Sensor package having a channel integrated within a substrate
A sensor package includes a substrate and a channel within the substrate. The channel is configured to allow flow of a fluid therethrough. The sensor package also includes a sensor disposed on the substrate and a lid. The sensor is configured to sense a property of the fluid. The lid forms at least one cavity between the lid and the substrate.
1. A sensor package, comprising:
a substrate;
a first channel within the substrate, the first channel configured to allow flow of a fluid therethrough;
a second channel within the substrate, the second channel configured to allow flow of the fluid therethrough;
a first sensor disposed on a surface of the substrate, the first sensor configured to sense a property relating to the fluid associated with the first channel;
a first opening extending between the first sensor and the first channel;
a second opening extending between the first channel and the surface;
a second sensor disposed on the substrate, the second sensor configured to sense a property relating to the fluid associated with the second channel; and
a lid covering the first sensor and the second sensor, the lid forming at least one cavity between the lid and the substrate, and the at least one cavity comprises a first cavity between the first sensor and the lid.
2. The sensor package of claim 1 , wherein the first sensor is a first pressure sensor and the second sensor is a second pressure sensor.
3. The sensor package of claim 2 , wherein the first pressure sensor and the second pressure sensor are configured to sense a pressure differential.
4. The sensor package of claim 1 , wherein the substrate comprises a printed circuit board.
5. The sensor package of claim 1 , wherein the first sensor is configured to perform sensing using at least a pressure of the first cavity.
6. The sensor package of claim 1 , further comprising a third opening in the lid allowing fluidic access to the first cavity.
7. The sensor package of claim 6 , further comprising a port coupled to the third opening.
8. The sensor package of claim 1 , wherein the at least one cavity comprises a second cavity between the second opening and the lid.
9. The sensor package of claim 8 , further comprising a port coupled to the second opening.
10. The sensor package of claim 9 , wherein the port extends to a top of the lid.
11. The sensor package of claim 9 , wherein the lid comprises a third channel extending from the second opening to the port.
12. The sensor package of claim 11 , wherein the port extends to a side of the lid.
13. The sensor package of claim 12 , wherein the lid has a top portion and a plurality of side portions forming first and second cavities between the top portion and the substrate.
14. A sensor package, comprising:
a substrate;
a first channel within the substrate, the first channel configured to allow a medium to pass therethrough;
a second channel within the substrate, the second channel configured to allow the medium to pass therethrough;
a first sensor disposed on a surface of the substrate, the first sensor configured to sense a property relating to the medium;
a first opening extending between the first sensor and the first channel;
a second opening extending between the first channel and the surface;
a second sensor disposed on the substrate, the second sensor configured to sense the property relating to the medium; and
a lid covering the first sensor and the second sensor, the lid having at least one wall adhered to the substrate, the lid forming at least one cavity between the lid and the substrate, and the at least one cavity comprises a first cavity between the first sensor and the lid.
15. The sensor package of claim 14 , wherein a bottom edge of the at least one wall is adhered to the substrate.
16. The sensor package of claim 14 , wherein the lid further comprises a top portion extending above the first sensor and the second sensor.
17. The sensor package of claim 16 , wherein the at least one wall comprises a plurality of walls and the top portion extends between the plurality of walls.
18. The sensor package of claim 14 , wherein the medium comprises a fluid or light.
19. The sensor package of claim 14 , wherein the surface of the substrate is a top surface of the substrate, and wherein:
a top of the first channel is below the top surface of the substrate and a bottom of the first channel is above a bottom surface of the substrate; and
a top of the second channel is below the top surface of the substrate and a bottom of the second channel is above the bottom surface of the substrate.