Semiconductor device with passing gate
A semiconductor device with a passing gate is provided. The semiconductor device includes a substrate having a first trench and a first gate structure in the first trench. The first gate structure includes a first gate electrode having a first doped region.
1. A semiconductor device, comprising:
a substrate having a first trench; and
a first gate structure in the first trench, wherein the first gate structure includes a first gate electrode having a first doped region;
wherein the first gate structure further comprises a barrier layer under the first gate electrode;
wherein the first doped region is defined in the first gate electrode and the barrier layer.
2. The semiconductor device of claim 1 , wherein the first gate structure further comprises a first capping layer disposed on the first gate electrode.
3. The semiconductor device of claim 2 , wherein the first capping layer directly contacts the first gate electrode.
4. The semiconductor device of claim 2 , wherein the first doped region is adjacent to the first capping layer.
5. The semiconductor device of claim 1 , wherein the substrate comprises an isolation region and an active region, and the first trench is disposed in the isolation region.
6. The semiconductor device of claim 5 , wherein the active region has a second doped region adjacent to the isolation region, and wherein the first doped region of the first gate structure and the second doped region are of the same polarity type.
7. The semiconductor device of claim 6 , wherein the second doped region comprises a source/drain (S/D) region.
8. The semiconductor device of claim 1 , further comprising a second gate structure in a second trench, wherein the second gate structure includes a second gate electrode and a third gate electrode on the second gate electrode.
9. The semiconductor device of claim 8 , wherein the third gate electrode of the second gate structure has a third doped region.
10. The semiconductor device of claim 9 , wherein the third doped region of the second gate structure and the first doped region of the first gate structure are of the same polarity type.
11. The semiconductor device of claim 9 , wherein the third doped region of the second gate structure and the first doped region of the first gate structure have different dopant concentrations.
12. The semiconductor device of claim 8 , wherein the first gate structure further comprises a first capping layer disposed on the first gate electrode, and the second gate structure further comprises a second capping layer disposed on the third gate electrode.
13. The semiconductor device of claim 12 , wherein a bottom surface of the first capping layer and a bottom surface of the second capping layer are located at different elevations.
14. A semiconductor device, comprising:
a substrate having a source/drain (S/D) region;
a passing gate having a first doped region, wherein the S/D region and the first doped region have the same polarity type; and
a main gate having a second doped region, wherein a distance between a boundary of the first doped region and an upper surface of the substrate is greater than a distance between a boundary of the second doped region and the upper surface, wherein the passing gate further comprises a first capping layer disposed on the first doped region, and the main gate further comprises a second capping layer disposed on the second doped region, wherein a bottom surface of the first capping layer and a bottom surface of the second capping layer are located at different elevations.
15. The semiconductor device of claim 14 , wherein the S/D region is adjacent to an upper surface of the substrate.
16. The semiconductor device of claim 15 , wherein a distance between a boundary of the first doped region and the upper surface is greater than a distance between a boundary of the S/D region and the upper surface.
17. The semiconductor device of claim 14 , wherein the S/D region and the second doped region are of the same polarity type.