Hybrid heat spreading and heating of a computing system in an autonomous vehicle
Examples of the present disclosure provide an apparatus for hybrid heat spreading and heating, comprising: a heating element and a heat exchanger proximate to the heating element, wherein the apparatus is configured to be thermally coupled to an IC device that is configured to operate above a minimum operating temperature. The heating element is configured to: power on when the ambient temperature is below the minimum operating temperature and the IC device is not powered on and power off after the IC device is powered on. The heat exchanger is configured to conduct heat from the heating element to the IC device when the heater is powered on, such that the IC device is heated to a temperature above the minimum operating temperature and conduct heat away from the IC device when the IC device is powered on.
1. An apparatus, comprising:
a heating element; and
a heat exchanger proximate to the heating element,
wherein:
the apparatus is configured to be thermally coupled to an integrated circuit (IC) device,
the IC device is configured to operate above a minimum operating temperature,
the heating element is configured to:
power on when a temperature of the IC device is below the minimum operating temperature, and
power off when the temperature of the IC device is above the minimum operating temperature, and
the heat exchanger is configured to:
conduct heat from the heating element to the IC device when the heating element is powered on, such that the temperature of the IC device is increased, and
conduct heat away from the IC device when the IC device is powered on, such that the temperature of the IC device is maintained or decreased.
2. The apparatus of claim 1 , further comprising a comparator coupled to the apparatus, wherein the comparator is configured to:
receive signals indicative of the temperature of the IC device from a temperature sensor,
determine whether the temperature is below the minimum operating temperature, and
power on the heating element based on a determination that the temperature is below the minimum operating temperature.
3. The apparatus of claim 1 , wherein the heating element comprises at least one of: a flexible heater, a cartridge heater, and a coil heater.
4. The apparatus of claim 1 , wherein the heat exchanger comprises at least one of: heat pipes, vapor chamber, and thermally conductive metal.
5. The apparatus of claim 1 , wherein:
the IC device is configured to operate between the minimum operating temperature and a maximum operating temperature, and
the apparatus is configured to maintain the temperature of the IC device between the minimum operating temperature and the maximum operating temperature.
6. The apparatus of claim 5 , wherein the heat exchanger is configured to conduct heat away from the IC device when at least two of the following are true: (1) the heating element is powered off, (2) the IC device is powered on, and (3) the IC device is generating heat.
7. The apparatus of claim 1 , further comprising a power source conductively coupled to the heating element.
8. The apparatus of claim 7 , wherein:
the power source comprises a battery of a vehicle, and
the battery is configured to provide power to other components inside the vehicle.