Memory device interface and method
Memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some configurations, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.
1. A memory system, comprising:
a processor coupled to a first substrate;
a memory device coupled to the first substrate adjacent to the processor, the memory device including:
a buffer device coupled to a second substrate, the buffer device including a host interface, and a DRAM interface wherein the host interface includes at least one memory channel, and wherein the DRAM interface includes at least two sub-channels;
a stack of multiple DRAM dies coupled to the second substrate; and
circuitry in the buffer device, configured to operate the host interface at a first data speed, and to operate the DRAM interface at a second data speed, slower than the first data speed, the circuitry configured to map the at least one memory channel to the at least two sub-channels.
2. The memory system of claim 1 , wherein the stack of multiple DRAM dies includes multiple wire bond interconnections between the DRAM interface of the buffer device and the stack of multiple DRAM dies.
3. The memory system of claim 1 , wherein the stack of multiple DRAM dies includes stair-stepped stacked DRAM dies.
4. The memory system of claim 3 , wherein the stack of multiple DRAM dies includes more than one step direction within a single stack.
5. The memory system of claim 1 , wherein the buffer device is located at least partially underneath the stack of multiple DRAM dies.
6. The memory system of claim 5 , wherein the buffer device is located at least partially underneath a portion of two different stacks of DRAM dies.
7. The memory system of claim 1 , further including solder balls between a backside of the second substrate and the first substrate.
8. The memory system of claim 5 , wherein the at least one memory channel includes both command/address interconnections and data interconnections.
9. A memory device, comprising:
a buffer die coupled to a substrate, the buffer die including a host device interface, and a DRAM interface, wherein the host device interface includes at least one memory channel, and wherein the DRAM interface includes at least two sub-channels;
a stack of DRAM dies supported by the substrate;
multiple through silicon via (TSV) interconnections coupling multiple die in the stack of DRAM dies with the buffer die; and
circuitry in the buffer die, configured to operate the host interface at a first data speed, and to operate the DRAM interface at a second data speed, slower than the first data speed, the circuitry configured to map the at least one memory channel to the at least two sub-channels.
10. The memory device of claim 9 , wherein two or more dies in the stack of DRAM dies are vertically aligned.
11. The memory device of claim 9 , wherein the stack of DRAM dies is vertically aligned.
12. The memory device of claim 9 , wherein the buffer die is located at least partially underneath the stack of DRAM dies.
13. The memory device of claim 9 , wherein the buffer die is located at least partially underneath a portion of two different stacks of DRAM dies.
14. The memory device of claim 9 , wherein the at least one memory channel includes both command/address interconnections and data interconnections.
15. A memory system, comprising:
a processor coupled to a first substrate;
a memory device coupled to the first substrate adjacent to the processor, the memory device including:
a buffer die coupled to a second substrate, the buffer die including a host device interface, and a DRAM interface, wherein the host device interface includes at least one memory channel, and wherein the DRAM interface includes at least two sub-channels;
a stack of DRAM dies supported by the second substrate;
multiple through silicon via (TSV) interconnections coupling multiple die in the stack of DRAM dies with the buffer die; and
circuitry in the buffer die, configured to operate the host interface at a first data speed, and to operate the DRAM interface at a second data speed, slower than the first data speed, the circuitry configured to map the at least one memory channel to the at least two sub-channels.
16. The memory system of claim 15 , wherein two or more dies in the stack of DRAM dies are vertically aligned.
17. The memory system of claim 15 , wherein the stack of DRAM dies is vertically aligned.
18. The memory system of claim 15 , wherein the at least one memory channel includes both command/address interconnections and data interconnections.
19. The memory system of claim 15 , wherein at least some sub-channels of the DRAM interface are in communication with only a single DRAM die.
20. The memory system of claim 15 , wherein at least some sub-channels of the DRAM interface are in communication more than one DRAM die of the stack of DRAM dies.