Intelligent dispensing adjustment system and method thereof
One embodiment of the present invention discloses an intelligent dispensing adjustment system and the method thereof. The system can dynamically detect the fluid dispensing amount of a fluid dispensing unit via a calculating unit having an intelligent dispensing mechanism and keeps monitoring the dispensing situation of the fluid material so as to automatically adjust the fluid dispensing amount of the fluid dispensing unit. The system can adjust the fluid dispensing amount of the fluid dispensing unit by obtaining the information of the state of previously dispensing the fluid material via a closed loop, which can solve the problems, of prior art, that the defects of products may be incurred because the state of the fluid material is hard to control (e.g., the fluid material is insufficient or overflows).
1. An intelligent dispensing adjustment system, comprising:
a fluid dispensing unit configured to fill a target area with a fluid material to execute a N th dispensing step, wherein N is a constant;
an optical measuring unit configured to dynamically image the fluid material in the target area and generate a N th 3-dimension fluid signal; and
a calculating unit electrically connected to the fluid dispensing unit and the optical measuring unit, and configured to receive the N th 3-dimension fluid signal to obtain a state of the fluid material, wherein the calculating unit compares the state of the fluid material with a predetermined fluid state value and transmits a N th fluid amount adjustment signal to the fluid dispensing unit, whereby the fluid dispensing unit adjusts a fluid dispensing amount thereof according to the N th fluid amount adjustment signal.
2. The intelligent dispensing adjustment system of claim 1 , wherein the target area is a fluid input end of a gap between a chip and a substrate.
3. The intelligent dispensing adjustment system of claim 2 , wherein the state of the fluid material includes a fluid volume, a fluid weight, a height of the fluid material in the gap, a width of the fluid material in the gap, or a ratio of a space, filled with the fluid material, of the gap to a total space of the gap.
4. The intelligent dispensing adjustment system of claim 1 , wherein the target area is a groove.
5. The intelligent dispensing adjustment system of claim 4 , wherein the state of the fluid material includes a fluid volume, a fluid weight, a height of the fluid material in the groove, a width of the fluid material in the groove, or a ratio of a space, filled with the fluid material, of the groove to a total space of the groove.
6. The intelligent dispensing adjustment system of claim 1 , wherein the fluid dispensing unit is a glue dispensing unit, the fluid material is a glue, the optical measuring unit is, a confocal laser scanning microscopy, a combination of a femtosecond laser and a confocal microscopy, a confocal laser, a 3-dimension measuring device, an ultrasonic measuring device, or a laser triangulation measuring device.
7. The intelligent dispensing adjustment system of claim 1 , wherein the optical measuring unit includes at least one visual module, and the visual module is a CCD (charge-coupled device) camera, a CCD image sensor, a CMOS (complementary metal-oxide-semiconductor) image sensor, a CMOS camera, an optical microscopy, a scanning electron microscopy or a transmission electron microscopy.
8. An intelligent dispensing adjustment method, comprising:
a N th dispensing step, wherein a fluid dispensing unit fills a N th fluid input end between a chip and a substrate with a fluid material, whereby the fluid material diffuses toward a fluid diffusing end between the chip and the substrate so as to fill the gap between the chip and the substrate with the fluid material, wherein N is a constant;
a N th detecting step, wherein an optical measuring unit dynamically images the fluid material in the gap between the chip and the substrate, and transmits a N th 3-dimension fluid signal to a calculating unit;
a N th adjusting step, wherein the calculating unit controls a fluid dispensing amount of the fluid dispensing unit according to the N th 3-dimension fluid signal; and
a N+1 th dispensing step, wherein the fluid dispensing unit, adjusted by the calculating unit, fills a N+1 th fluid input end between the chip and the substrate with the fluid material.
9. The intelligent dispensing adjustment method of claim 8 , after the N+1 dispensing step, further comprising:
a N+1 th detecting step, wherein the optical measuring unit dynamically images the fluid material in the gap between the chip and the substrate, and transmits a N+1 th 3-dimension fluid signal to the calculating unit;
a N+1 th adjusting step, wherein the calculating unit controls the fluid dispensing amount of the fluid dispensing unit according to the N+1 th 3-dimension fluid signal; and
a N+2 th dispensing step, wherein the fluid dispensing unit, adjusted by the calculating unit, fills a N+2 th fluid input end between the chip and the substrate with the fluid material.
10. An intelligent dispensing adjustment method, comprising:
a N th dispensing step, wherein a fluid dispensing unit fills a groove with a fluid material in order to perform a caulking for the groove, wherein N is a constant;
a N th detecting step, wherein an optical measuring unit dynamically images the fluid material in the groove, and transmits a N th 3-dimension fluid signal to a calculating unit; and
a N th adjusting step, wherein the calculating unit controls a fluid dispensing amount of the fluid dispensing unit according to the N th 3-dimension fluid signal.
11. The method of claim 10 wherein the N th adjusting step includes transmitting an expansion signal to the fluid dispensing unit when the N th 3-dimension fluid signal indicates that an insufficient glue state occurs so as to increase the glue dispensing amount of the fluid dispensing unit.
12. The method of claim 10 wherein the N th adjusting step includes transmitting a retraction signal to the fluid dispensing unit 1 when the 3-dimension fluid signal indicates that a glue overflowing state occurs so as to decrease the glue dispensing amount of the fluid dispensing unit.
13. The method of claim 10 wherein the fluid dispensing unit used in the N th dispensing step is a glue dispensing unit and the fluid material is a glue, and the optical measuring unit used in the N th detecting step is a confocal laser scanning microscopy device.
14. The intelligent dispensing adjustment system of claim 1 wherein the optical measuring unit is disposed at a side close to a fluid diffusing end of a gap between a chip and a substrate and can move to the position corresponding to the fluid diffusing end so as to perform dynamical detection.
15. The intelligent dispensing adjustment system of claim 1 , wherein the fluid dispensing unit is a glue dispensing unit, the fluid material is a glue, and the optical measuring unit is a confocal laser scanning microscopy device.
16. The intelligent dispensing adjustment system of claim 7 wherein the optical measuring unit includes an upper visual module and a lateral visual module.
17. The intelligent dispensing adjustment system of claim 16 wherein the upper visual module is configured to capture a top image of the fluid material, the lateral visual module is configured to capture a lateral image of the fluid material, and the calculating unit is configured to obtain the N th 3-dimension fluid signal according to the top image and the lateral image.
18. The method of claim 8 wherein the fluid dispensing unit used in the N th dispensing step is a glue dispensing unit and the fluid material is a glue, and the optical measuring unit used in the N th detecting step is a confocal laser scanning microscopy device.
19. The method of claim 8 wherein the N th adjusting step includes transmitting an expansion signal to the fluid dispensing unit when the N th 3-dimension fluid signal indicates that an insufficient glue state occurs so as to increase the glue dispensing amount of the fluid dispensing unit.
20. The method of claim 8 wherein the N th adjusting step includes transmitting a retraction signal to the fluid dispensing unit 1 when the 3-dimension fluid signal indicates that a glue overflowing state occurs so as to decrease the glue dispensing amount of the fluid dispensing unit.