IP Library Granted Patent US 12,117,253
Granted Patent B2
US 12,117,253 · App. 17/861,830 · Granted Oct 15, 2024

High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture

Inventors: Jesse W. Edwards (Wake Forest, NC); Abhishek Yadav (Cary, NC); Simbarashe Nyika (Durham, NC); Devon Newman (Salt Lake City, UT)
Assignee: Phononic, Inc.
F28F9/16F28F9/0246F28F2260/02
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Quick Facts
Patent No.
US 12,117,253
App. No.
17/861,830
Granted
Oct 15, 2024
Kind
B2
Abstract

Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

Claims (15)

1. A method of manufacturing a micro-channel array comprising:

providing a plurality of micro-channels having a first end and a second end;

providing external manifolding for fluid connectivity between the plurality of micro-channels; and

machining and/or stamping an end cap of the external manifolding with molded stand-off spacers sized to contain internal pressures and allow for working fluid transfer between parallel channels;

where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels.

2. The method of claim 1 wherein the external manifolding comprises a small diameter tube with holes spaced/sized to match microchannel dimensions, for fluid connectivity between the plurality of micro-channels.

3. The method of claim 2 further comprising:

brazing the external manifolding to a micro-channel extrusion, for fluid connectivity between the plurality of micro-channels.

4. The method of claim 1 wherein the external manifolding comprises no stress concentration features.

5. The method of claim 1 further comprising:

providing internal manifolding for fluid connectivity between the plurality of micro-channels.

6. The method of claim 5 further comprising:

cutting a slot into base webbing between interior channels of the internal manifolding, leaving an outer most channel wall on each end undisturbed for sealing.

7. The method of claim 6 further comprising:

one or more of: compressing; cold welding; and brazing the internal manifolding to seal the micro-channel array.

Assignments (3)
SECURITY INTEREST Recorded Mar 9, 2026
From: PHONONIC, INC.
To: DOUBLE HELIX PTE LTD, AS AGENT
Reel/Frame 075068/0485 →
SECURITY INTEREST Recorded Feb 6, 2026
From: PHONONIC, INC.
To: TOP CORNER CAPITAL II LP
Reel/Frame 074811/0453 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2024
From: EDWARDS, JESSE W.; YADAV, ABHISHEK; NYIKA, SIMBARASHE; NEWMAN, DEVON
To: PHONONIC, INC.
Reel/Frame 067999/0577 →
Continuity (2)
Provisional Application 63220368 · Jul 9, 2021
Related Publication 20230008028A1 · Jan 12, 2023