Fingerprint sensor package and smart card including the same
Provided is a fingerprint sensor package including a first substrate including first bonding pads and an external connection pad, a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, second bonding pads, and test pads, conductive wires electrically connecting the first bonding pads and the second bonding pads, a controller chip connected to the second substrate, and a molding layer covering the controller chip and the second substrate and in contact with the first bonding pads, the second bonding pads, the test pads, and the conductive wires.
1 . A fingerprint sensor package comprising:
a first substrate including first bonding pads and at least one external connection pad;
a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, second bonding pads, and test pads;
conductive wires electrically connecting the first bonding pads and the second bonding pads;
a controller chip connected to the second substrate; and
a molding layer covering the controller chip, the first bonding pads, the second bonding pads, the test pads, and the conductive wires,
wherein at least one of the test pads is disposed between the second bonding pads and the controller chip.
2 . The fingerprint sensor package of claim 1 , wherein the second substrate comprises:
a sensing region including the plurality of first sensing patterns and the plurality of second sensing patterns; and
a peripheral region surrounding the sensing region in a plan view, the peripheral region including the test pads.
3 . The fingerprint sensor package of claim 1 , wherein the second substrate comprises:
a sensing region including the plurality of first sensing patterns and the plurality of second sensing patterns; and
a peripheral region surrounding the sensing region in a plan view, the peripheral region including at least one of the test pads.
4 . The fingerprint sensor package of claim 3 , wherein at least a portion of each of the second bonding pads is in the sensing region.
5 . The fingerprint sensor package of claim 1 , wherein
the second bonding pads are parallel to a first edge of the second substrate,
the test pads are parallel to the first edge of the second substrate, and
wherein the test pads comprise outer test pads between the second bonding pads and the first edge of the second substrate and inner test pads between the second bonding pads and the controller chip in a plan view.
6 . The fingerprint sensor package of claim 1 , wherein
the test pads include a first plurality of test pads that are parallel and adjacent to a first edge of the second substrate, and a second plurality of test pads that are parallel and adjacent to a second edge of the second substrate.
7 . The fingerprint sensor package of claim 1 , wherein
a horizontal width of each of the test pads has a range between about 200 μm and about 300 μm, and
the horizontal width of each of the test pads is greater than a horizontal width of each of the second bonding pads.
8 . The fingerprint sensor package of claim 1 , wherein
the first substrate further comprises a core insulating layer comprising a first surface and a second surface opposite to each other,
the first bonding pads, the at least one external connection pad, and the second substrate are on the second surface of the core insulating layer,
the at least one external connection pad is between an edge of the second surface of the core insulating layer and the first bonding pads, and
the molding layer extends laterally along the second surface of the core insulating layer from a side surface of the second substrate to a boundary between the first bonding pads and the at least one external connection pad.
9 . The fingerprint sensor package of claim 8 , wherein the second substrate further comprises:
a sensing region including the plurality of first sensing patterns and the plurality of second sensing patterns; and
a peripheral region surrounding the sensing region in a plan view,
wherein the first substrate further comprises:
a coating layer on the first surface of the core insulating layer and overlapping the sensing region of the second substrate in a third direction perpendicular to the first direction and the second direction;
a ground bezel on the first surface of the core insulating layer and surrounding the coating layer in the plan view; and
an adhesive layer between the ground bezel and the core insulating layer and between the coating layer and the core insulating layer.
10 . The fingerprint sensor package of claim 1 , wherein at least one of the test pads is electrically connected to at least one of the second bonding pads through a conductive connection pattern.
11 . The fingerprint sensor package of claim 1 , further comprising:
an inner molding layer between the molding layer and the controller chip,
wherein the inner molding layer is spaced apart from the test pads.
12 . The fingerprint sensor package of claim 1 , further comprising:
an inner molding layer provided between the molding layer and the controller chip,
wherein the inner molding layer comprises first openings exposing the second bonding pads and second openings exposing the test pads.
13 . The fingerprint sensor package of claim 1 , further comprising:
a substrate adhesive layer between an upper surface of the second substrate and the first substrate,
wherein the controller chip is on a lower surface of the second substrate.
14 . The fingerprint sensor package of claim 1 , wherein the plurality of first sensing patterns are spaced apart from the plurality of second sensing patterns in a third direction perpendicular to the first direction and the second direction.
15 . The fingerprint sensor package of claim 1 , wherein the plurality of first sensing patterns are disposed on the plurality of second sensing patterns or disposed below the plurality of second sensing patterns.
16 . A fingerprint sensor package comprising:
a first substrate including a first bonding pad;
a second substrate disposed on the first substrate, and including a plurality of first sensing patterns, a plurality of second sensing patterns, a second bonding pad, and a test pad;
a controller chip disposed on the second substrate;
a wire connected to the first bonding pad and the second bonding pad; and
a molding layer covering the controller chip,
wherein the plurality of second sensing patterns are disposed on the plurality of first sensing patterns and are spaced apart from the plurality of first sensing patterns,
the plurality of first sensing patterns are spaced apart from each other in a first direction, and extend in a second direction that is different from the first direction,
the plurality of second sensing patterns are spaced apart from each other in the second direction, and extend in the first direction, and
the test pad is disposed between the second bonding pad and the controller chip.
17 . The fingerprint sensor package of claim 16 , wherein the plurality of first sensing patterns include a first pattern, and the plurality of second sensing patterns include a second pattern, and
the first pattern and the second pattern define a first capacitor, the first pattern being a first electrode of the first capacitor, the second pattern being a second electrode of the first capacitor.
18 . The fingerprint sensor package of claim 17 , further comprising:
a first sensing pad connected to the first pattern; and
a second sensing pad connected to the second pattern, a distance between the second sensing pad and the first substrate being greater than a distance between the first sensing pad and the first substrate.
19 . A fingerprint sensor package comprising:
a first substrate including a first bonding pad;
a second substrate disposed on the first substrate, and including a plurality of first sensing patterns, a plurality of second sensing patterns, a second bonding pad, and a test pad;
a controller chip disposed on the second substrate; and
a wire connected to the first bonding pad and the second bonding pad,
wherein the plurality of second sensing patterns are disposed on the plurality of first sensing patterns and are spaced apart from the plurality of first sensing patterns,
the plurality of first sensing patterns are spaced apart from each other in a first direction, and extend in a second direction that is different from the first direction,
the plurality of second sensing patterns are spaced apart from each other in the second direction, and extend in the first direction,
the plurality of first sensing patterns include a first pattern, and the plurality of second sensing patterns include a second pattern,
the first pattern and the second pattern define a first capacitor, the first pattern being a first electrode of the first capacitor, the second pattern being a second electrode of the first capacitor, and
the test pad is disposed between the second bonding pad and the controller chip.
20 . The fingerprint sensor package of claim 19 , wherein the first capacitor constitutes a fingerprint sensor.