
20. A method comprising:
forming a photodetector in a semiconductor substrate; and
forming a semiconductor material on the photodetector, the semiconductor material comprising a first dopant type contacting a top surface of the photodetector, a second dopant type contacting the top surface of the photodetector and intrinsic semiconductor material contacting the top surface of the photodetector and separating the first dopant type from the second dopant type.