IP Library › Granted Patent US 12,346,090
Granted Patent B2
US 12,346,090 · App. 17/861,374 · Granted Jul 1, 2025

Process control device in manufacturing

Inventors: Fatma Arzum Simsek-Ege (Boise, ID); Shruthi Kumara Vadivel (Boise, ID); Deepti Verma (Boise, ID); Anshika Sharma (Boise, ID); Lavanya Sriram (Boise, ID); Trupti D. Gawai (Boise, ID)
Assignee: Micron Technology, Inc.
G05B19/40938G05B19/4187G05B2219/35513
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Quick Facts
Patent No.
US 12,346,090
App. No.
17/861,374
Granted
Jul 1, 2025
Kind
B2
Abstract

Methods, devices, and systems related to process control in manufacturing are described. In an example, a method can include receiving data from a first process control device affixed to a first manufacturing tool of a first type, identifying one or more attributes of the data via a second processing resource of a second process control device affixed to a second manufacturing tool of a second type different from the first type, determining one or more settings for the second manufacturing tool via the second processing resource in response to identifying the one or more attributes of the data, and sending a command including the one or more settings to the second manufacturing tool from the second process control device.

Claims (34)

1. A method, comprising:

receiving, data, including a detected number of particles, at a process control device affixed to a first manufacturing tool in a manufacturing line;

determining a second manufacturing tool is creating an excess number of particles at least partially based on the detected number of particles;

transmitting a command from the process control device at least partially based on the data; and

performing at least one of: preventative maintenance on the second manufacturing tool, stopping an operation at the second manufacturing tool, or bypassing the second manufacturing tool in the manufacturing line in response to receiving the command.

2. The method of claim 1 , further comprising detecting the number of particles via a particle counter.

3. The method of claim 1 , further comprising transmitting the command to clean the second manufacturing tool in response to determining the second manufacturing tool is creating the excess number of particles.

4. The method of claim 1 , further comprising transmitting the command to bypass the second manufacturing tool in response to determining the second manufacturing tool is creating the excess number of particles.

5. The method of claim 1 , further comprising transmitting the command to stop the operation at the second manufacturing tool in response to determining the second manufacturing tool is creating the excess number of particles.

6. The method of claim 1 , further comprising receiving the data from at least one of: acoustic sensor, a pressure sensor, a vibration sensor, a thermal sensor, a humidity sensor, or a chemical sensor.

7. The method of claim 1 , further comprising receiving the data from a sensor integrated into the first manufacturing tool.

8. An apparatus, comprising:

a particle counter configured to detect a number of particles;

a memory; and

a first processing resource affixed to a first manufacturing tool in a manufacturing line and configured to:

receive the detected number of particles;

determine a second manufacturing tool in the manufacturing line is creating an excess number of particles based on the detected number of particles; and

transmit a command to a second processing resource affixed to the second manufacturing tool in response to determining the second manufacturing tool is creating the excess number of particles,

wherein the second processing resource is configured to:

perform at least one of: preventative maintenance on the second manufacturing tool, stop an operation at the second manufacturing tool, or bypass the second manufacturing tool in the manufacturing line in response to receiving the command.

9. The apparatus of claim 8 , wherein the apparatus includes a polymer material.

10. The apparatus of claim 8 , wherein the apparatus includes an adhesive portion.

11. The apparatus of claim 10 , wherein the apparatus adheres to the first manufacturing tool via the adhesive portion.

12. A system, comprising:

a first process control device affixed to a first manufacturing tool, wherein the first process control device is configured to:

receive data, including a detected number of particles, from one or more sensors;

determine a second manufacturing tool is creating an excess number of particles at least partially based on the detected number of particles; and

send a command to a second process control device in response to the received data; and

the second process control device affixed to the second manufacturing tool, wherein the second process control device is configured to:

receive the command from the first process control device; and

stop an operation at the second manufacturing tool in response to receiving the command.

13. The system of claim 12 , wherein the first process control device is a flexible package.

14. The system of claim 12 , wherein the first manufacturing tool is of a first type.

15. The system of claim 14 , wherein the second manufacturing tool is of a second type different from the first type.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2022
From: SIMSEK-EGE, FATMA ARZUM; VADIVEL, SHRUTHI KUMARA; VERMA, DEEPTI; SHARMA, ANSHIKA; SRIRAM, LAVANYA; GAWAI, TRUPTI D.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 060469/0724 →
Continuity (2)
Continuation 16997717 · Aug 19, 2020
Related Publication 20220342386A1 · Oct 27, 2022
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